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Thursday, August 14, 2025

• Siemens, Arm and Southampton Uni announce Cre8Ventures Education Program
• Oxford Ionics delivers quantum computer to UK NQCC
• TSMC Board of Directors Meeting Resolutions
• EnSilica Establishes New EU Mixed-Signal Design Centre in Budapest, Hungary
• Brite Semiconductor Releases PCIe 4.0 PHY IP
• Perceptia Completes Silicon Characterisation of pPLL03 for GF 22FDX - Report Now Available

Wednesday, August 13, 2025

• Can Huawei's open-sourced CANN toolkit break the CUDA monopoly?
• TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
• Samsung boosts HBM specialist hiring, scales back foundry recruitment
• Wave Photonics launches its PDK Management Platform with CORNERSTONE as the first user
• Cadence Accelerates Development of Billion-Gate AI Designs with Innovative Power Analysis Technology Built on NVIDIA
• Arm Neural Technology Delivers Smarter, Sharper, More Efficient Mobile Graphics for Developers

Tuesday, August 12, 2025

• NVIDIA latest: Blackwell GPU and software updates
• Ceva, Inc. Announces Second Quarter 2025 Financial Results
• Dnotitia Launches the World's First MCP-Based AI Agent Workstation with Integrated Vector Database

Monday, August 11, 2025

• AIoT 2.0 brings smarter voice and visual features to connected devices
• Eseye: Why the true cost of IoT connectivity is often hidden
• GlobalFoundries Expands Partnership with Apple to Advance Wireless Connectivity and Power Management, Reinforcing U.S. Chip Manufacturing Leadership
• Open Compute Project Enables Silicon Diversity in AI Clusters

Saturday, August 9, 2025

• Linus Torvalds Rejects RISC-V Changes For Linux 6.17: "Garbage"

Friday, August 8, 2025

• UCIe 3.0 Doubles Data Rate For 2D Chiplets
• Aion Silicon Successfully Completes ISO 9001 and ISO/IEC 27001 Surveillance Audit, Strengthening Commitment to Quality and Security
• ALi Corporation and Ceva Announce Strategic Collaboration to Bring Scalable Edge AI to Next-Gen Video Platforms
• Cyient Semiconductors Enters Strategic Channel Partnership with GlobalFoundries

Thursday, August 7, 2025

• Silicon Labs Secures Industry First with PSA Level 4 Certification for SiXG301 SoC
• Teledyne e2v Unveils 16GB Radiation-Tolerant DDR4 Engineering Models for Space Applications
• NVIDIA on RVA23: "We Wouldn't Have Considered Porting CUDA to RISC-V Without It"
• CFX Achieves Major Breakthrough in 40nm SONOS Embedded eFlash IP
• ALi Corporation and Ceva Announce Strategic Collaboration to Bring Scalable Edge AI to Next-Gen Video Platforms
• Arasan Announces the industries first MIPI SWI3S Manager IP and Peripheral Controller IP

Wednesday, August 6, 2025

• GlobalFoundries Partners with Chinese Foundry for Localized Automotive-Grade CMOS Production
• Bosch Propels Advanced ADAS Forward With Pair of Radar SoCs
• Intel 18A yields remain critically low at just 10 per cent, according to reports
• BrainChip launches Akida Cloud for instant access to latest Akida neuromorphic technology
• Ceva's 20 Billion Device Milestone Paves the Way for a New Era in Smart Edge Innovation
• Qualitas Semiconductor Signs Licensing Agreement with Chinese SoC Company for DSI-2 Controller and MIPI PHY IP

Tuesday, August 5, 2025

• Enabling Space-Grade AI/ML with RISC-V: A Fully European Stack for Autonomous Missions
• 7 Critical Components of the Car of Tomorrow
• GlobalFoundries Reports Second Quarter 2025 Financial Results
• Chiplets Are The New Baseline for AI Inference Chips
• China Unyielding Ascent in RISC-V
• PCI-SIG® Announces PCI Express® 8.0 Specification to Reach 256.0 GT/s
• UCIe 3.0 Spec Released with Big Speed Up for Chiplets
• Codasip looks to Silicon Creations' PLL to drive RISC-V Automotive Safety-Critical Core
• UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance and Enhanced Manageability
• Weebit Nano well-positioned to achieve 2025 commercial targets
• Arteris To Provide FlexGen Smart NoC IP In Next-Generation AMD AI Chiplet Designs

Monday, August 4, 2025

• Silicon Labs Extends IoT Security Leadership with World's First PSA Level 4 Certification
• Silvaco Completes Acquisition of Mixel Group, Inc. a Provider of Low-Power, High-Performance Mixed-Signal Connectivity IP Solutions
• Advanced GNSS IP Cores (RF + Digital + Software) for Enhanced Positioning, Navigation, & Tracking for Next-Gen Products