Ceva-Waves Bluetooth 5.3 Low Energy Baseband Controller, software and profiles
1611 Results (721 - 760) |
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Denali Announces PureSpec Solution Featured in IBM's New PowerPC PLB-6 CoreConnect Toolkits
Sep. 16, 2009 - Denali today announced Denali's PureSpec(TM) verification IP support for IBM's PowerPC(R) processor local bus (PLB)-6, enabling verification of compliance with the latest PLB specification and validation of interoperability between the processor cores and integrated bus controllers. -
IPextreme Announces Partnership with Toppan Printing to Provide Easy Access to Freescale and National Semiconductor Microprocessor IP Cores
Sep. 15, 2009 - IPextreme today announced the immediate availability of Freescale’s 32-bit V1 ColdFire, National Semiconductor’s 16-bit CR16 and Freescale’s 8-bit HCS08 synthesizable microprocessor IP cores to Toppan’s design service customers. -
Toshiba announces availability of free and low-cost development tools for ARM microcontroller families
Sep. 14, 2009 - Atollic TrueSTUDIO® development environment options reduce cost and speed implementation of embedded systems based on Toshiba ARM926EJ-S™ and ARM Cortex™-M3 families -
TSMC Selects Synopsys HSIM Simulator for Sub-40nm Memory IP Characterization
Sep. 14, 2009 - Synopsys today announced that TSMC has adopted Synopsys' HSIM® hierarchical FastSPICE circuit simulator for its sub-40-nanometer (nm) memory intellectual property (IP) characterization flow. -
Xilinx Demonstrates New Broadcast Offerings That Lower Cost and Power of Serial Digital Interfaces
Sep. 08, 2009 - Xilinx today announced demonstrations of the latest developments in serial connectivity that lower the cost and power of serial digital interfaces and enable the rapid adoption of emerging DisplayPort and Ethernet AVB protocols. -
GSA Appoints Warren Savage as IP Interest Group Chairman
Aug. 31, 2009 - GSA announce the appointment of Warren Savage, president and chief executive officer of IPextreme, to serve as the GSA IP Interest Group Chairman. -
Cadence and GLOBALFOUNDRIES Announce Broad, Multi-Year Technology Agreement
Aug. 31, 2009 - As part of the agreement, GLOBALFOUNDRIES has adopted a comprehensive suite of Cadence® technologies to aid in the design, verification and manufacturing of complex semiconductor devices targeting process technologies of 45 nanometers and below. In addition, GLOBALFOUNDRIES will team with the Cadence ... -
Cadence Design Systems Appoints John Bruggeman as Chief Marketing Officer
Aug. 27, 2009 - -
Global Unichip Provides High Speed Interface Total Solution
Aug. 06, 2009 - Global Unichip announced its Gbps level high speed production-proven total solution. The total solution includes comprehensive IP portfolio, ASIC implementation, chip + package co-design, and production testing solution. -
Actel's Libero IDE v8.6 Continues to Lead the Way in Low Power Design and Analysis
Aug. 03, 2009 - Actel continues to lead the way for low-power designs with the release of Libero® Integrated Design Environment (IDE) v8.6. The newest version of the Libero IDE offers designers several new features, including upgraded power analysis using the SmartPower tool and post-layout probe insertion for device ... -
Cadence Reports Q2 2009 Financial Results
Jul. 29, 2009 - Cadence reported second quarter 2009 revenue of $210 million, compared to revenue of $308 million reported for the same period in 2008. On a GAAP basis, Cadence recognized a net loss of $74 million, or $(0.29) per share on a diluted basis, in the second quarter of 2009, compared to a net loss of $19 ... -
MindTree develops 'e' to SystemVerilog language migration utility
Jul. 28, 2009 - SystemVerilog (SV) along with its methodologies is emerging as a unified language for design and verification using object oriented techniques. Companies who have already invested in Specman ‘e’ test benches face a dilemma whether to continue supporting legacy verification infrastructure for future ... -
TSMC and Global Unichip Collaborate On Silicon Proven SiP Solution in TSMC Reference Flow 10.0
Jul. 27, 2009 - Global Unichip announced today the application and validation of System-in-Package (SiP) design solution in TSMC Reference Flow 10.0 as the fruit of collaboration with TSMC. The SiP methodology has been fully qualified with GUC production case and achieved good silicon correlation. -
Denali Expands PureSpec Solution for Predictable Protocol Verification
