Foundries News

• SMIC Raises Second Quarter 2012 Revenue and Gross Margin Guidance (Tuesday Jul. 24, 2012)
  SMIC is pleased to announce today an upward revision of its second quarter revenue and gross margin guidance for the three months ended June 30, 2012, which was originally released by SMIC in its results for the three months ended March 31, 2012 on May 10, 2012.
  
  
• TSMC Reports Second Quarter EPS of NT$1.61 (Thursday Jul. 19, 2012)
  TSMC today announced consolidated revenue of NT$128.06 billion, net income of NT$41.81 billion, and diluted earnings per share of NT$1.61 (US$0.27 per ADR unit) for the second quarter ended June 30, 2012.
  
  
• TSMC June 2012 Sales Report (Wednesday Jul. 11, 2012)
  TSMC today announced its net sales for June 2012: On an unconsolidated basis, net sales were approximately NT$42.87 billion, a decrease of 1.7 percent from May 2012 and an increase of 20.2 percent over June 2011.
  
  
• UMC Reports Sales for June 2012 (Monday Jul. 09, 2012)
  UMC today reported unaudited net sales for the month of June 2012
  
  
• UMC Aligns With IBM on 20nm Process with FinFET 3D Transistors (Friday Jun. 29, 2012)
  UMC today announced that it has licensed IBM technology to expedite the development of the foundry's next generation 20nm CMOS process with FinFET 3D transistors. Under the terms of the agreement, IBM will license its 20nm process design kit and FinFET technology to UMC so the foundry can use these technologies in order to accelerate the availability of these processes for UMC customers.
  
  
• SMIC and Synopsys Extend 40nm Low Power Capabilities with Reference Flow 5.0 (Tuesday Jun. 26, 2012)
  Synopsys and SMIC today announced availability of version 5.0 of their 40-nanometer (nm) RTL-to-GDSII reference design flow.
  
  
• Radiation Hardened SRAM Designed by RedCat Devices and Fabricated in TowerJazz's 0.18um Process Flow Withstands 15 Mrad Total Ionization Dose (Monday Jun. 25, 2012)
  RedCat Devices and TowerJazz announced today a breakthrough achievement in the design and fabrication of radiation hard ICs. As a part of the Program focused on the development of the radiation hard components, the companies for the first time report the results of testing RedCat’s 512 kbit SRAM (RC7C512RHH). The part has been designed by RedCat using its rad-hard standard cell library and IPs with the support of TowerJazz’s Design Center in Netania, Israel, and fabricated in TowerJazz’s Fab 2 in Migdal Haemek, Israel utilizing a flavor of its commercial 0.18-micron CMOS process flow.
  
  
• Analog Devices and TSMC Collaborate on New Analog Process Technology Platform (Thursday Jun. 21, 2012)
  Analog Devices and TSMC today announced a collaboratively developed analog process technology platform for precision analog integrated circuits (ICs). The new process technology platform significantly improves analog performance for a number of devices, including A/D and D/A converters, power management devices, and audio coders/decoders that are widely used in consumer, communication, computer, industrial, and automotive applications.
  
  
• SMIC and Brite Semiconductor's 40LL Dual-core ARM Cortex-A9 Processor-based Test Chip Achieves 1.3GHz (Wednesday Jun. 20, 2012)
  SMIC and Brite Semiconductor (Shanghai) Corporation today jointly announced that their dual-core ARM® Cortex™-A9 MPCore™ processor-based chip, adopting SMIC's 40nm LL (low-leakage) process technology, has achieved a clock rate of 1.3GHz in silicon tests.
  
  
• Dresden fab could host 20-nm process, 450-mm wafers (Tuesday Jun. 19, 2012)
  Fab 1, the 300-mm operation of GlobalFoundries Inc. here, could be used for 20-nm process technology and for processing 450-mm wafers, according to, Rutger Wijburg, vice president and Fab 1 general manager.
  
  
• TSMC May 2012 Sales Report (Friday Jun. 08, 2012)
  TSMC today announced its net sales for May 2012: On an unconsolidated basis, net sales were approximately NT$43.62 billion, an increase of 9 percent over April 2012 and an increase of 21.3 percent over May 2011.
  
  
• UMC Reports Sales for May 2012 (Friday Jun. 08, 2012)
  UMC TODAY reported unaudited net sales for the month of May 2012.
  
  
• GLOBALFOUNDRIES Silicon Validates 28nm AMS Production Design; Reveals Digital and AMS Support for Double Patterning at 20nm (Friday Jun. 01, 2012)
  GLOBALFOUNDRIES plans to demonstrate an enhanced silicon-validated design flow for its 28nm Super Low Power (SLP) technology with Gate First High-k Metal Gate (HKMG). In addition, the company will reveal jointly developed design flows with its EDA partners in certifying both analog and digital "double patterning aware" flows for its 20nm process, with silicon validation expected in early 2013 at that technology node.
  
  
• SMIC and Beijing Government Sign Cooperation Framework Document to Launch SMIC Beijing Second Phase Expansion Project (Tuesday May. 15, 2012)
  SMIC today announced the signing of a cooperation framework document between its subsidiary SMIC Beijing and the Beijing municipal government, which will lead to the establishment of a joint venture to launch SMIC Beijing's Second Phase Expansion Project.
  
