Jan. 26, 2022 - Thalia Design Automation, provider of analog and mixed-signal circuit IP reuse platform, today announced enhancements to its Technology Analyzer and Circuit Porting tools, key parts of its AMALIA IP reuse & development platform.

Nov. 02, 2021 - First commercial deal to take Weebit’s ReRAM technology to volume production, successful demonstration of ReRAM technology at 28nm, expanded development partnership with CEA-Leti

Oct. 04, 2021 - Weebit Nano, a leading developer of next-generation memory technologies for the global semiconductor industry, together with its development partner CEA-Leti, have demonstrated production-level parameters of Weebit’s Resistive Random-Access Memory (ReRAM) technology in a 28 nanometre (nm) process.

Sep. 09, 2021 - Attopsemi™ Technology, innovator of the revolutionary I-fuse™ OTP IP, together with New Japan Radio (“NJR”), one of the leading electronic device manufacturers in the world, announced jointly that I-fuse™ OTP IP was successfully embedded into NJR’s products.

Jul. 21, 2021 - Attopsemi™ Technology, innovator of the revolutionary I-fuse™ OTP IP, together with ABLIC Inc., the IC vendor of best analog semiconductor solutions, have a successful collaboration. The companies jointly announced that I-fuse™ OTP IP is now qualified on a Japanese Wafer Fab’s 130nm BCD process, ...

Jul. 19, 2021 - Dolphin Design and CEA-List have formed a new joint R&D lab of embedded systems. Their goal is to achieve the best tradeoff for Edge AI devices between SW flexibility, energy efficiency, and peak performance. Specifically, CEA-List's PNeuro® hardware accelerator integrates AI into the computing platform ...

Jan. 20, 2021 - Attopsemi, innovator of I-fuse™ one-time programmable (OTP) IP provider, today announced the availability of a white paper titled “I-fuse™ --- Most Reliable and Fully Testable OTP”. This paper discusses performance characteristics of I-fuse™, a non-breaking fuse technology.

Nov. 19, 2020 - Mentor, a Siemens business, today announced that it has joined Nano 2022 – a strategic private/public program presented by the French Minister of Economics on STMicroelectronics premises and focused on driving innovation for France’s microelectronics industry.

Nov. 04, 2020 - T2MIP, the global independent semiconductor IP Cores & Technology provider, is pleased to announce the availability of a comprehensive range of high-volume production proven SERDES IPs extracted from, production 28FDSOI chips.

Oct. 08, 2020 - X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, together with Attopsemi, innovator of I-fuse™ one-time programmable (OTP) IP solutions, have entered into a collaboration to satisfy the memory requirements of 5G technology.

Feb. 18, 2020 - Leti and List, institutes of CEA-Tech, reported a high-performance processor breakthrough using an active interposer as a modular and energy- efficient integration platform solution that enables efficient integration of large-scale chiplet-based computing systems such as high-performance computing (HPC) ...

Dec. 10, 2019 - Attopsemi's I-fuse™ OTP provides small size, low program voltage, low read voltage, wide temperature, and high reliability for successful mass production in Melexis’ sensor ICs.

Nov. 20, 2019 - Attopsemi Technology attended SOI Symposium on October 30th, 2019 in Yokohama, Japan and provided a talk “I-fuse™: A Disruptive OTP Technology”. The event was a huge success and attracted several hundreds of attendees.

Oct. 08, 2019 - In the partnership with Samsung Foundry business, Dream Chip is now able to offer total ASIC solutions from specification to volume production for their SoC customers including latest semiconductor nano technologies like 8 nm and beyond.

Sep. 20, 2019 - Attopsemi Technology attended D&R IP SoC Day on September 12, 2019 in Shanghai, China and provided a talk “I-fuse™: Dream OTP Finally Comes True” and won the best Innovative IP award.

Aug. 27, 2019 - sureCore Limited today announced that it has opened a new Low Power Design Service that offers its concept-to-tape-out low power mixed-signal design expertise to ASIC developers.

Jul. 16, 2019 - Attopsemi Technology attended ChipEx2019 on May 3, 2019 in Tel Aviv, Israel and provided a talk “I-fuseTM A Disruptive OTP (One-Time Programmable).” ChipEx is the largest annual event of the Israeli Semiconductor industry.

Jun. 20, 2019 - Vidatronic, Inc., a leading provider of analog, power management unit (PMU) and CMOS radio frequency (RF) Intellectual Property (IP) licenses, today announced that they will provide PMU and analog IP cores to multinational semiconductor and software design company, Arm, for use in their solutions.

Jun. 20, 2019 - We are pleased to inform you that due to the demand of business expansion, with effect from June 17, 2019, the company has been relocated to new building as following address, the main telephone and facsimile numbers remain unchanged.

