May. 15, 2014 - STMicroelectronics and Samsung Electronics today announced the signing of a comprehensive agreement on 28nm Fully Depleted Silicon-on-Insulator (FD-SOI) technology for multi-source manufacturing collaboration.

Mar. 28, 2014 - The semiconductor industry's growth has historically depended on a reduction in cost per transistor with each migration to smaller dimensions, but next-generation chips will not deliver this cost reduction. The impact of this situation is one of the most serious challenges the industry has faced within ...

Feb. 14, 2014 - CEA-Leti and STMicroelectronics have presented the successful demonstration of an ultra-wide-voltage range (UWVR) digital signal processor (DSP), based on 28nm ultra-thin body buried-oxide (UTBB) FD-SOI technology.

Jan. 29, 2014 - European chip company STMicroelectronics NV is gaining design wins for its 28nm fully depleted silicon-on-insulator (FDSOI) manufacturing process but is being coy about who will be its initial partner for high volume manufacturing. The date for the start of second-source volume manufacturing of FDSOI ...

Nov. 07, 2013 - STMicroelectronics announced today its close collaboration with Memoir Systems has made the revolutionary Algorithmic Memory Technology available for embedded memories in application-specific integrated circuits (ASICs) and Systems on Chips (SoCs) manufactured in ST’s fully-depleted silicon-on-insulator ...

Oct. 28, 2013 - sureCore Ltd has announced that it has taped out its low power SRAM IP demonstrator chip in STMicroelectronics’ 28nm Fully Depleted Silicon-on-Insulator (FD-SOI) process.

May. 21, 2013 - STMicroelectronics is considering plans to offer its fully depleted silicon on insulator (FDSOI) process to second-tier foundries United Microelectronics Corp. and SMIC.

Feb. 11, 2013 - Globalfoundries Inc. has set out a timetable to the high volume production of fully-depleted silicon-on-insulator (FDSOI) chips making the mainstream adoption of the process possible.

Feb. 06, 2013 - Warren East, CEO of processor IP licensor ARM, says the company stands ready to help STMicroelectronics make a success of its fully-depleted silicon-on-insulator (FDSOI) chip manufacturing process, but that it is up to ST to make the process more widely available.

Jan. 21, 2013 - STMicroelectronics is in discussions with Globalfoundries Inc. on a transfer of fully depleted silicon on insulator (FDSOI) manufacturing process technology for volume production in 2013, according to a senior executive at ST.

Jan. 08, 2013 - ST-Ericsson announced the world’s fastest and lowest-power integrated LTE smartphone platform. The NovaThor™ L8580 ModAp is a multimode LTE-enabled integrated smartphone platform that includes a full connectivity suite and features an eQuad™-powered application processor running at up to 2.5Ghz. ...

Dec. 17, 2012 - A senior engineer at FPGA vendor Altera has evaluated fully-depleted silicon on insulator (FDSOI) chip manufacturing process and concluded that the technology could have particular benefits for FPGAs.

Dec. 14, 2012 - Documents presented at the fully depleted silicon on insulator (FDSOI) workshop in San Francisco this week show that the FDSOI roadmap now omits a 20-nm and goes straight to 14-nm and then on to 10-nm.

Sep. 25, 2012 - Chip giant Intel and the research partnership clustered around IBM and STMicroelectronics are each set to report progress on their approaches to leading-edge IC manufacturing during the International Electron Devices Meeting (IEDM) in San Francisco in December.

Jul. 12, 2012 - A consortium touting fully depleted silicon-on-insulator (FDSOI) technology for mobile computing applications presented a united front this week in promoting the process technology as a viable alternative to Intel’s FinFET manufacturing approach.

Jun. 11, 2012 - STMicroelectronics announces that GLOBALFOUNDRIES has agreed to manufacture devices for ST using ST’s proprietary Fully Depleted Silicon-on-Insulator (FD-SOI) technology in both the 28nm and 20nm nodes.

Mar. 13, 2012 - Soitec announced today that ST-Ericsson has selected planar fully depleted silicon on insulator (FD-SOI) technology for use in future mobile platforms.

Jul. 14, 2011 - FD-SOI Determined to Be More Economical Than Planar Bulk Silicon CMOS Processing

Feb. 27, 2025 - X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, and Attopsemi Technology, the innovative one-time programmable (OTP) IP solutions provider, jointly announced today the successful demonstration of the latest version of Attopsemi’s I-fuse S3® OTP on X-FAB's XH018 ...

Oct. 10, 2024 - The companies have integrated Crypto Quantique’s QDID physical unclonable function (PUF) with Attopsemi’s I-fuse® OTP technology so that PUF error correction data can be stored securely in the OTP.

