Semiconductor IP: Bluetooth IP/ Good Die

Bluetooth IP/ Good Die

Item #2131

	Posted	Jun. 30, 2023

	# of Offers	4

	Status

		(mail this request to a colleague)

Customer assumes all responsibility for listing this item.

Request Description

Functionality

The Bluetooth IP needs to interface with our AMS SoC that is a Front-End to some MEMS sensors. Very competitive low power consumption is a requirement since the system would be battery powered. The IP must have sub-uA standby/sleep current and 6 to 10 dBm of Tx power.

External compatibility and integration requirements

We are on GF 130nm. If the IP is on a different node, what are the different ways in which we can integrate? Do you have good dies that we can purchase to do a package level integration? Volume will be 1-2 million pieces at first production.

Availability Timing

We are in India Time Zone.

Support requirement

We would require the vendor's support for IP/ die integration as we don't have an internal RF team.

Quality requirement

Automotive Grade 1 required.

Business Scheme Requirement

Licensing of IP/ Purchase of Good Dies.

Customer Profile

Position of the person having emitted the request		Business/Corporate Management

Corporation Profile
	End Product	Automotive/Transportation
	Gross Annual Dollar Sales	--
	Size of his organization at this location
	Size of his organization in entire company	6 - 19
	Location	Bengaluru, Karnataka, India

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