Jul. 24, 2009 - Denali Software today announced the availability of the extended PureSpec™ verification IP solution with planning and protocol exploration capabilities, plus seamless integration into 3rd party verification planners, such as Synopsys® VMM Planner. -
OVM World Collaborates on Accellera's Industry Solution for VIP Interoperability
Jul. 22, 2009 - Mentor and Cadence today announced that the Accellera guide for verification IP (VIP) interoperability, currently in draft form, was enabled by technology contributions provided by both companies in open source form, and served as a basis for the reference implementation of the Accellera VIP Technical ... -
Cadence Introduces First TLM-Driven Design and Verification Solution to Increase Engineering Productivity over RTL-based Flows
Jul. 16, 2009 - The Cadence® solution combines C-to-Silicon Compiler with new memory compiler integration and C/C++ usability, Incisive® Enterprise Simulator with new TLM/RTL metric-driven verification and source level debug visualization, Calypto® sequential logic equivalence checking, the first version of the ... -
Synopsys Accelerates Development of System-On-Chip Designs With Complete IP Solution for PCI Express 3.0
Jul. 15, 2009 - Synopsys today announced its complete DesignWare® IP solution for PCI Express® (PCIe®) 3.0 consisting of digital controllers, PHY and verification IP. Synopsys' DesignWare IP enables easy integration of the 8.0 GT/s PCI Express 3.0 interface into system-on-chips (SoCs) for high-performance enterprise ... -
Avery Design Systems Announces Support for PCI Express 3.0 Verification IP
Jul. 10, 2009 - Avery Design Systems today announced that its PCI-Xactor verification IP solution now supports the PCI Express® (PCIe®) 3.0 draft standard, at a preliminary revision 0.5, and is available to existing customers under active maintenance. -
InSilica Inc. Licenses Beyond Semiconductor's BA22 Processor
Jul. 09, 2009 - InSilica Inc. announced that it has taken a license to use BA22 RISC Processor solution from Beyond Semiconductor in its next generation camera processors. The value to InSilica of Beyond Semiconductor's IP solution is to reduce power in its camera processor SoCs while reducing overall silicon area ... -
Atrenta Collaborates With Sonics and Denali on a 1Team-Genesis Reference Flow to Accelerate SoC Assembly
Jul. 07, 2009 - Atrenta today announced a collaboration with Sonics and Denali to build a reference flow based on Atrenta’s 1Team®-Genesis automated chip assembly product. The flow will facilitate a healthy eco-system of semiconductor IP that is qualified and ready to use in automated SoC assembly. -
MIPS Technologies and EE Solutions Bring MIPS(R) Architecture to Semiconductor Companies across China and Taiwan
Jul. 07, 2009 - MIPS and EE Solutions announced they are teaming to provide semiconductor companies in China and Taiwan with easy access to MIPS' industry-standard technology. EE Solutions licensed the synthesizable MIPS32(R) 24KEc(TM) core as part of its digital IP portfolio and will work with MIPS to provide value-added ... -
Synopsys MVSIM Adopted for Low Power Verification of STw8500 Mobile SoC Platform
Jul. 01, 2009 - ST-Ericsson selected MVSIM for its proven ability to comprehensively verify low power techniques, including standby and built-in automated low power assertions, which enable the early detection of bugs. The tool's extensive support for the IEEE 1801 [Unified Power Format (UPF)] power format, on which ... -
Cadence and Xilinx Simplify SoC Development With Enterprise Verification Capabilities for FPGA Targeted Design Platforms
Jun. 24, 2009 - IEEE-Standard Encryption for SecureIP Models Offers 2X Performance Boost; Open Verification Methodology (OVM) to Increase Schedule Predictability and Quality -
Xilinx Accelerates Development of Next-Generation Systems With Industry's First Deployment of Targeted Design Platforms
Jun. 24, 2009 - Xilinx today released the Xilinx Base Targeted Design Platform aimed at accelerating the development of system-on-chip (SoC) solutions with Xilinx(R) Virtex(R)-6 and Spartan(R)-6 field programmable gate arrays (FPGAs). -
Tiempo Demonstrates the First Asynchronous Synthesis Tool Using Standard Languages
Jun. 19, 2009 - Tiempo will reveal at the 46th DAC, its unique and breakthrough asynchronous synthesis tool. ACC (“Asynchronous Circuit Compiler”) is the first synthesis tool on the market which automatically generates asynchronous and delay-insensitive circuits from a model written in a standard hardware description ... -
eASIC and IPextreme Announce Freescale ColdFire Processors for Nextreme NEW ASICs
