English
Search IP
Latest News
Today on Design-Reuse.com
Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation ... Read
Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced ...
FlexNoC 5 interconnect IP with physical awareness improves place and route efficiency and reduces interconnect area and power consumption. Read
The first such complete core is ideal for protected sensor/processor communication and joins CAST’s industry-leading set of ISO 26262 and other automotive ... Read
Partner Highlight
System Level Solutions Inc. (SLS) is revolutionizing high-speed data transfer with the world's first USB 20Gbps Device IP Core. Read
Grass Valley Adds JPEG XS Support to AMPP, Powered by intoPIX FastTicoXS Technology, Enhancing ...
intoPIX today announced that its innovative JPEG XS software technology now powers the support of JPEG XS VSF TR-07 within Grass Valley’s Agile Media ... Read
Kudelski IoT Launches Quantum-Resistant Security IP, Future-Proofing Semiconductors Against ...
New Quantum-Resistant Algorithms Integrated into KSE Security IP to Protect the Next Generation of Chips and Devices, Responding to Global Regulations Read
Industry Expert Blogs
Xiphera Blog Kimmo Jarvinen, Xiphera
QuickLogic Blog Brian Faith, Quicklogic
Alphawave Semi Blog Archana Cheruliyil, Alphawave Semi
QuickLogic Blog Brian Faith, Quicklogic
8.5GHz Fractional-N/SSC PLL on Samsung 4nm
Camera 3DNR IP
Compact, low-power, 8bit ADC on GF 22nm FDX
224G Ethernet PHY IP for TSMC N3P
ARINC 429 IP
PVT - Process, Voltage, and Temperature Monitor with Interrupt ...
40 mA LDO voltage regulator (3.3/5.0V to 1.8V) on TSMC 180nm ...
Flip-Chip compatible I/O Library in Dongbu HiTek 130nm with ...
Highly Accurate RC Oscillator on SMIC 180nm
DDR5 Temperature Sensor I3C / I2C
UniPro 1.6 Host/Device IP
60MHz Differential Line Driver - X-FAB 0.35um
WDT Verification IP
Simulation VIP for AMBA LTI
UCIe Verification IP
BoW Verification IP
MIPI C-PHY v1.2 D-PHY v2.1 RX 3 trios/4 Lanes in TSMC (16nm, ...
Industry Articles
-
Streamlining SoC Design with IDS-Integrate™
Agnisys
-
Last-Time Buy Notifications For Your ASICs? How To Make the Most of It
Enrique Martinez
EnSilica -
CANsec: Security for the Third Generation of the CAN Bus
CAST and Fraunhofer IPMS
-
Accelerating SoC Evolution With NoC Innovations Using NoC Tiling for AI and Machine Learning
Andy Nightingale
Arteris -
A new era for embedded memory
Eran Briman
Weebit Nano -
Electronic musical instruments design: what's inside counts
Kevin Kai-Wen Liu
Faraday Technology -
Casting a wide safety net through post processing Checking
Purushottham R
HCL Technologies -
Proven solutions for converting a chip specification into RTL and UVM
Nikita Gulliya
Agnisys
