Nov. 29, 2023 - Untether AI®, the leader in energy-centric AI inference acceleration, today announced that it has joined Universal Chiplet Interconnect Express™ (UCIe™) Consortium, the industry organization that has developed an open specification that defines the interconnect between chiplets within a package. ...

Nov. 14, 2023 - Siemens Digital Industries Software today announced that its PAVE360-based solution for automotive digital twin is now available on AWS. Expanding on the strong partnership between Siemens and AWS, PAVE360 helps foster innovation in the automotive industry through hardware and software parallel development, ...

Nov. 01, 2023 - SureCore and Intrinsic have announced a collaborative relationship to accelerate time to market for Intrinsic’s innovative, Resistive Random-access Memory (ReRAM) technology.

Oct. 13, 2023 - Enosemi emerges from stealth mode today as a new fabless semiconductor startup focused on design enablement and design IP for silicon photonics.

Oct. 05, 2023 - The collaboration combines proteanTecs’ Health and Performance Monitoring solutions with ELES’ Design for Reliability methodology and advanced reliability test platforms.

Sep. 26, 2023 - Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the expansion of its node-to-node design migration flow based on the Cadence® Virtuoso® Studio, which is compatible with all TSMC advanced nodes, including the latest N3E and N2 process technologies.

Sep. 11, 2023 - Blue Pearl Software Inc., today announced that it has added design verification and methodology services to its product offering.

Sep. 07, 2023 - The Synopsys EDA Data Analytics solution is the first of its kind in the semiconductor industry to provide AI-driven insight and optimization to drive improvements across exploration, design, manufacturing, and testing processes.

Aug. 16, 2023 - Get Ready for an Epic Tech Odyssey with the keynote, ‘Journeying Beyond AI: Unleashing the Art of Verification’, by P. R. Sivakumar, Founder, and CEO, Maven Silicon.

Jul. 11, 2023 - Easing the design of chips for power- and space-constrained applications, Synopsys, Inc. (Nasdaq: SNPS) today announced its digital and custom design flows, powered by the Synopsys.ai™ full-stack AI-driven EDA suite, are certified for the Intel Foundry Services (IFS) Intel 16 process.

Jul. 10, 2023 - Imperas RISC-V reference models, simulator, tests, and verification IP in combination with Cadence SystemVerilog simulation tools provide a unified RISC-V verification solution

Jul. 10, 2023 - T2MIP, a leading provider of cutting-edge IP core solutions, is pleased to announce its participation in the highly anticipated Design Automation Conference (DAC) 2023 in San Francisco, California, from July 9th – 13th.

Jul. 06, 2023 - IC Manage GDP-XL IP Catalog integrates with NXP's product life cycle management to deliver improved productivity, advanced IP searching, tracking, and reuse for global IC development

Jul. 06, 2023 - Imperas will host the RISC-V panel session with like-minded industry peers and Calista Redmond, CEO of RISC-V International, as moderator

Jun. 28, 2023 - Siemens Digital Industries Software announced today at the Samsung Advanced Foundry Ecosystem (SAFE) Forum North America 2023 a range of new certifications and collaborations with longtime partner Samsung Foundry, resulting in key achievements in enabling Siemens EDA technologies for the foundry’s ...

Jun. 28, 2023 - Responding to significant market growth in high-performance computing, AI, mobile and automotive applications, Synopsys, Inc. (Nasdaq: SNPS) today announces a collaboration with Samsung to develop optimized digital and custom design flows on Samsung Foundry's SF2 process.

Jun. 26, 2023 - Cadence Design System today announced that DB GlobalChip has deployed the Cadence® Spectre® FX Simulator, integrated with Spectre AMS Designer, to verify its crucial analog and mixed-signal IP, achieving a 2X improvement in performance with the required accuracy compared to their incumbent flow.

Jun. 05, 2023 - Imperas Software Ltd., the leader in RISC-V models and simulation solutions, today announced that ImperasDV has been adopted by Dolphin Design for RISC-V processor verification for the Panther DSP/AI Accelerator IP from Dolphin Design.

Jun. 05, 2023 - Imperas will showcase solutions for RISC-V processor verification, custom instruction design flows, and software development, including a keynote on RISC-V Processor verification plus many other activities.

May. 11, 2023 - The Innovate UK-funded CryoCMOS Consortium, led by sureCore Ltd, reports that it has successfully created new, PDK-quality, transistor models characterised for both 4K & 77K operation. SureCore is using these to develop key foundation IP to enable the design of cryo-control ASICs for use in the quantum ...

Apr. 27, 2023 - Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the availability of a node-to-node design migration flow based on the Cadence® Virtuoso® Design Platform compatible with all TSMC advanced nodes, including the latest N3E and N2 process technologies.