  
• TSMC April 2012 Sales Report (Friday May. 11, 2012)
  TSMC today announced its net sales for April 2012: On an unconsolidated basis, net sales were approximately NT$40.01 billion, an increase of 9.3 percent over March 2012 and an increase of 10.4 percent over April 2011.
  
  
• SMIC Reports 2012 First Quarter Results (Thursday May. 10, 2012)
  SMIC today announced its consolidated results of operations for the three months ended March 31, 2012. Revenue up by 14.9% to $332.7 million in 1Q12 from $289.6 million in 4Q11 and down by 10.2% compared to 1Q11.
  
  
• UMC Reports Sales for April 2012 (Wednesday May. 09, 2012)
  
  
  
• TSMC's 28nm Based ARM Cortex-A9 Test Chip Reaches Beyond 3GHz (Thursday May. 03, 2012)
  TSMC today announced its 28nm high performance ARM® Cortex(TM)-A9 dual-core processor test chip achieved 3.1GHz performance under typical conditions
  
  
• TSMC Reports First Quarter EPS of NT$1.29 (Thursday Apr. 26, 2012)
  TSMC today announced consolidated revenue of NT$105.51 billion, net income of NT$33.47 billion, and diluted earnings per share of NT$1.29 (US$0.22 per ADR unit) for the first quarter ended March 31, 2012.
  
  
• GLOBALFOUNDRIES Fab 8 Adds Tools To Enable 3D Chip Stacking at 20nm and Beyond (Thursday Apr. 26, 2012)
  GLOBALFOUNDRIES today announced a significant milestone on the road to enabling 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, NY, the company has begun installation of a special set of production tools to create Through-Silicon Vias (TSVs) in semiconductor wafers processed on the company’s leading-edge 20nm technology platform.
  
  
• TSMC March 2012 Sales Report (Tuesday Apr. 10, 2012)
  TSMC today announced its net sales for March 2012: On an unconsolidated basis, net sales were approximately NT$36.61 billion, an increase of 9 percent over February 2012 and an increase of 0.7 percent over March 2011.
  
  
• SMIC Raises First Quarter 2012 Revenue and Gross Margin Guidance (Tuesday Apr. 10, 2012)
  SMIC is pleased to announce today an upward revision of its first quarter revenue and gross margin guidance for the three months ended March 31, 2012, which was originally released by SMIC in its results for the three months ended December 31, 2011 on February 8, 2012
  
  
• TSMC Begins Further Expansion of Fab 14 (Monday Apr. 09, 2012)
  TSMC today held a groundbreaking ceremony at the South Taiwan Science Park in Tainan for Phase 5 of its Fab 14 GigaFab. Following TSMC's Fab 12 Phase 6 in Hsinchu, this facility will be another key production center for TSMC’s advanced 20nm technology, providing TSMC with abundant leading-edge capacity.
  
  
• UMC Reports Sales for March 2012 (Monday Apr. 09, 2012)
  UMC today reported unaudited net sales for the month of March 2012.
  
  
• TowerJazz and UCSD Demonstrate First Silicon Wafer-Scale 110 GHz Phased Array Transmitter with Record Performance (Thursday Mar. 29, 2012)
  TowerJazz and The University of California, San Diego (UCSD) today announced they have collaborated to demonstrate the first wafer-scale phased array with 16 different antenna elements operating at 110 GHz frequency range.
  
  
• GLOBALFOUNDRIES Dresden Fab Ships 250,000th 32nm HKMG Wafer (Thursday Mar. 22, 2012)
  GLOBALFOUNDRIES today announced that its Fab 1 in Dresden, Germany has shipped a quarter of a million semiconductor wafers based on 32nm High-k Metal Gate (HKMG) technology.
  
  
• X-FAB Extends High-Temperature Capability to 0.18 Micrometer Platform for Unique Combination of High Voltage, High Temperature and NVM Features (Tuesday Mar. 20, 2012)
  X-FAB Silicon Foundries today announced XH018 HT – a new module that adds high-temperature capability to its XH018 technology family. It offers the industry’s first and only 0.18 micrometer platform with high temperature (HT), high voltage (HV) and non-volatile memory (NVM) capability.
  
  
• Globalfoundries expects sales to AMD to increase (Thursday Mar. 15, 2012)
  Despite an amended wafer supply agreement that gives Advanced Micro Devices Inc. (AMD) the right to use other foundries to make its 28-nm accelerated processing units (APUs), Globalfoundries Inc. expects AMD to increase its business with the firm in 2012.
  
  
• SilTerra launches 130nm CMOS Logic Aluminum Backend Technology (Thursday Mar. 15, 2012)
  Malaysian-based wafer foundry SilTerra Malaysia today announced the release of 130nm CMOS Logic Technology with aluminum backend interconnection, CL130AL. This technology is targeting main stream, high volume consumer electronics applications such as Touch Controller, Flash Memory Card Controller, USB Pen-Drive controller, Card Reader, Host MP3 and others.
  
  
• SMIC and Brite Semiconductor's 40LL Dual-core ARM Cortex-A9 Processor-based Test Chip Achieves 1.3GHz (Saturday Jun. 20, 1998)
  SMIC and Brite Semiconductor (Shanghai) Corporation today jointly announced that their dual-core ARM® Cortex™-A9 MPCore™ processor-based chip, adopting SMIC's 40nm LL (low-leakage) process technology, has achieved a clock rate of 1.3GHz in silicon tests.