Dec. 20, 2018 - Attopsemi Technology attended SemIsrael on November 27, 2018 in Tel Aviv, Israel and provided a talk “100% Testable OTP for Automotive.” More than 40 semiconductor chip and IP companies worldwide joined this event that attracted several hundreds of attendees.

Aug. 28, 2018 - Globalfoundries' lack of business success at the leading-edge of FinFET foundry work means it can no longer afford to pursue a twin FinFET and FDSOI development strategy and is stopping all 7nm development.

Aug. 22, 2018 - Flex Logix Technologies, Inc.the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that it has hired Quantum Leap Sales in response to growing demand for its leading eFPGA platform in North America.

Jun. 22, 2018 - Arm and Samsung Foundry push the possibilities of semiconductor manufacturing with industry’s first eMRAM compiler and new physical IP offerings on advanced process nodes including 7nm and 5nm

Apr. 26, 2018 - Mobile Semiconductor, a Seattle WA based company, today announced the inclusion of its new 22nm ULL (Ultra Low Leakage) memory compilers in the industry leading GLOBALFOUNDRIES FDXceleratorTM Program. This new embedded SRAM technology on 22nm FDX offers the best in class memory solution using the GLOBALFOUNDRIES ...

Feb. 26, 2018 - Dream Chip Technologies announced today record power efficiency of its ADAS System-on-Chip (SoC) for automotive computer vision applications, fabricated on GLOBALFOUNDRIES 22FDX® semiconductor process at the foundry’s Fab 1 facility in Dresden, Germany.

Jan. 10, 2018 - Incise Infotech, a major Indian Semiconductor technology service provider, has signed a commercial marketing agreement with T2M, the world’s largest independent global semiconductor technology provider.

Oct. 30, 2017 - Attopsemi Technology published a paper “32Kb Innovative Fuse (I-Fuse) Array in 22nm FD-SOI with 0.9V/1.4mA Program Voltage/Current and 0.744um2 Cell” for the 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).

Sep. 07, 2017 - Menta SAS, a leading embedded FPGA (eFPGA) Intellectual Property (IP) provider, and sureCore Ltd., a low-power SRAM IP leader, today opened the doors to creative power-sensitive design in leading-edge applications with the availability of eFPGA IP with embedded sureCore PowerMiserTM low-power SRAM IP. ...

Jun. 20, 2017 - Synopsys, Inc. today announced the enablement of the Synopsys Design Platform and DesignWare® Embedded Memory IP on GLOBALFOUNDRIES 7-nm Leading-Performance (7LP) FinFET process technology.

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Mar. 02, 2017 - The 3D-NoC network-on-chip developed by Leti, STMicroelectronics, and Mentor Graphics under a project coordinated by IRT Nanoelec offers 20% to 40% less energy consumption and higher speeds than other NoCs.

Feb. 28, 2017 - Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, and Dream Chip Technologies GmbH today announced that Dream Chip Technologies (DCT) is demonstrating an automotive ADAS development platform at Mobile World Congress.

Jan. 26, 2017 - ZeroPoint Technologies AB (Goteborg, Sweden) is developing a hardware-based approach to data compression called MaxiMem that could be useful for both servers and leaf node equipment.

Dec. 01, 2016 - QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced a strategic initiative to substantially broaden its market reach. The company will selectively license its proprietary ultra-low power ...

Oct. 11, 2016 - First tape-outs could come as soon as the first quarter of 2017 for memory intellectual property licensor SureCore Ltd. (Sheffield, England), according to company CEO, Paul Wells.

Sep. 08, 2016 - GLOBALFOUNDRIES today announced a new partner program, called FDXcelerator™, an ecosystem designed to facilitate 22FDX™ system-on-chip (SoC) design and reduce time-to-market for its customers.

Jul. 13, 2016 - Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.

Jun. 07, 2016 - Menta SAS, a provider of embedded FPGA (eFPGA) Intellectual Property (IP), today announced the next generation of its embedded programmable logic IP cores for SoCs. The programmable logic, available as both custom and pre-defined IP cores, is based on Menta’s proven eFPGA fabric, optimized to deliver ...

Jun. 03, 2016 - sureCore Ltd., the low power SRAM IP leader, today announced the immediate availability of its TSMC 40nmULP process technology memory compiler. The new compiler facilitates utilisation of sureCore's recently announced 40nm Ultra Low Voltage SRAM IP that effectively operates at a record-setting 0.6V ...

May. 31, 2016 - Arteris today announced that Dream Chip Technologies GmbH has licensed Arteris FlexNoC interconnect IP with the Arteris FlexNoC Resilience Package for use in the European Commission / ENIAC THINGS2DO automotive advanced driver assistance systems (ADAS) reference development platform project.