Dec. 10, 2018 - Synopsys, Inc. (Nasdaq: SNPS) announced today another milestone in its longstanding partnership with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, with the successful completion of the first comprehensive sub-3 nanometer (nm) parasitic variation modeling ...

Dec. 03, 2018 - Imperas Software Ltd., the leader in virtual platforms and high-performance software simulation, today announced the partnership with Valtrix Systems for advanced RISC-V Processor test and validation.

Nov. 20, 2018 - Xilinx, Inc. (NASDAQ: XLNX) today announced that its Zynq® UltraScale+™ MPSoC family has been assessed as SIL 3, HFT1 capable, according the IEC 61508 functional-safety specification, by Exida, the leading functional safety certification agency.

Oct. 29, 2018 - Kazan Networks today announced the release of its Fuji NVMe-oF™ Bridge ASIC to volume production in December 2018, along with its companion Onyx Bridge Adapter.

Oct. 09, 2018 - Mentor, a Siemens business, today announced it has qualified complete solutions from its Calibre® nmPlatform™, Analog FastSPICE™ (AFS)™ Platform, Eldo® Platform and Nitro-SoC place and route system for GLOBALFOUNDRIES' 22FDX Fully-Depleted Silicon-On-Insulator (FD-SOI) integrated circuit (IC) ...

Oct. 04, 2018 - Synopsys, Inc. (Nasdaq: SNPS) today announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS®) advanced packaging technologies.

Oct. 02, 2018 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital tools and advanced IC packaging solutions support the new TSMC InFO_MS (InFO with Memory on Substrate) packaging technology.

Oct. 01, 2018 - Open-Silicon, a system-optimized ASIC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance (DCA) programs, will present on custom SoC platform solutions for AI applications at the TSMC Open Innovation Platform® (OIP) Ecosystem Forum on October ...

Oct. 01, 2018 - Cadence today announced its continued collaboration with TSMC to certify its design solutions for TSMC 5nm and 7nm+ FinFET process technologies for mobile and high-performance computing (HPC) designs.

Sep. 10, 2018 - BrainChip, the leading neuromorphic computing company, today establishes itself as the first company to bring a production spiking neural network architecture – the Akida Neuromorphic System-on-Chip (NSoC) – to market.

Aug. 27, 2018 - Synopsys today announced a state-of-the-art artificial intelligence (AI) enabled formal verification app, Regression Mode Accelerator, as part of the Synopsys VC Formal® solution.

Aug. 14, 2018 - Antmicro, a software-driven technology vendor for edge AI and cyber-physical systems, and SiFive, the first fabless semiconductor company to offer customized silicon based on the free and open RISC-V Instruction Set Architecture, are announcing a milestone partnership to bring forth a complete offering ...

Aug. 14, 2018 - By combining the Palladium Z1 emulation platform with Cadence Xcelium™ Parallel Logic Simulation, GUC engineers were able to apply more complex SoC verification test scenarios with full debug visibility, accelerating verification by up to 795 times.

Jul. 31, 2018 - Thalia Design Automation and Catena, a leader in radio frequency (RF) communication intellectual property (IP) for connectivity, today announced successful completion of their first jointly delivered analog IP reuse projects.

Jul. 25, 2018 - The Akida Development Environment is a machine learning framework for the creation, training, and testing of spiking neural networks (SNNs), supporting the development of systems for edge and enterprise products on the Company’s Akida Neuromorphic System-on-Chip (NSoC).

Jun. 18, 2018 - On June 13-14th, 2018, Dolphin Integration, partner of the ENIAC’s THINGS2DO European project, showcased its achievements with PowerStudio, its cutting-edge EDA tool for safe Power Regulation Networks implementation.

Jun. 14, 2018 - Synopsys, Inc. (Nasdaq: SNPS) today announced that Samsung Foundry has certified the Synopsys Design Platform with Fusion Technology for 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

Jun. 06, 2018 - Sonics announced a partnership with Synkom, a leading electronic design services firm in Japan, that incorporates NoC and Energy Processing Unit (EPU) IP into Synkom’s design flow for companies creating complex chips using Synkom’s services.

May. 23, 2018 - Synopsys today announced that Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, has certified the Synopsys Design Platform for Samsung Foundry's 8-nanometer (nm) LPP (Low Power Plus) process.

May. 01, 2018 - Cadence today announced that its full suite of Cadence® digital, signoff and custom/analog IC design tools, along with advanced IC packaging design solutions, support the new TSMC Wafer-on-Wafer (WoW) stacking technology.