Jun. 16, 2009 - eASIC and IPextreme today announced the immediate availability of Freescale’s 32-bit V1 and V2 ColdFire processor cores for Nextreme NEW ASICs. -
Innovative Logic announces fully integrated USB3.0 Controller with PCS layer
Jun. 16, 2009 - Innovative Logic announced today the second release of USB 3.0 Device Controller IP. Inno-Logic’s USB3.0 IP offering includes implementation IP as well as verification IP by making use of industry standard latest tools and methodologies. -
Sonics Joins IPextreme's Constellations Program
Jun. 11, 2009 - Sonics, Inc., and IPextreme Inc., announce today that Sonics has joined the IPextreme Constellations program, which is designed to make semiconductor IP more accessible to a greater number of SoC designers. -
Cadence Announces Restructuring
Jun. 11, 2009 - Upon completion, Cadence expects to achieve annual operating expense savings of approximately $30 million, through a combination of workforce and other expense reductions. -
Casio Selects Cadence C-to-Silicon Compiler for High-Level Synthesis
Jun. 08, 2009 - Cadence today announced that Casio Computer Co., Ltd., has selected the Cadence® C-to-Silicon Compiler as its high-level synthesis solution. -
Synopsys Enables System Design Interoperability With System-Level Catalyst Program
Jun. 08, 2009 - Open to electronic design automation (EDA) vendors, intellectual property (IP) vendors, embedded software companies and service providers, the program is designed to benefit mutual customers by advancing tool and model interoperability as well as availability of system-level models and services. -
ARM Selects Jasper for Formal Verification of IP
May. 19, 2009 - Jasper Design Automation, provider of advanced formal technology solutions, today announced its JasperGold® Verification System has been adopted by ARM. -
Cadence and Virtutech Extend Metric-Driven Verification to Virtual Systems Development
May. 19, 2009 - Cadence and Virtutech today announced a collaboration to integrate Cadence® Incisive® Software Extensions with the Virtutech Simics® high-speed system-level virtual platform. -
Cadence Speeds Systems Development with Automated Transaction-Level Verification
May. 19, 2009 - Cadence announced today that it has delivered an extended system-level verification solution that supports the Open SystemC Initiative (OSCI) TLM 2.0 standard. -
NXP Semiconductors Accelerates Design Cycle using New Cadence Encounter Digital Implementation System for Industry’s First 45nm Digital TV Processor
May. 18, 2009 - Cadence Design Systems announced today that NXP Semiconductors utilized the new Cadence® Encounter® Digital Implementation System (EDI System), and its seamless design-for-manufacturing (DFM) technologies to ensure reliable production of its advanced 45-nanometer PNX85500 digital TV processor chip ... -
PLDA Achieves IP Success with Cadence SuperSpeed USB (USB 3.0) Verification IP
May. 18, 2009 - Cadence today announced that PLDA utilized Cadence® Incisive® USB 3.0 (SuperSpeed USB) verification IP (VIP) to achieve IP success for its commercial USB 3.0 design IP. -
Octasic Inc. Appoints New Chief Executive Officer
May. 12, 2009 - Octasic today announced that Robert Blake has been appointed chief executive officer. Blake, who until recently served as vice president of consumer and automotive business at Altera Corporation, brings more than 20 years of industry experience to Octasic. -
Cadence Encounter Digital Implementation System Used by Gennum’s Snowbush IP Group to Speed Delivery of Industry’s First 45nm USB 3.0 PHY IP
May. 07, 2009 - Cadence announced today that Gennum Corporation’s Snowbush IP Group utilized the Cadence® Encounter® Digital Implementation System to develop the industry’s first 45-nanometer SuperSpeed USB 3.0 PHY IP core. -
Cadence Reports Q1 2009 Financial Results
Apr. 30, 2009 - Cadence reported first quarter 2009 revenue of $206 million, compared to revenue of $271 million reported for the same period in 2008. On a GAAP basis, Cadence recognized a net loss of $63 million, or $(0.25) per share on a diluted basis, in the first quarter of 2009, compared to a net loss of $33 million, ... -
Tego Standardizes on VMM and Synopsys VCS Solution to Speed Verification of Radio Frequency Identification Tags
Apr. 28, 2009 - Synopsys today announced that Tego, Inc. has standardized on the production-proven VMM verification methodology and VCS® functional verification solution, both key components of Synopsys' Discovery™ Verification Platform, to verify their radio frequency identification (RFID) tags for the aviation ...