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Wednesday, June 17, 2026

• Chips&Media Signs Next-Gen 'AV2' Video IP Licensing Deal with North American Big Tech, Strengthening Global Standards Leadership
• MIPI Alliance Welcomes Sony Semiconductor Solutions as a Promoter Member
• Agile Analog collaborates with Xiphera for Post-Quantum Cryptography challenge

Tuesday, June 16, 2026

• Allegro DVT’s Pulsar Decoder IP adds support for AV2 video codec
• Quintauris and Nuclei Cooperate to Ensure Automotive Real-Time RISCV Readiness with RT-Europa

Monday, June 15, 2026

• TES offers new voltage buffer IPs with various driving capabilities for X-FAB’s XT018 technology
• TGE200: M33-Class Performance RISC-V MCU IP Core with Unified Software Ecosystem for Secure IoT Edge Computing, and Embedded Systems
• Keysight Joins Siemens Digital Industries Software Solution Partner Program as a Software and Technology Partner
• Samsung CEO Sees Foundry Profitability in 2028
• TSMC May 2026 Revenue Report
• SemiFive CEO Says Company Targets 200 Billion Won in Sales This Year
• ADTechnology Hires 50 Engineers in Largest Recruitment Drive
• SignOff Semiconductors Achieves ISO 9001:2015 Certification for Semiconductor Chip Design and Embedded Solutions
• Celera Semiconductor Acquires Portugal-Based SiliconGate, a Global Leader in Analog IC Design
• ICTK Selected to Lead 7 Billion-Won Security SoC Project
• GlobalFoundries and Qualinx demonstrate first European sovereign manufacturing flow for security‑critical semiconductors
• Arm delivers a step-change in mobile gaming with Neural Dawn, showcasing the first use of Arm Neural Technology and Unreal Engine MegaLights on mobile
• Dnotitia Releases DNA 3.0, an Enterprise-Ready AI Language Model Family
• RISC-V Targets Data Centers, Edge AI, Space
• Axelera AI and Andes Technology Partner to Power Next-Generation "Europa" AI Platform with High-Performance RISC-V AX65 Cores
• Imec advances III-V chiplet integration with RF silicon interposer
• The Chiplet Puzzle: Balancing Design Flexibility, Yield, and Packaging Risks in 2026 Read more at: https://www.bisinfotech.com/balancing-design-flexibility-yield-and-packaging-risks-in-2026/
• Strong AI Demand and Early Consumer Electronics Inventory Build Drive Top 10 Foundries to 3.7% QoQ Revenue Growth in 1Q26
• CEA‑Leti Advances European FD-SOI Innovation with GlobalFoundries’ Collaboration in the FAMES Pilot Line
• Samsung and Nvidia Partnership Upgrade: HBM4E, HBM5 and Autonomous Driving Chip Foundry Enter Substantial Discussions
• Analogue Insight Opens Early Customer Engagement for Low-Power 1–32 Gbps NRZ Transmitter and Receiver IP in GlobalFoundries 45SPCLO for Integrated Co-Packaged Optics

Thursday, June 11, 2026

• Chips Act 2.0 Puts Demand at Center of Europe’s Semiconductor Strategy
• Sunplus Monthly Consolidated Sales Report -May 2026
• BOS Semiconductors Appoints Dr. Dirk Reimer as Senior Vice President, Sales & Business Development EMEA
• VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
• GlobalFoundries and Qualinx demonstrate first European sovereign manufacturing flow for security‑critical semiconductors
• RISC-V Summit Europe 2026: Industry and Academia Unite in Bologna to Advance Open Hardware
• Siemens and Infineon leverage silicon carbide technology to advance electrical protection in data centers and factories
• Samsung Says Nvidia Partnership Extends Beyond HBM to Foundry Collaboration

Wednesday, June 10, 2026

• Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
• Chips&Media Licenses Its Latest-Generation Video CODEC IP to Ambarella, Strengthening Strategic Collaboration in Global Edge and Physical AI Markets

Tuesday, June 9, 2026

• INNOSILICON Unveils Full Suite of High-Speed UALink IP, Powering Next-Gen Token Factories with Enhanced Productivity
• NimbleAI: A European consortium advances next-generation edge AI technologies and strengthens technological sovereignty
• Avant Technology Partners with Jade Design Automation to Provide IP/SoC Register Management Solutions
• Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
• MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA

Monday, June 8, 2026

• Meet T2M at MWC Shanghai 24th – 26th Jun’26: Showcasing Next-Generation IP Cores
• EnSilica wins seven-year, $75m manufacturing and supply contract
• Viettel launches 2026 technology talent program
• Global Semiconductor Sales Increase 11% Month-to-Month in April
• The AI-driven semiconductor supercycle accelerates
• Intel Outfits New Xeon Processors, Networking, and GPUs for Agentic AI
• NVIDIA and TSMC push AI deeper into semiconductor fabs
• Chairman Chey Tae-won Meets TSMC Chairman C.C. Wei: "Strengthening Global AI Alliance"
• JEDEC® Releases New SiC Guidelines to Improve Reliability and Evaluation in Power Electronics
• Siemens Intros AI-Powered Library Characterizer to Speed IC Design
• Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA
• Rapidus Completes 150 Billion Yen Funding Round from Japan Government
• Intel CEO says TSMC a ‘partner’ in chip production
• Samsung’s 2nm Advance Draws on EDA Innovation from Cadence, Siemens, and Synopsys