Foundries News

• TSMC September 2011 Sales Report (Friday Oct. 07, 2011)
  TSMC today announced its net sales for September 2011: On an unconsolidated basis, net sales were approximately NT$32.86 billion, a decrease of 11.3 percent over August 2011 and a decrease of 10.3 percent over September 2010.
  
  
• UMC Delivers Foundry Industry's Most Compact MTP IP Solution (Tuesday Sep. 13, 2011)
  UMC today announced the successful completion of a joint development project with Yield Microelectronics Corporation (YMC) to deliver the foundry industry's most compact multiple-time programmable (MTP) non-volatile memory (NVM) intellectual property (IP) solution.
  
  
• GLOBALFOUNDRIES Offers BCDlite Technology Process for Applications in the Automotive Industry (Tuesday Sep. 13, 2011)
  GLOBALFOUNDRIES today announced it is offering its BCDlite™ foundry technology optimized for automotive applications such as power management devices, audio amplifiers, displays and LED driver integrated circuits (ICs).
  
  
• TSMC August 2011 Sales Report (Monday Sep. 12, 2011)
  TSMC today announced its net sales for August 2011: On an unconsolidated basis, net sales were approximately NT$37.04 billion, an increase of 6.1 percent over July 2011 and an increase of 1.5 percent over August 2010.
  
  
• GLOBALFOUNDRIES and Samsung Extend Fab Sync to New High-Performance 28nm Technology for Mobile Applications (Tuesday Aug. 30, 2011)
  GLOBALFOUNDRIES and Samsung Electronics, Co., Ltd. broadened their collaboration, announcing plans to synchronize global semiconductor fabrication facilities to produce chips based on a new high-performance and low-leakage 28nm High-K Metal Gate (HKMG) technology.
  
  
• UMC Delivers High Endurance, Variable Voltage Range Embedded EEPROM Solution (Tuesday Aug. 30, 2011)
  UMC has achieved breakthroughs in its development of embedded electrically erasable programmable read-only memory (eEEPROM) solutions, delivering an I/O voltage range of 1.8V-5V and endurance at 1 million program erase cycles.
  
  
• GLOBALFOUNDRIES and Amkor to Collaborate on Advanced Assembly and Test Solutions (Tuesday Aug. 30, 2011)
  GLOBALFOUNDRIES and Amkor today announced that they have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes.
  
  
• GLOBALFOUNDRIES Announces Design Enablement Support for 20nm Design Flows from Leading EDA Vendors (Tuesday Aug. 30, 2011)
  By successfully taping out a test chip using flows from leading EDA vendors Cadence Design Systems, Magma Design Automation, Mentor Graphics Corporation, and Synopsys Inc., GLOBALFOUNDRIES has demonstrated that it is ready for customers to begin evaluating their 20nm designs.
  
  
• SMIC Reports 2011 Second Quarter Results (Wednesday Aug. 10, 2011)
  SMIC today announced its consolidated results of operations for the three months ended June 30, 2011. Revenue down by 4.9% to $352.4 million in 2Q11 from $370.6 million in 1Q11 and down by 5.9% compared to 2Q10.
  
  
• TSMC July 2011 Sales Report (Wednesday Aug. 10, 2011)
  TSMC today announced its net sales for July 2011: On an unconsolidated basis, net sales were approximately NT$34.92 billion, a decrease of 2.1 percent over June 2011 and a decrease of 3.4 percent over July 2010
  
  
• TowerJazz Qualifies 0.13um SiGe Process at Its Israeli Fab; Technology Successfully Transferred from Its US Facility (Wednesday Aug. 03, 2011)
  TowerJazz today announced its 0.13um SiGe technology (SBL13) has been successfully transferred to its Migdal Haemek (MH), Israel fab from its Newport Beach, CA facility.
  
  
• TowerJazz Israel and Ramon Chips Deliver Advanced, Second Generation Radiation-Hardened Processor for Space Applications (Monday Aug. 01, 2011)
  TowerJazz and Ramon Chips announced today the successful completion of a second generation radiation-hardened (rad-hard) processor for space applications (GR712RC). The part is being fabricated exclusively in TowerJazz’s Fab2 in Migdal Haemek, Israel utilizing its internal 0.18-micron CMOS process technology.
  
  
• TSMC Reports Second Quarter EPS of NT$1.39 (Thursday Jul. 28, 2011)
  TSMC today announced consolidated revenue of NT$110.51 billion, net income of NT$35.95 billion, and diluted earnings per share of NT$1.39 (US$0.24 per ADR unit) for the second quarter ended June 30, 2011.
  
