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Wednesday, July 16, 2025

• Siemens collaborates with SK keyfoundry to launch 130nm automotive power semiconductor Calibre PERC PDK
• InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration

Tuesday, July 15, 2025

• GUC Tapes Out Industry-Leading UCIe Face-Up IP for TSMC SoIC-X
• Synopsys Receives All Necessary Approvals for Proposed Acquisition of Ansys

Monday, July 14, 2025

• IPrium releases SOQPSK-TG Demodulator for Aerospace Telemetry
• Breakthrough in AR/VR SoC Innovation: Full Suite of Cutting-Edge Interface & Analog IP Cores Licensed by Tier-1 U.S. Customer

Friday, July 11, 2025

• RISC-V Solidifies Presence in China as Global Momentum Builds
• IC'Alps Joins GlobalFoundries GlobalSolutions™ Ecosystem to Accelerate ASIC Development
• JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance
• IC'Alps Joins GlobalFoundries GlobalSolutions™ Ecosystem to Accelerate ASIC Development
• Arasan Announces immediate availability of its Total IP for Embedded USB2 (eUSB2) with Controller and PHY
• First Tetrivis LTD Consumer Product is Finalist in IEEE Smart Lighting "Let's Make Light" Contest.

Thursday, July 10, 2025

• TSMC June 2025 Revenue Report
• Europe's first HPC ARM processor lands at TSMC
• Andes Technology's AutoOpTune™ Applies Genetic Algorithms to Accelerate RISC-V Software Optimization
• Lossless Data Compression Webinar: Choosing Algorithms and IP Core Accelerators
• Andes Technology Advances High-Performance RISC-V Strategy with U.S.-based Design Center: Condor Computing

Wednesday, July 9, 2025

• Ceva, Inc. Schedules Second Quarter 2025 Earnings Release and Conference Call
• From smarter sensing to safer driving: GlobalFoundries solutions driving ADAS innovation
• Japanese Semiconductor Manufacturer Races Toward 2nm, Backed by IBM
• Exclusive: Arm estimates a 14-fold increase in data center customers since 2021, company says
• 3 Acquisitions Show Heavy Investment in AI, IoT, and High-End Processors
• SiPearl finally tapes out Europe's supercomputer chip
• Cadence Introduces Industry-First LPDDR6/5X 14.4Gbps Memory IP to Power Next-Generation AI Infrastructure
• Custom ASIC Design for CGM, TPMS & SATCOM applications from T2M-IP

Tuesday, July 8, 2025

• Samsung's Q2 profit falls short as chip slump, tariffs take toll
• Keysight and Korea Automotive Technology Institute Team Up to Improve Vehicle-to-Everything Component Testing
• OpenAI scales security to protect IP from Chinese foreign espionage threats
• French Startup Combines Electronics, Photonics And Optics For AI
• GlobalFoundries to Acquire MIPS to Accelerate AI and Compute Capabilities
• PUFsecurity, a subsidiary of eMemory, Achieves NIST CAVP Certification for PQC Algorithms, Launches PUFpqc Architecture for Quantum-Resilient SoCs

Monday, July 7, 2025

• 160-core RISC V Board Is The M.2 CoProcessor You Didn't Know You Needed
• Samsung Targets 70% 2nm Yield in 6 Months to Win Big Clients
• Menta Licenses Menta Embedded FPGA Programmable IP To Renesas For Its ForgeFPGA Product Line

Friday, July 4, 2025

• Tech Note: Use this Flexible and Efficient AC’97 IP Core for Simple Audio Interfaces and Legacy System Upgrades
• Infineon to Start 300 mm GaN Wafer Production as TSMC Exits Market
• South Korean chipmakers accelerate facility investments amid booming AI demand
• Qt to buy IAR for $230m
• Synopsys, Cadence, and Siemens resume EDA supply to China
• Are open-source RISC-V CPUs a threat to ARM Holdings' business?
• TSMC to exit gallium nitride semiconductor business in two years
• Samsung delays 1.4nm node, doubles down on 2nm process enhancement