Apr. 19, 2023 - Silicon Interfaces services encompasses FMEA (Failure Mode and Effects Analysis through to FMEDA (Failure Mode, Effects and Diagnostic Analysis) across the Safety Flow spectrum, including Safety Analysis (including Diagnostic Coverage Estimation, Failure in Time (FIT) & Fault list Generation), Design ...

Apr. 04, 2023 - SureCore has exploited its low power design capability to create a new range of ultra-low voltage SRAM solutions, called PowerMiser™ Plus, that can operate down to 0.45V, enabling customers to create market leading, low power products.

Mar. 29, 2023 - For the first time, engineers can now use AI at every stage of chip design, from system architecture to design and manufacturing, and access the solutions in the cloud. Renesas, a leader in the automotive space, is already using Synopsys.ai to shave weeks off product development times with enhanced ...

Mar. 13, 2023 - Based on the Imperas reference models for the MIPS eVocore P8700 RISC-V Multiprocessor, together with Ashling’s RiscFree™ SDK tools, this collaboration extends beyond the standard level of ecosystem support to enable developers across all design phases from pre-silicon to prototype devices to end ...

Mar. 08, 2023 - In order to speed up design times for customers, sureCore has launched a range of off-the-shelf, ultra-low power memory IP that is available for use at the most popular industry nodes.

Feb. 23, 2023 - Veriest Solutions, a leading provider of engineering services and solutions, is proud to announce its participation in the DVCon 2023 US conference, where it will present two papers in advanced verification techniques.

Feb. 23, 2023 - Samsung Electronics, a world leader in advanced semiconductor technology, and Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that Samsung’s Foundry business is providing its 5-nanometer (nm) process technology to Ambarella for its newly announced CV3-AD685 automotive ...

Jan. 26, 2023 - Axiomise, the leading provider of cutting-edge formal verification solutions, marked its fifth anniversary in 2022 with an impressive list of highlights, including training, consulting, services, and custom app development such as formalISA.

Jan. 12, 2023 - Bluespec Inc., announced today a collaboration with Synopsys to provide Synopsys reference methodologies for verification and hardware/software debug of RISC-V system designs with Bluespec RISC-V cores.

Dec. 14, 2022 - aiMotive, one of the world’s leading suppliers of scalable modular automated driving technologies, today announced the latest release of its award-winning aiWare automotive NPU hardware IP. aiWare4+ builds on the success of aiWare4 in production automotive SoCs, such as Nextchip’s Apache5 and Apach6, ...

Dec. 13, 2022 - Breker Verification Systems, the leading provider of advanced test content synthesis solutions, today unveiled the Breker Integrity FASTApps™ Portfolio, a library of automated test generation intellectual property (IP) elements targeting difficult-to-verify processor core and system-on-chip (SoC) ...

Dec. 12, 2022 - Imperas Software Ltd., the leader in RISC-V simulation solutions, today announced the latest updates to ImperasDV to support the rapid growth in RISC-V verification as developers extend into established and emerging applications with new design innovations based on the flexibility of RISC-V.

Dec. 12, 2022 - Imperas Software Ltd., the leader in RISC-V simulation solutions, today announced that Simon Davidmann has been elected as Chair of the OpenHW Verification Task Group (VTG) with an expanded charter to drive the developing verification infrastructure and methodologies applicable to all RISC-V adopters. ...

Dec. 05, 2022 - Imperas leadership in the RISC-V Verification Ecosystem recognized in the expanded OpenHW Verification Task Group charter to lead the RISC-V community in adapting to the challenges of RISC-V processor verification

Nov. 16, 2022 - Silicon Frontline Technology is proud to announce that they have been accepted as a partner in Samsung Foundry SAFE™ Program. Through in-depth collaboration, Silicon Frontlines’ ESRA CDM has been certified in Samsung Foundry process to down to 4nm technology.

Nov. 02, 2022 - The Bluetooth Low Energy (BLE) wireless interface has dramatically cut power consumption for many applications, although its ubiquity has once again raised the stakes among developers by pushing them to reconsider a range of design trade-offs that can squeeze yet more operating life between re-charges. ...

Nov. 01, 2022 - The SiFive Performance™ P670 and P470 RISC-V processors bring unparalleled compute performance and efficiency that is significantly raising the bar for innovative designs in these high-volume markets.

Oct. 27, 2022 - Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the leading Cadence® Integrity™ 3D-IC platform has achieved certification for and met all reference design flow criteria for TSMC’s 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips ...

Oct. 27, 2022 - This alliance will help customers achieve speedy implementation of silicon and system-level innovations and enable next-generation HPC and mobile applications using TSMC’s 3DFabric technologies, a comprehensive family of 3D silicon stacking and advanced packaging technologies.