  
• Cypress and UMC Deliver ICs on New 65-Nanometer SONOS Embedded Flash Technology (Wednesday Jul. 27, 2011)
  Cypress and UMC today announced that they have produced working silicon on a new, 65-nanometer SONOS (Silicon Oxide Nitride Oxide Silicon) technology for embedded Flash memory
  
  
• SMIC: Appointment of Chairman, Redesignation of Director and Independent Non-Executive Director, Resignation of CEO, Appointment of Acting CEO, Resumption of Trading (Friday Jul. 15, 2011)
  SMIC: Appointment of Chairman, Redesignation of Director and Independent Non-Executive Director, Resignation of Chief Executive Officer, Appointment of Acting Chief Executive Officer and Authorised Representative, Clarification Announcement, Resumption of Trading
  
  
• GLOBALFOUNDRIES Fabs in New York and Dresden Achieve "Ready for Equipment" Milestone (Tuesday Jul. 12, 2011)
  Just over one year after revealing plans for a major global capacity expansion, GLOBALFOUNDRIES today announced its newly constructed cleanrooms in New York and Dresden are ready for the installation of 300mm semiconductor wafer fabrication equipment.
  
  
• Samsung, in Collaboration with Physical IP and Design Enablement Partners, Confirms 20nm Design Infrastructure with Test Chip Tape-out (Tuesday Jul. 12, 2011)
  Samsung Foundry’s 20nm early access process design kit (PDK) is currently available to those customers who are in the initial stages of designing their next-generation products.
  
  
• TSMC June 2011 Sales Report (Friday Jul. 08, 2011)
  TSMC today announced its net sales for June 2011: On an unconsolidated basis, net sales were approximately NT$35.65 billion, a decrease of 0.9 percent over May 2011 and an increase of 1.5 percent over June 2010.
  
  
• X-FAB Adds eFlash to High-Voltage 0.18 Micrometer Foundry Offering (Tuesday Jul. 05, 2011)
  X-FAB Silicon Foundries today enhanced its XH018 0.18 micrometer high-voltage process with a highly reliable new embedded Flash solution.
  
  
• Brite Semiconductor Achieves First-Pass Silicon Success with SMIC's 40nm Process (Tuesday Jun. 21, 2011)
  Brite Semiconductor and SMIC today announced that they have achieved first-pass silicon success with Brite's first 40nm chip, using SMIC's 40nm process technology.
  
  
• ATIC and GLOBALFOUNDRIES announce new leadership to drive continued investment through 2012 (Thursday Jun. 16, 2011)
  As part of a plan to continue significant investments in technology, talent and manufacturing capacity over the next 18 months, the board of directors of GLOBALFOUNDRIES announced today it has appointed new leadership to run the company.
  
  
• TSMC May 2011 Sales Report (Friday Jun. 10, 2011)
  TSMC today announced its net sales for May 2011: On an unconsolidated basis, net sales were approximately NT$35.96 billion, a decrease of 0.7 percent over April 2011 and an increase of 6.3 percent over May 2010.
  
  
• Samsung Qualifies 28nm LP Process Technology for High Performance Mobile Applications (Tuesday Jun. 07, 2011)
  Samsung Electronics, Co., Ltd. today announced that its foundry business, Samsung Foundry, has qualified 28nm low-power (LP) process with High-k Metal Gate (HKMG)* technology and is ready for risk production.
  
  
• Elpida, PTI, and UMC Partner on 3D IC Integration Development For Advanced Technologies Including 28nm (Tuesday May. 31, 2011)
  Elpida, PTI, and UMC, today announced that they have finalized the 3-way tie-up to deliver 3DIC integration technologies for advanced processes including 28-nm. UMC and PTI engineers have already been working with Elpida on joint development of TSV products at Elpida's Hiroshima Plant.
  
  
• TowerJazz Announces New Design Center Partnership Incentive Program (Tuesday May. 31, 2011)
  TowerJazz today announced its “Design Star Awards Program,” a new design center partnership incentive program offered to independent design centers. The program will encourage design centers that enroll in this program to refer new customers and new products to TowerJazz.
  
  
• TSMC Completes 28nm Design Infrastructure, Design Partners Show Solutions at DAC (Thursday May. 26, 2011)
  TSMC announced today that 28nm support within the Open Innovation Platform™ (OIP) design infrastructure is fully delivered, as demonstrated by 89 new 28nm designs scheduled to tapeout.
  
  
• SMIC Reports 2011 First Quarter Results (Thursday May. 19, 2011)
  SMIC today announced its consolidated results of operations for the three months ended March 31, 2011. Revenue down by 9.3% to $370.6 million in 1Q11 from $408.6 million in 4Q10 and up by 7.2% compared to 1Q10.
  
  
• Spansion and SMIC Expand Foundry Agreement (Monday May. 16, 2011)
  Spansion and SMIC today announced they will extend their current foundry arrangement to expand 65nm capacity and include the manufacture of Spansion's 45nm Flash memory.
  
  
• SMIC and Hubei Science & Technology Investment Group Sign Joint Venture Agreement in Wuhan (Thursday May. 12, 2011)
  SMIC and Hubei Science & Technology Investment Group today announced the formal signing of a joint venture agreement to invest in and manage Wuhan Xinxin Semiconductor Manufacturing Corporation's 12-inch wafer production line.
  
  
• TSMC April 2011 Sales Report (Tuesday May. 10, 2011)
  TSMC today announced its net sales for April 2011: On an unconsolidated basis, net sales were approximately NT$36.23 billion, a decrease of 0.4 percent over March 2011 and an increase of 10.9 percent over April 2010.