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IP / SOC Products News

• Xiphera Enhances the Performance of Its Portfolio with New Cryptographic IP Cores (Wednesday Nov. 01, 2023)
  Xiphera introduces Extreme-Speed Solutions in its cryptographic IP core portfolio, by launching two new extreme-speed IP cores, for AES-GCM and MACsec.
  
  
• Codasip delivers processor security to actively prevent the most common cyberattacks (Tuesday Oct. 31, 2023)
  Codasip, the leader in RISC-V Custom Compute, today announced the first commercial implementation of CHERI, the advanced security mechanism the semiconductor industry needs.
  
  
• Rambus Boosts AI Performance with 9.6 Gbps HBM3 Memory Controller IP (Thursday Oct. 26, 2023)
  Rambus today announced that the Rambus HBM3 Memory Controller IP now delivers up to 9.6 Gigabits per second (Gbps) performance supporting the continued evolution of the HBM3 standard.
  
  
• DVB-C2 LDPC/ BCH Decoder FEC IP Core From Global IP Core (Wednesday Oct. 25, 2023)
  In Digital video broadcasting for cable systems systems, a powerful FEC sub-system is needed. FEC is based on LDPC (Low-Density Parity Check) codes concatenated with BCH (Bose Chaudhuri Hocquenghem) codes, allowing Quasi Error Free operation close to the Shannon limit.
  
  
• Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference (Wednesday Oct. 25, 2023)
  Cadence Design Systems, Inc.(Nasdaq: CDNS) today expanded its industry-leading Tensilica® HiFi and Vision DSP families with the introduction of four new DSPs based on the recently announced Tensilica Xtensa® LX8 processor platform.
  
  
• Sofics releases its ESD technology on TSMC 3nm process (Tuesday Oct. 24, 2023)
  Sofics bv, a leading semiconductor integrated circuit IP provider announced that its TakeCharge® Electrostatic Discharge (ESD) solutions portfolio is now available for TSMC’s advanced 3nm process technology.
  
  
• Semidynamics launches first fully-coherent RISC-V Tensor unit to supercharge AI applications (Tuesday Oct. 24, 2023)
  Semidynamics has just announced a RISC-V Tensor Unit that is designed for ultra-fast AI solutions and is based on its fully customisable 64-bit cores.
  
  
• Socionext Begins Development of SoCs for Advanced ADAS and AD Using 3nm Automotive Process (Monday Oct. 23, 2023)
  Socionext, today announced it is developing custom SoCs for advanced ADAS (Advanced Driver Assistance Systems) and AD (Autonomous Driving) using N3A, TSMC's latest 3nm automotive process technology. Target production of the SoCs will be in 2026.
  
  
• Neurxcore Introduces Innovative NPU Product Line for AI Inference Applications, Powered by NVIDIA Deep Learning Accelerator Technology (Friday Oct. 20, 2023)
  Neurxcore, a leading provider of cutting-edge Artificial Intelligence (AI) solutions, today announced the launch of its groundbreaking Neural Processor Unit (NPU) product line for AI inference applications.
  
  
• Orthogone Technologies Unveils FPGA-Based Lightning-Fast PCIe DMA Controller Solution (Friday Oct. 20, 2023)
  Orthogone Technologies, a leader in FPGA and software engineering solutions, is proud to announce the release of its latest high-speed interconnect innovation: the Ultra-Low Latency (ULL) PCIe DMA Controller.
  
  
• Andes Technology Unveils Andes D23 and N225 Cores Pioneering the Next Generation of Compact, Performant, and Secure RISC-V Processor Technology (Wednesday Oct. 18, 2023)
  Andes Technology, the renowned supplier of high-efficiency, low-power 32/64-bit RISC-V processor cores and a Founding Premier member of RISC-V International, proudly announces the release of its latest innovation – the AndesCore™ D23 and N225 RISC-V processors.
  
  
• Codasip announces next-generation RISC-V processor family for Custom Compute (Tuesday Oct. 17, 2023)
  Codasip®, the leader in RISC-V Custom Compute, announced today a new highly configurable family of RISC-V baseline processors for unlimited innovation. The family, called the “700 family”, includes application and embedded cores.
  
  
• Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications (Tuesday Oct. 17, 2023)
  Combining FlexNoC and Ncore from Arteris with Fraunhofer IESE DRAMSys4.0 enables customers to improve performance, reduce cost and accelerate the advanced DRAM-centric SoC development schedules
  
  
• SiFive Announces Differentiated Solutions for Generative AI and ML Applications Leading RISC-V into a New Era of High-Performance Innovation (Thursday Oct. 12, 2023)
  SiFive’s Performance P870 and Intelligence X390 product debut sets new bar for high-performance compute in consumer, infrastructure, and automotive applications
  
  
• BrainChip Makes Second-Generation Akida Platform Available to Advance State of Edge AI Solutions (Tuesday Oct. 03, 2023)
  BrainChip today announced the Early Access availability of its second-generation Akida™ IP solution for use in a wide range of applications across the Smart Home, Smart City, Industrial and Automotive markets.
  
