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• Strong AI Demand and Early Consumer Electronics Inventory Build Drive Top 10 Foundries to 3.7% QoQ Revenue Growth in 1Q26 (Monday, June 15, 2026)
• CEA‑Leti Advances European FD-SOI Innovation with GlobalFoundries’ Collaboration in the FAMES Pilot Line (Monday, June 15, 2026)
• Samsung and Nvidia Partnership Upgrade: HBM4E, HBM5 and Autonomous Driving Chip Foundry Enter Substantial Discussions (Monday, June 15, 2026)
• Samsung Says Nvidia Partnership Extends Beyond HBM to Foundry Collaboration (Thursday, June 11, 2026)
• Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs (Wednesday, June 10, 2026)
• Rapidus Completes 150 Billion Yen Funding Round from Japan Government (Monday, June 8, 2026)
• Intel CEO says TSMC a ‘partner’ in chip production (Monday, June 8, 2026)
• Samsung’s 2nm Advance Draws on EDA Innovation from Cadence, Siemens, and Synopsys (Monday, June 8, 2026)
• Samsung Foundry Reportedly in Talks With Chinese Carmakers Like BYD for 2nm, 4nm Autonomous Driving SoCs (Thursday, June 4, 2026)
• NVIDIA and TSMC Bring AI Into Fabs to Advance Semiconductor Design and Manufacturing (Thursday, June 4, 2026)
• Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026 (Monday, June 1, 2026)
• Siemens and Samsung Foundry strengthen collaboration to advance silicon design enablement (Monday, June 1, 2026)
• AMD Announces Production Ramp of Next-Generation AMD EPYC Processor "Venice" on TSMC 2nm Process Technology (Monday, May 25, 2026)
• United Microelectronics: The Market Is No Longer Pricing It As A Sleepy Mature-Node Foundry (Monday, May 25, 2026)
• Intel Accelerates 1.4nm Foundry Push, Targets Mass Production in 2029 (Monday, May 25, 2026)
• Samsung Electronics Revises GaN Semiconductor Strategy, Shifts Focus to Foundry (Monday, May 25, 2026)
• GlobalFoundries advances long-term technology innovation through investment in Playground Global (Thursday, May 21, 2026)
• Fraunhofer IPMS, APECS and FMD: High-density chiplet systems realized at wafer level (Thursday, May 21, 2026)
• IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation (Monday, May 18, 2026)
• UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone Displays (Monday, May 18, 2026)
• Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing (Thursday, May 14, 2026)
• GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend at 2026 Investor Day (Monday, May 11, 2026)
• Sony Semiconductor Solutions and TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership (Monday, May 11, 2026)
• SEMI ESD Alliance 2026 Executive Outlook Explores How Agentic AI Will Change Chip Design and Verification (Thursday, May 7, 2026)
• GlobalFoundries accelerates adoption of co-packaged optics for advanced AI data centers with SCALE optical module solution (Thursday, May 7, 2026)
• Apple Considers Samsung and Intel Foundries to Reduce Reliance on TSMC (Thursday, May 7, 2026)
• TSMC pushes next-gen chip expansion while Samsung grapples with union (Thursday, May 7, 2026)
• TSMC SoIC roadmap targets 2029 chip stacking (Monday, May 4, 2026)
• TSMC Latest Roadmap: A12, A13 for 2029 Without High-NA EUV; A16 Volume Production Delayed to 2027 (Monday, April 27, 2026)
• Cadence Collaborates with TSMC to Accelerate Design of Next-Generation AI Silicon (Thursday, April 23, 2026)
• Siemens collaborates with TSMC to advance AI for semiconductor design (Thursday, April 23, 2026)
• Synopsys Partners with TSMC to Power Next-Generation AI Systems with Silicon Proven IP and Certified EDA Flows (Thursday, April 23, 2026)
• TSMC Debuts A13 Technology at 2026 North America Technology Symposium (Thursday, April 23, 2026)
• TSMC Tightens 2nm Grip While Samsung Foundry Targets the Alternative Demand (Monday, April 20, 2026)
• Three Foundry Companies and the "Everyone’s Challenge Fabless" Initiative… Full-Scale Support for Startups (Thursday, April 16, 2026)
• Rapidus Opens Analysis Center and Rapidus Chiplet Solutions (Monday, April 13, 2026)
• Japan's Rapidus ramps up 2nm chip plans while eyeing factories on the Moon (Thursday, April 9, 2026)
• Japan’s Rapidus Races TSMC and Samsung in 1nm Chip Foundry (Monday, April 6, 2026)
• QuickLogic Announces Contract for High Density eFPGA Hard IP Optimized for Intel 18A (Thursday, April 2, 2026)
• Silicon Photonics Race Intensifies as TSMC Targets 2026 COUPE Production, Samsung Eyes 2029 CPO Turnkey (Thursday, April 2, 2026)
• Samsung Electronics Launches Silicon Photonics Foundry Business (Thursday, April 2, 2026)
• CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line (Thursday, March 26, 2026)
• IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes (Monday, March 16, 2026)
• Samsung Applies 2nm Process to HBM Memory (Thursday, March 12, 2026)
• Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus (Monday, March 9, 2026)
• Rapidus to Make Chips for Canon, Synopsys on Trial (Monday, March 9, 2026)
• Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields (Monday, March 9, 2026)
• ASML announces breakthrough in EUV light source to boost chip output (Monday, March 2, 2026)
• Moon Photonics: moving towards large-scale quantum photonics (Thursday, February 26, 2026)
• Europe’s stealth leading-edge process technology (Thursday, February 26, 2026)