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IP / SOC Products News

• Xiphera provides versatility and compact footprint with two new SHA-3 IP cores (Friday Oct. 28, 2022)
  Xiphera expands support for SHA-3 (Secure Hash Algorithm) by launching two new Intellectual Property (IP) cores: the resource-optimised compact version XIP3030C and the performance-optimised version XIP3030H.
  
  
• Vidatronic Releases FlexSIMO™ DC-DC Converter Technology for Highly Efficient Power Delivery in IoT, AR/VR, and Metaverse SoCs (Friday Oct. 28, 2022)
  Vidatronic’s latest single-inductor multiple-output, FlexSIMO™, DC-DC converter technology is optimized for providing power supplies for the next generation of processors and audio and wireless connectivity SoCs for Internet of Things (IoT) and wearable devices.
  
  
• Weebit Nano successfully qualifies its ReRAM module (Thursday Oct. 27, 2022)
  Weebit Nano Limited is pleased to announce it has successfully completed full technology qualification of its Resistive Random-Access Memory (ReRAM or RRAM) module manufactured by its R&D partner CEA-Leti.
  
  
• Flex Logix EFLX4K eFPGA IP Core on TSMC 7nm Technology Now Available (Wednesday Oct. 26, 2022)
  Flex Logix® Technologies, Inc., a leading innovator in AI inference IP and the leading supplier of eFPGA IP, today announced that it has completed porting and delivered the EFLX4K eFPGA IP core, both the Logic and DSP versions, on TSMC 7nm technology to its lead customer for integration into a production ASIC.
  
  
• GUC Unveils GLink 2.3LL, The World's Most Powerful D2D Interconnect IP Using 2.5D Technology (Wednesday Oct. 26, 2022)
  Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that GLink 2.3LL (GUC’s die-to-die Link) interface IP for TSMC CoWoS® and InFO chiplets integration platforms passed silicon validation and will be showcased at the TSMC 2022 Open Innovation Platform® (OIP) Ecosystem Forum in Santa Clara Convention Center on Oct 26, 2022.
  
  
• Alphawave IP Achieves Its First Testchip Tapeout for TSMC N3E Process (Tuesday Oct. 25, 2022)
  Alphawave IP (LSE: AWE), a global leader in high-speed connectivity for the world's technology infrastructure, today announced the successful tapeout of its ZeusCORE100® 1-112Gbps NRZ/PAM4 Serialiser-Deserialiser ("SerDes"), Alphawave's first testchip on TSMC's most advanced N3E process.
  
  
• Flex Logix Opens Up Licensing to its InferX AI Technology (Tuesday Oct. 25, 2022)
  Available in early 2023, device manufacturers and systems companies who design chips can now license Flex Logix’s InferX AI technology, enabling broader access to the company’s eFPGA and edge inference IP solutions.
  
  
• Rambus Delivers PCIe 6.0 Interface Subsystem for High-Performance Data Center and AI SoCs (Tuesday Oct. 25, 2022)
  Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced the availability of its PCI Express® (PCIe®) 6.0 Interface Subsystem comprised of PHY and controller IP. The Rambus PCIe Express 6.0 PHY also supports the latest version of the Compute Express Link™ (CXL™) specification, version 3.0.
  
  
• Synopsys Advances Designs on TSMC N3E Process with Production-Proven EDA Flows and Broadest IP Portfolio for AI, Mobile and HPC Applications (Monday Oct. 24, 2022)
  Building on a long-standing collaboration with TSMC to drive continued innovation on advanced process nodes, Synopsys, Inc. today announced several key achievements on the TSMC N3E process technology.
  
  
• Agile Analog fast tracks IoT design with macros for analog functions (Friday Oct. 21, 2022)
  Agile Analog™, the analog IP innovators, now has available a complete set of the key analog IP needed to fast track an IoT design. Arranged in six blocks, they wrap round the customer’s choice of processor core and memory to provide all the vital analog functions required to interface between the digital world of the processor and the analog real world.
  
  
• Arasan Partners with Testmetrix on its 4.5 GSPS C-PHY / D-PHY HDK and Compliance Test Platform (Tuesday Oct. 18, 2022)
  Arasan Chip Systems, a leading provider of semiconductor IP today announced that its MIPI DSI-2, CSI-2 and C-PHY / D-PHY Combo IP have been successfully implemented on the Testmetrix C/D-PHY HDK and Compliance Test Platform.
  
  
• Andes Announces the N25F-SE Processor, the World First RISC-V CPU IP with ISO 26262 Full Compliance (Monday Oct. 17, 2022)
  Andes Technology, a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and founding premier member of RISC-V International, today announces its safety-enhanced AndesCore® N25F-SE is the first RISC-V CPU IP certified to be fully compliant with ISO 26262 functional safety standards for the development of automotive applications.
  
  
• Brite Semiconductor Provides MIPI IP Total Solution (Friday Oct. 14, 2022)
  Brite Semiconductor today announced providing MIPI IP total solution for custom ASIC/SoC design service. This solution consists of a series of MIPI controller and PHY. It will help the System Manufacturer and IC companies to design high quality ASIC/SoC products while speeding up time to market.
  
  
• Weebit Nano advances its ReRAM selector development to fit embedded & discrete applications (Thursday Oct. 13, 2022)
  Weebit Nano, a leading developer of next-generation memory technologies for the global semiconductor industry, has made significant progress in its selector development with new results confirming its ReRAM selector is suitable for both embedded and discrete (stand-alone) applications
  
  
• Faraday Delivers SAFE™ IP Portfolio for Samsung Foundry 14LPP Process (Thursday Oct. 13, 2022)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that its 14LPP application-specific IPs have been listed on SAFE™ (Samsung Advanced Foundry Ecosystem) IP system.
  
