Foundries News

• SMIC, Brite, and Zhejiang University Found Joint IC Research Program (Wednesday Mar. 14, 2012)
  The IC research program will provide a world-class environment for research projects between the three parties. It will serve as a platform for cooperation, strengthening technology development and academic exchange while aligning with the university's educational tradition of "combining theory and practice."
  
  
• Soitec announces adoption of fully depleted technology for advanced mobile platforms (Tuesday Mar. 13, 2012)
  Soitec announced today that ST-Ericsson has selected planar fully depleted silicon on insulator (FD-SOI) technology for use in future mobile platforms.
  
  
• TSMC February 2012 Sales Report (Friday Mar. 09, 2012)
  TSMC today announced its net sales for February 2012: On an unconsolidated basis, net sales were approximately NT$33.58 billion, a decrease of 1.4 percent over January 2012 and an increase of 5.8 percent over February 2011.
  
  
• UMC Reports Sales for February 2012 (Thursday Mar. 08, 2012)
  UMC today reported unaudited net sales for the month of February 2012
  
  
• AMD Amends Wafer Supply Agreement With GLOBALFOUNDRIES (Monday Mar. 05, 2012)
  AMD today announced that it entered into an amendment to its Wafer Supply Agreement (WSA) with GLOBALFOUNDRIES Inc. In this amendment, AMD and GLOBALFOUNDRIES agreed to a negotiated wafer price mechanism for 2012. AMD also agreed to transfer its remaining ownership interest in GLOBALFOUNDRIES to GLOBALFOUNDRIES and, as a result, AMD will no longer hold an equity stake in GLOBALFOUNDRIES.
  
  
• TSMC Board of Directors Resolution (Friday Mar. 02, 2012)
  The TSMC Board of Directors today held a special meeting and approved the appointment of Senior Vice President of R&D Dr. Shang-yi Chiang, Senior Vice President of Operations Dr. Mark Liu, and Senior Vice President of Business Development Dr. C.C. Wei as Executive Vice Presidents and Co-Chief Operating Officers of TSMC.
  
  
• SMIC and Brite Semiconductor Tape Out Low Leakage 40nm Test Chip Based on a Dual-Core ARM Cortex-A9 Processor (Monday Feb. 27, 2012)
  Brite Semiconductor, SMIC and ARM today jointly announced the first tape out of a dual-core ARM® Cortex™-A9 MPCore™ test chip using SMIC's 40nm low leakage process technology.
  
  
• Samsung positions its fab to take on TSMC (Wednesday Feb. 22, 2012)
  Samsung touted its new 32-nm high-k metal gate (HKMG) process at the International Solid-State Circuits Conference here Tuesday (Feb. 21), showing features it hopes might win customers over from a supply constrained TSMC.
  
  
• Japanese Ministry of Economy, Trade and Industry has Approved Grants to TowerJazz for its Cap-Ex Investment Plan (Monday Feb. 13, 2012)
  TowerJazz today announced that TowerJazz Japan, Ltd. (TJP) has been selected to receive a cap-ex subsidy from the Japanese Ministry of Economy, Trade and Industry (METI).
  
  
• TSMC January 2012 Sales Report (Friday Feb. 10, 2012)
  TSMC today announced its net sales for January 2012: On an unconsolidated basis, net sales were approximately NT$34.05 billion, an increase of 11.4 percent over December 2011 and a decrease of 1.1 percent over January 2011.
  
  
• Analyst: UMC 28-nm roll out beating expectations (Friday Feb. 10, 2012)
  UMC. is sampling a customer with a 28-nm application processor amid indications that the roll out of the leading-edge process technology is going better than expected.
  
  
• SMIC Reports Results for the Three Months Ended December 31, 2011 (Thursday Feb. 09, 2012)
  SMIC Reports Results for the Three Months Ended December 31, 2011. Revenue down by 5.6% to $289.6 million in 4Q11 from $306.9 million in 3Q11 and down by 29.1% compared to 4Q10.
  
  
• UMC to boost 2012 capex to $2 billion (Thursday Feb. 09, 2012)
  UMC said Wednesday (Feb. 8) it plans to spend about $2 billion on capital expenditures in 2012, up 25 percent from the roughly $1.6 billion it spent on capital expenditures in 2011.
  
  
• UMC Reports Sales for January 2012 (Thursday Feb. 09, 2012)
  UMC today reported unaudited net sales for the month of January 2012.
  
  
• TSMC Reports Fourth Quarter EPS of NT$1.22 (Wednesday Jan. 18, 2012)
  TSMC today announced consolidated revenue of NT$104.71 billion, net income of NT$31.58 billion, and diluted earnings per share of NT$1.22 (US$0.20 per ADR unit) for the fourth quarter ended December 31, 2011. Year-over-year, fourth quarter revenue decreased 4.9% while both net income and diluted EPS decreased 22.5%.
  