  
• Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect (Tuesday Oct. 03, 2023)
  There is an ever-increasing demand for more powerful chip designs for advanced applications, such as AI and ML, that require many cores on one chip. To facilitate this, Semidynamics and SignatureIP have partnered to integrate their respective IPs to provide a fully-tested RISC-V, multi-core environment and CHI interconnect for the development of state-of-the-art chip designs.
  
  
• M31 Announces Low-Power IP Solutions for TSMC's N12e Process (Thursday Sep. 28, 2023)
  M31 today announced that Jayanta, VP of Technical Marketing of M31 Technology, presented a speech on "Driving AIoT Innovation - M31 Low-Power IP" at the TSMC North America 2023 Open Innovation Platform® (OIP) Ecosystem Forum, showcasing M31's low-power silicon intelligence (IP) solution on TSMC's N12e process.
  
  
• Intrinsic ID Becomes World's First IP Vendor with PSA Certified Level 3 Root of Trust Component (Thursday Sep. 28, 2023)
  New solution from Intrinsic ID brings lab-validated security to connected devices in critical, high-performance Internet of Things (IoT) applications and enables compliance with US Cyber Trust Mark Program
  
  
• Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process (Wednesday Sep. 27, 2023)
  Comprehensive Multi-Die System Design Solution Supports 3Dblox 2.0 Standard and TSMC 3DFabric™ Technologies to Boost Productivity for Fast Heterogeneous Integration
  
  
• Chips&Media Announces the Release of "CMNP," the New Neural Processor IP (Wednesday Sep. 27, 2023)
  Chips&Media, Inc. today announced the release of "CMNP" (Chips&Media Neural Processor) for customers who want value-added image enhancement features in deep learning-based video processing.
  
  
• GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production (Wednesday Sep. 27, 2023)
  GlobalFoundries (GF) (Nasdaq: GFS) and Microchip Technology (Nasdaq: MCHP), via its Silicon Storage Technology (SST) subsidiary, today announces the immediate release to production of the SST ESF3 third-generation embedded SuperFlash non-volatile memory (NVM) solution in the GF 28SLPe foundry process.
  
  
• Synopsys Unveils Industry's Broadest Portfolio of Automotive-Grade IP on TSMC's N5A Process Technology (Tuesday Sep. 26, 2023)
  Today Synopsys, Inc. (Nasdaq: SNPS) announced the industry's broadest portfolio of automotive-grade Interface and Foundation IP for TSMC's N5A process.
  
  
• QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries™ 22FDX® Platform (Tuesday Sep. 26, 2023)
  QuickLogic today announced that it has been selected by a prominent technology company for an eFPGA IP targeting the GlobalFoundries™ (GF) 22FDX platform.
  
  
• Rambus MACsec-IP-361 is Certified ASIL-B Ready (Friday Sep. 22, 2023)
  We are pleased to announce that we have added another automotive-grade security IP solution to our portfolio. The Rambus MACsec-IP-361 has been certified ISO 26262 ASIL-B Ready by TÜV-SGS, making it an ideal solution to help our customers reduce development time and risk when designing a fully certified MACsec-capable SoC or ASIC.
  
  
• Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP (Thursday Sep. 21, 2023)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced it has expanded its design IP portfolio on TSMC’s 3nm (N3E) process—most notably with the addition of the flagship Cadence® 224G Long-Reach (224G-LR) SerDes PHY IP, which has achieved first-pass silicon success.
  
  
• AiM Future Introduces Next-Generation NeuroMosAIc Processors, Expands Partnerships (Wednesday Sep. 20, 2023)
  AiM Future, the pioneer in concurrent multimodal inference accelerators for edge and end-point devices, announced a new family of NeuroMosAIc Processors delivering sixty percent higher performance efficiency over the previous generation.
  
  
• Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator (Tuesday Sep. 19, 2023)
  Creonic GmbH, a leading provider of IP cores for communication systems, proudly introduces its DVB-S2X Multi-Carrier Demodulator IP core.
  
  
• Synopsys Demonstrates Industry's First Interoperability of PCI Express 6.0 IP with Intel's PCIe 6.0 Test Chip (Monday Sep. 18, 2023)
  Synopsys, Inc. today announced that its collaboration with Intel has achieved end-to-end 64 GT/s interoperability between Synopsys’ IP for PCI Express (PCIe) 6.0 and Intel’s PCIe 6.0-enabled test chip.
  
  
• Quadric Announces Llama2 LLM Support Immediately Available for Chimera GPNPUs (Monday Sep. 18, 2023)
  Quadric® today announced that support for the Llama 2 large language model (LLM) is immediately available on its ChimeraTM general purpose neural processing unit (GPNPU) intellectual property (IP) core.
  
  
• Flex Logix Announces Reconfigurable Block RAM with ECC Option (Monday Sep. 18, 2023)
  Flex Logix® Technologies, Inc., the leading supplier of eFPGA IP, announced today the availability of Reconfigurable Block RAM with ECC and Parity Options.