Apr. 04, 2024 - sureCore, the low power embedded memory specialist, has announced the availability of its PowerMiser, ultra-low, dynamic power memory compiler in 16nm. This will enable developers to more easily hit their challenging power budgets and successfully exploit the capabilities of these mature FinFET processes. ...

Mar. 11, 2024 - T2MIP is pleased to announce the availability of its partner’s silicon and production-proven 14-bit Wideband Time-Interleaved Pipeline ADC IP cores supporting 4.32 Gsps sampling speed in 28nm FDSOI process with complete source-code delivery and full modification rights and unlimited usage.

Feb. 20, 2024 - imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – presents a unique, low-power ultra-wideband (UWB) receiver chip that is ten times more resilient against interference from Wi-Fi and (beyond) 5G signals than existing, state-of-the-art UWB devices.

Nov. 29, 2023 - SiliconIntervention today announced the successful demonstration of eliminating thermal noise in analog circuits based on quantum tunneling.

Sep. 27, 2023 - The new features include ultra-low power memory, designed to operate with exceptional energy efficiency, even in the most power-sensitive environments. Additionally, GF’s 22FDX platform introduces advanced temperature-resistant capabilities, which are critical for the auto industry as they ensure ...

Aug. 28, 2023 - Racyics®, Europe’s leading design house for mixed-signal System-on-Chip design in advanced nodes, has announced that it is now an Arm Approved Design Partner.

Jul. 18, 2023 - Attopsemi Technology, a leading provider of OTP IP (One-Time Programmable intellectual property), announced today a series of collaboration with Denso Corporation, a global supplier of automotive technology, to upgrade 180nm SOI technology, facilitating future installations of automotive products.

May. 11, 2023 - The Innovate UK-funded CryoCMOS Consortium, led by sureCore Ltd, reports that it has successfully created new, PDK-quality, transistor models characterised for both 4K & 77K operation. SureCore is using these to develop key foundation IP to enable the design of cryo-control ASICs for use in the quantum ...

Nov. 14, 2022 - T2MIP, the global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the availability of its partner’s silicon and production-proven 14-bit Wideband Time-Interleaved Pipeline ADC IP cores supporting 4.32 Gsps sampling speed in 28nm FDSOI process with full modification ...

Sep. 23, 2022 - CAES announced that it has won multiple contracts with the European Space Agency (ESA) for the development of the GR765 System-on-Chip (SOC), the first user selectable CPU for space. This next-generation, radiation-hardened device will allow users to select between the LEON5 SPARC V8 or NOEL-V RISC-V ...

Aug. 29, 2022 - T2MIP is pleased to announce the availability of its partner’s silicon and production-proven 14-bit Wideband Time-Interleaved Pipeline ADC IP cores supporting 4.32 Gsps sampling speed in 28nm FDSOI process with complete source-code delivery and full modification rights and unlimited usage.

Jul. 28, 2022 - SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced it is receiving $15 million in funding from the Department of Defense (DOD) to facilitate open source design for its 90 nm process offering, part of the previously announced $27 million investment.

Jul. 13, 2022 - SkyWater Technologytoday announced the Department of Defense (DOD) is funding a $27 million Other Transactional (OT) Agreement Option to further develop intellectual property (IP) for its 90 nm Strategic Rad-Hard by Process (RH90) FDSOI technology platform.

Jun. 13, 2022 - SkyWater Technology today announced a new component of its RH90 IP ecosystem to enable 90 nm strategic rad-hard by process solutions for microelectronic devices used in harsh environments. Mobile Semiconductor will provide two static random-access memory (SRAM) compilers for SkyWater customers developing ...

Jun. 08, 2022 - T2MIP, the global independent semiconductor IP Cores provider & Technology experts, is pleased to announce the availability of its’ partners silicon and production proven 14-bit Wideband Time-Interleaved Pipeline ADC IP cores supporting 4.32 Gsps sampling speed in 28nm FDSOI process with full modification ...

May. 10, 2022 - X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with Attopsemi, the innovative one-time programmable (OTP) IP solutions provider, today announced that the latest version of Attopsemi‘s I-fuse® IP with its next generation architecture has been successfully ...

May. 04, 2022 - Bringing 30 years of business experience in STMicroelectronics and Kalray where he held the position of VP Business Development, Stéphane will be responsible, in addition to managing the company, for accelerating Intento global sales expansion.

May. 04, 2022 - CoreHW’s new automotive compliant mmWave PLL frequency synthesizer IP is changing your experience of using wireless technology.

Apr. 21, 2022 - At the end of 2021, GlobalFoundries awarded Mobile Semiconductor Platinum Qualification Status for the RF1P-ULL-GF22FDX Memory Compiler. This qualification level through the FDXcelerator Program indicates full approval including silicon report acceptance.

Apr. 08, 2022 - CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology.