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IP / SOC Products News

• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design (Thursday Sep. 14, 2023)
  The new highly scalable Cadence® Neo™ Neural Processing Units (NPUs) deliver a wide range of AI performance in a low-energy footprint, bringing new levels of performance and efficiency to AI SoCs.
  
  
• Allegro DVT Launches a New Generation of High-Performance Multi-Format Video Encoder IP for 4K/8K Video Resolutions (Tuesday Sep. 12, 2023)
  Allegro DVT, a leading provider of video encoding semiconductor IP solutions, today announced the availability of its E300 series, a new generation of video encoder IPs built upon a higher performance architecture with support for resolutions from 4K60 up to 8K120.
  
  
• Tachyum Offers Its TPU Inference IP to Edge and Embedded Markets (Tuesday Sep. 12, 2023)
  Tachyum® today announced that it is expanding the unique value proposition of its Tachyum Prodigy by offering its Tachyum TPU® (Tachyum Processing Unit) intellectual property as a licensable core, allowing developers to take full advantage of intelligent, datacenter-trained AI when making IoT and Edge devices.
  
  
• CAST adds Ascon Lightweight Encryption Engine to Security IP Cores Line (Monday Sep. 11, 2023)
  The new ASCON-F Ascon Authenticated Encryption & Hashing Engine core provides a competitively small and fast hardware engine for the lightweight security functions detailed in the Ascon v1.2 specification. Its lean standard version supports Ascon-128 and -128a, the primary AEAD (authenticated encryption with associated data) cryptographic functions.
  
  
• NR-5G Polar Decoder and Encoder FEC IP Core Available For Licensing and Implementation from Global IP Core (Monday Sep. 11, 2023)
  The Forward Error Correction (FEC) sub-system is one of the essential basing blocks in any communication systems so a powerful FEC code is needed. The New Radio (NR) FEC for the control channel is proposed to be designed based on Polar codes allowing close to the Shannon limit/Capacity operation.
  
  
• Andes Announces General Availability of the New AndesCore™ RISC-V Multicore Vector Processor AX45MPV (Friday Sep. 08, 2023)
  The AX45MPV is the third generation of the award winning AndesCore™ vector processor series. Equipped with powerful RISC-V vector processing and parallel execution capability, it targets the applications with large volumes of data such as ADAS, AI inference and training, AR/VR, multimedia, robotics, and signal processing.
  
  
• Creonic Introduces NCR Processor IP Core for DVB-S2X/DVB-RCS2 Satellite Communication (Thursday Sep. 07, 2023)
  Creonic is proud to unveil its latest addition, the NCR Processor IP core. Designed to cater to the specialized needs of the satellite communication industry, this state-of-the-art IP core is set to facilitate clock synchronization and reference source solutions.
  
  
• Comcores now offers standalone Reed Solomon Forward Error Correction (RSFEC) IP cores (Thursday Sep. 07, 2023)
  Comcores has been developing high quality, first-time right IP cores and solutions for nearly a decade now and we understand that with increasing speed of data communication as well as volumes of data exchange, it is now even more critical to have data transmission that is error-free or error corrected, whether it is High-Speed PAM4 based Chip to Chip Protocol like Interlaken, JESD204D or Ethernet Protocols.
  
  
• CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market (Wednesday Sep. 06, 2023)
  Ultra-low power RivieraWaves Bluetooth 5.4 IP platform qualified for all features, including Periodic Advertising with Response (PAwR) required for ESL tags
  
  
• GUC Announced 5nm HBM3 PHY and Controller Silicon Proven at 8.4 Gbps (Wednesday Sep. 06, 2023)
  Global Unichip Corp. (GUC), the advanced ASIC leader, announced that they have silicon proved 8.4 Gbps HBM3 solution on TSMC’s 5nm process technology. The platform was demonstrated at the Partner Pavilion of the TSMC 2023 North America Technology Symposium.
  
  
• Codasip collaborates with Siemens to deliver trace solution for custom processors (Tuesday Sep. 05, 2023)
  Codasip® now offers the Tessent™ Enhanced Trace Encoder solution from the Tessent Embedded Analytics product line at Siemens EDA with its customizable RISC-V cores. Through the joint solution, developers can efficiently trace and debug issues between silicon and software, and accurately understand real-time behaviors of even the most complex customized designs based on Codasip RISC-V processors™.
  
  
• Nextera-Adeas ST 2110 IP cores are now available on Intel FPGAs (Friday Sep. 01, 2023)
  We are proud to announce that our industry-leading ST 2110/ST 2059/IPMX FPGA IP cores and NMOS control software are now available on Intel FPGAs!
  
  
• Allegro DVT Fosters Adoption of MPEG-5 LCEVC Video Codec, Releases a Full Range of LCEVC Products (Thursday Aug. 31, 2023)
  Allegro DVT, a leading provider of Video codec compliance streams and silicon video IP solutions has launched a complete range of MPEG-5 LCEVC products comprising LCEVC compliance streams and LCEVC hardware decoder and encoder video IPs (D301 and E301).
  
  
• QuickLogic Unveils Customizable eFPGA IP on GlobalFoundries' 12LP Process (Tuesday Aug. 29, 2023)
  QuickLogic , a developer of embedded FPGA (eFPGA) IP, ruggedized FPGAs and Endpoint AI/ML solutions, today announced a GlobalFoundries® 12nm LP eFPGA Core, created by QuickLogic's state-of-the-art Australis™ IP Generator tool. This
  
  
• Driving the Custom Silicon Revolution with Arm Neoverse Compute Subsystems (Tuesday Aug. 29, 2023)
  At Hot Chips today, we’re introducing Arm Neoverse Compute Subsystems (CSS). With CSS, Arm is enabling our ecosystem to build specialized silicon at lower cost, with less risk and a faster time-to-market compared to discrete IP.
  
  
• GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA (Tuesday Aug. 29, 2023)
  GOWIN Is Offering the Andes A25 RISC-V CPU IP and AE350 Subsystem As Instantiated Hard Cores in Its GW5AST-138 FPGA
  
  
• BrainChip Receives First Shipment of AKD1500 Chips in Silicon from Technology Partner GlobalFoundries (Monday Aug. 28, 2023)
  BrainChip, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, announced today that it has received its first shipment of AKD1500 chips in silicon from GlobalFoundries to advance the company’s IP into the next phase of development.
  
  
• Nuclei, the World's First RISC-V CPU IP Vendor, Accomplishes ISO 26262 ASIL-D Product Certificate (Monday Aug. 28, 2023)
  Nuclei System Technology, a leading RISC-V CPU IP vendor in China, announces that NA900 has been certified to be compliant with ASIL D requirements of ISO 26262 standards for both systematic fault and random hardware fault. NA900 becomes the world's first RISC-V CPU IP achieving ISO 26262 ASIL D product certificate.
  
  
• PQSecure announces IPs for NIST recommended PQC algorithms under FIPS (Thursday Aug. 24, 2023)
  PQSecure has successfully developed highly efficient hardware and software IPs for NIST recommended PQC algorithms under FIPS. These algorithms are all considered to be secure against attack by a quantum computer, and they are expected to be interoperable with existing communications protocols and networks.
  
  
• Rambus Safeguards Accelerated Computing with FPGA-targeted Security IP (Wednesday Aug. 23, 2023)
  Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today announced a full suite of Security IP solutions for the FPGA market with state-of-the-art cryptographic, side-channel, and Quantum Safe protections.
  
  
• Dream Chip Technologies tapes out a 10-TOPS SoC in 22nm with a novel AI Accelerator and an Automotive Functional Safety Processor (Friday Aug. 18, 2023)
  The main blocks on the SoC are two AI accelerators with 10 TOPS aggregated performance, two Dream Chip Realtime Pixel Processor (RPP) high-performance automotive Image Signal Processors (ISPs), an ARM Cortex-R52 based functional safety processor (Alcatraz), a dual-core ARM Cortex-A65 processor cluster, and an Arteris FlexNoC Network-on-Chip.
  
  
• Faraday Announces Infineon's SONOS eFlash is Fully Qualified on UMC's 40ULP Process (Thursday Aug. 17, 2023)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the successful qualification of Faraday’s Ariel™ IoT SoC with UMC’s 40nm ultra-low-power (40ULP) process.
  
  
• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family (Monday Aug. 07, 2023)
  NeuPro-M delivers an industry leading 350 TOPS/Watt to bring the power of Generative AI to infrastructure, industrial, automotive, PC, consumer, and mobile markets with exceptional cost and power efficiency
  
  
• DVB-C Demodulator IP Core Available For Immediate Implementation From Global IP Core (Monday Aug. 07, 2023)
  The demodulator is designed to be used together with a cable tuner and an analog to digital converter (ADC). The system has an internal state machine to control the operation, which can be externally configured via the SPI interface.
  
  
• Certifiably Secure - Xiphera Announces a First Batch of CAVP Validated IP Cores (Thursday Aug. 03, 2023)
  Xiphera has finished a CAVP validation process of the National Institute of Standards and Technology (NIST) for eight IP cores. The CAVP validations reinforce the trustworthiness and credibility of Xiphera’s cryptographic security products and solutions and open new possibilities on the global market for the company.
  
  
• Arasan announces its CAN-XL IP with seamlessly integrated CANsec Accelerator IP (Thursday Aug. 03, 2023)
  Arasan now offers its CAN XL IP seamlessly combined with the CANsec Acceleration IP, delivering hardware acceleration for secure CAN Bus transactions. This addition completes our CAN IP Portfolio, alongside CAN FD, CAN 2.0, and TT-CAN, solidifying our decade-long commitment to providing CAN IP cores.
  
  
• Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform (Thursday Aug. 03, 2023)
  8th generation of the industry-leading Tensilica Xtensa LX platform offers significant system-level performance enhancements while delivering optimal power efficiency
  
  
• Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers (Wednesday Aug. 02, 2023)
  Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced a partnership with Winbond to deliver an IP controller targeting automotive, smart IoT, industrial, wearables, true wireless stereo (TWS), wireless headsets, smart speakers and connectivity applications.
  
  
• LeapMind's Ultra Low-Power AI accelerator IP "Efficiera" Achieved industry-leading power efficiency of 107.8 TOPS/W (Tuesday Aug. 01, 2023)
  
  
  
• Weebit Nano qualifies its ReRAM module for automotive grade temperature (Tuesday Aug. 01, 2023)
  Weebit Nano Ltd (ASX:WBT, Weebit or Company), a leading developer of advanced memory technologies for the global semiconductor industry, has fully qualified its Resistive Random-Access Memory (ReRAM) module up to 125 degrees Celsius, the temperature specified for automotive grade 1 Non-Volatile Memories (NVMs).