  
• TCP/IP Hardware Stack IP Core now Available from CAST (Thursday Oct. 13, 2022)
  The new TCPIP-1G/10G Hardware Stack IP core implements a hardware stack for the TCP/IP protocol that transmits or receives data over Ethernet at speeds of 10/100/1000Mbps, 2.5Gbps, and 10Gbps.
  
  
• DCD-SEMI introduces multiprotocol combo: HDLC, UART, SPI... with bigger FIFO and... (Tuesday Oct. 11, 2022)
  The DEMSCC - Dual channel Multiprotocol Enhanced Serial Communication Controller, means a brave new world for well-known serial IP users. The new IP Core is available with AXI, AHB, APB wrappers enabling ultimate functionalities for all modern microcontrollers, both from DCD-SEMI and other vendors.
  
  
• Creonic Releases DVB-RCS2 Multi-carrier Satellite Receiver IP Core (Friday Oct. 07, 2022)
  Creonic GmbH, the market leader for satellite communication (SATCOM) IP cores, today announced the immediate availability of its multi-carrier DVB-RCS2 receiver, allowing to implement efficient satellite communication networks.
  
  
• SEMIFIVE Announces New 5nm HPC SoC Platform (Monday Oct. 03, 2022)
  Built on its in-house methodology used in its first two SoC Platforms (AI Inference Platform and AIoT Platform), SEMIFIVE’s latest HPC SoC Platform is designed and optimized on Samsung Foundry’s mass production proven 5nm FinFET technology.
  
  
• Vidatronic Unveils OmniPOWER™ Distributed Power Systems Available for Licensing in FinFET Technologies (Friday Sep. 30, 2022)
  New patent-pending OmniPOWER™ distributed regulator systems are optimized for providing power supplies (on die or to multiple dies/chiplets) for the next generation of high-performance processor cores, cache, and high-speed serial IO interfaces.
  
  
• easics launches nearbAI™ IP cores for XR devices that will set the standard for extreme edge AI performance and immersive experiences (Thursday Sep. 29, 2022)
  Battery-powered extended reality (XR) devices need to sense and analyze their environments within the response time of the human senses to provide instant visual and aural feedback towards the user. And do so with extremely low power consumption and with ultra-low latency.
  
  
• PUFsecurity's Crypto Coprocessor PUFcc is PSA Certified Level 2 Ready (Tuesday Sep. 27, 2022)
  PUFsecurity Corporation, a subsidiary of eMemory Inc., announced that its Crypto Coprocessor PUFcc had achieved PSA Certified Level 2 Ready. The test was executed by SGS Brightsight, an independent security evaluation laboratory approved by the PSA Certified program.
  
  
• SiFive and ProvenRun Collaborate to deliver Best-in-Class Security for RISC-V Microprocessors (Tuesday Sep. 27, 2022)
  ProvenRun, a global leader in embedded security, today announced the availability of its flagship secure OS / TEE product called ProvenCore, integrated with SiFive® WorldGuard technology, providing powerful SoC-level mechanism for software isolation.
  
  
• IPrium releases IEEE 802.11n/ac/ax LDPC Encoder and Decoder (Thursday Sep. 22, 2022)
  FPGA intellectual property (IP) provider IPrium LLC has today announced that it has expanded its family of LDPC Encoder and Decoder IP products with a new IEEE 802.11n/ac/ax WLAN WiFi LDPC Encoder and Decoder.
  
  
• CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs (Wednesday Sep. 21, 2022)
  CEVA, the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, today introduced PentaG-RAN™, the industry’s first 5G baseband platform IP for ASICs targeting cellular infrastructure in both base station and radio configurations, including distributed units (DU), and Remote Radio Units (RRU), from small cell to Massive Multiple-Input, Multiple Output (mMIMO).
  
  
• Agile Analog launches new Digital Standard Cell Library (Wednesday Sep. 21, 2022)
  Agile Analog™, the analog IP innovators, has launched its Digital Standard Cell Library (DSCL). It provides a comprehensive library of digital cells enabling designers to implement the digital circuits required to control analog blocks in mixed signal solutions.
  
  
• Redefining the global computing infrastructure with next-generation Arm Neoverse platforms (Thursday Sep. 15, 2022)
  Arm marks a new beginning for the world’s computing infrastructure with additions to its Arm Neoverse roadmap including Neoverse V2 (codenamed “Demeter”). Neoverse V2 is the latest Arm core targeted at providing leadership per-thread performance for cloud, hyperscale and HPC workloads
  
  
• VeriSilicon AI-ISP Delivers Innovative Image Quality Enhancement that Breaks the Limits of Computer Vision (Wednesday Sep. 14, 2022)
  VeriSilicon today announced the launch of AI-ISP, an innovative AI image enhancement technology for applications including smartphones, automotive electronics, and Industrial Internet of Things (IIoT), providing advanced image enhancement effects beyond traditional computer vision technologies.
  
  
• VeriSilicon Announces the One-Stop VeriHealth Chip Design Platform for Smart Healthcare Applications (Wednesday Sep. 14, 2022)
  VeriHealth provides customizable health monitoring solutions from chip design to software system and reference application development at a platform level.
  
  
• Global IP Core Announces the Availability of The WiMAX IEEE802.16e Modem and FEC IP Core For Licensing and Integration (Tuesday Sep. 13, 2022)
  The new WiMAX IEEE802.16e Modem and FEC IP Core is designed to be used along with an RF tuner, and ADC/ DAC converters. The system has internal state machine to control the operation, and can be externally configured through the SPI interface.