May. 01, 2018 - Cadence today announced its continued collaboration with TSMC to further 5nm and 7nm+ FinFET design innovation for mobile and high-performance computing (HPC) platforms.

Apr. 16, 2018 - Arm and Synopsys, Inc. (Nasdaq: SNPS) have extended their collaboration and signed a multi-year subscription agreement expanding Synopsys' access to a broad range of Arm intellectual property (IP) to enable optimization of Synopsys tools and methodologies for Arm-based system-on-chips (SoCs).

Apr. 11, 2018 - Cadence Design Systems, Inc. (NASDAQ: CDNS) today introduced major enhancements to its Cadence® Virtuoso® custom IC design platform that improve electronic system and IC design productivity.

Mar. 06, 2018 - Silvaco today announced that it has acquired NanGate, a leader in Electronic Design Automation (EDA) software, that offers tools and services for creation, optimization, characterization and validation of physical library IP.

Mar. 01, 2018 - CEVA today announced that it is supporting Nokia in the development of its ReefShark baseband System-on-Chips (SoCs), set to be deployed for 4.9G and 5G wireless infrastructure.

Feb. 27, 2018 - Sonics announced a partnership with Inomize (Netanya, Israel) that enables chip designs to comply with the ISO 26262 automotive functional safety standard using Sonics’ NoCs with Inomize’s ASIC design platforms and services.

Feb. 26, 2018 - Together, Magillem and Imperas provide a unique virtual prototyping solution set, fully based on the IEEE standards IP-XACT and SystemC.

Feb. 08, 2018 - Siemens today announced it has entered into an agreement to acquire Oulu, Finland-based Sarokal Test Systems Oy, a provider of innovative test solutions for fronthaul networks that are comprised of links between the centralized radio controllers and the radio heads (or masts) at the "edge" of a cellular ...

Jan. 25, 2018 - Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, has announced today its continued commitment to first-pass silicon success for its foundry customers’ chip designs by launching the Samsung Advanced Foundry Ecosystem (SAFETM) program.

Jan. 22, 2018 - Thalia Design Automation today announced a significant expansion of its analog design engineering capabilities, with the opening of a new engineering center in Hyderabad, India.

Nov. 20, 2017 - Andes Technology today announces the partnership with the world-class tools vendors including Imperas, Lauterbach, Mentor, a Siemens Business, and UltraSoC (in alphabetical order) to bring their system-on-chip (SoC) development environments to Andes V5 processors and the RISC-V community.

Nov. 16, 2017 - Faraday Technology today introduced its M1+ standard cell library on UMC 28HPC process. This optimized M1+ library supports the essential multi-track cells (7T/9T/12T), multi-Vt cells (LVT/RVT/HVT), and Faraday low-power PowerSlash™ kit to build the best portfolio of power, performance, and area metrics ...

Nov. 25, 2017 - GUC today announced the achievement of highly coveted ISO 13485:2016 certification, which make GUC the first and only ASIC company to meet these demanding standards and will strengthen qualities of medical IC design and manufacturing services.

Oct. 16, 2017 - Open-Silicon, a system-optimized ASIC solutions provider, will be exhibiting at ARM TechCon 2017. The company will demonstrate its IoT Edge SoC Platform Solution, IoT Gateway SoC Reference Design and Comprehensive High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in TSMC 16nm FF+.

Sep. 25, 2017 - Synopsys today announced that the Synopsys Design Platform has been fully certified for use on Samsung Foundry's 28FDS (FD-SOI) process technology. A Process Design Kit (PDK) and a comprehensive reference flow, compatible with Synopsys' Lynx Design System, containing scripts, design methodologies and ...

Sep. 19, 2017 -

Sep. 19, 2017 - AFuzion and HDL Design House invite you to join the free October 4, 2017 webinar on DO-254 optimization techniques including DO-254 requirements, mistakes, best practices, and use of random verification and UVM methodology.

Sep. 12, 2017 -

Sep. 12, 2017 - Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully completed silicon validation of its High Bandwidth Memory (HBM2) IP subsystem in TSMC’s 16nm FinFET technology in combination with TSMC’s CoWoS® 2.5D silicon interposer technology and HBM2 memory.

Sep. 11, 2017 - Cadence today announced its collaboration with TSMC to advance 7nm FinFET Plus design innovation for mobile and high-performance computing (HPC) platforms.