  
• TSMC December 2011 Sales Report (Tuesday Jan. 10, 2012)
  TSMC today announced its net sales for December 2011: On an unconsolidated basis, net sales were approximately NT$30.57 billion, a decrease of 13.2 percent over November 2011 and a decrease of 9.4 percent over December 2010.
  
  
• IBM and GLOBALFOUNDRIES Begin First Production At New York's Latest Semiconductor Fab (Tuesday Jan. 10, 2012)
  GLOBALFOUNDRIES and IBM today announced an agreement to jointly manufacture advanced computer chips at both companies' semiconductor fabs in New York's "Tech Valley." The new products recently began initial production at IBM's 300mm fab in East Fishkill and GLOBALFOUNDRIES' Fab 8 in Saratoga County, and are planned to ramp to volume production in the second half of 2012.
  
  
• UMC Reports Sales for December 2011 (Monday Jan. 09, 2012)
  UMC today reported unaudited net sales for the month of December 2011.
  
  
• UMC Pushes 8" Manufacturing Limit with A+ Technology Solution (Friday Dec. 30, 2011)
  UMC today announced its A+ technology platform, a specialized 0.11um aluminum process manufactured in UMC’s 8” fabs.
  
  
• SMIC Receives Supplier Award from Qualcomm (Wednesday Dec. 14, 2011)
  SMIC today announced its receipt of a 1 billion unit product milestone award from customer Qualcomm Incorporated in a ceremony held at SMIC's Shanghai headquarters.
  
  
• Crocus and SMIC Sign Technology Development and Wafer Manufacturing Agreements (Monday Dec. 12, 2011)
  Crocus Technology and SMIC today announced the formal signing of joint technology development and wafer manufacturing agreements. Under the agreements, the two companies will jointly develop high-temperature Magnetic Logic Unit™ (MLU) technology targeted at automotive applications.
  
  
• TSMC Expands Investment in Taiwan with New Milestone for Taichung GigaFab (Friday Dec. 09, 2011)
  TSMC today held a groundbreaking ceremony in Taichung’s Central Taiwan Science Park for Phase 3 of its Fab 15 GigaFab, setting a new milestone for the company’s commitment towards continued investment in Taiwan.
  
  
• TSMC November 2011 Sales Report (Friday Dec. 09, 2011)
  TSMC today announced its net sales for November 2011: On an unconsolidated basis, net sales were approximately NT$35.22 billion, a decrease of 5.4 percent over October 2011 and a decrease of 1.4 percent over November 2010.
  
  
• TowerJazz Signs MOU for Process Transfers and Projects in India and Brazil, Targeting India's Emerging Semiconductor Market (Thursday Nov. 17, 2011)
  TowerJazz announced today it has signed a non-exclusive MOU with a European entity to seek process transfer opportunities and projects in India and Brazil.
  
  
• TSMC October 2011 Sales Report (Thursday Nov. 10, 2011)
  TSMC today announced its net sales for October 2011: On an unconsolidated basis, net sales were approximately NT$37.25 billion, an increase of 13.3 percent over September 2011 and a decrease of 0.3 percent over October 2010.
  
  
• MagnaChip to Offer Cost Competitive Compact Standard Cell Library for Low Power Applications (Tuesday Nov. 08, 2011)
  MagnaChip Semiconductor today announced that it now offers cost competitive compact standard cell libraries targeting low power applications in 0.18um and 0.35um technologies.
  
  
• X-FAB Extends 0.18 Micrometer Technology Platform to Address Energy Efficiency Applications (Tuesday Nov. 01, 2011)
  X-FAB Silicon Foundries today announced the new technology platform XP018, its latest foundry process with the industry’s lowest mask count for the modular combination of digital, analog and high-voltage features with embedded Flash
  
  
• AppliedMicro Selects TSMC as Manufacturing Partner for ARM 64-bit SoCs On Advanced 40nm and 28nm Process Technology (Friday Oct. 28, 2011)
  AppliedMicro, today announced it has selected TSMC as its manufacturing partner to develop 64-bit ARM architecture Systems-on-Chip (SoCs) on 40nanometer (nm) and 28nm process technology.
  
  
• TSMC Reports Third Quarter EPS of NT$1.17 (Thursday Oct. 27, 2011)
  TSMC today announced consolidated revenue of NT$106.48 billion, net income of NT$30.40 billion, and diluted earnings per share of NT$1.17 (US$0.20 per ADR unit) for the third quarter ended September 30, 2011.
  
  
• TSMC 28nm Technology in Volume Production (Monday Oct. 24, 2011)
  TSMC today announced that its 28nm process is in volume production and production wafers have been shipped to customers. TSMC leads the foundry segment to achieve volume production at 28nm node.