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New Products

Chips&Media, Inc.
Specialized video processing NPU for SR, NR, Demosaic New!
IQonIC Works
MCU Platform for Industrial Applications
Wolley Inc.
CXL Controller IP
Movellus, Inc.
On-Die PDN Analyzer for Transistor-Level Visibility and Telemetry
Terminus Circuits Pvt Ltd.
10G Base T Ethernet PHY

Blogs

Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry's Transformation to Software-Defined Vehicles
Synopsys, Inc.
Synopsys, Inc.
Arm Zena CSS - Accelerating Chiplet-Based SoC Design for AI-Defined Vehicles
Cadence Design Systems, Inc.
Cadence Design Systems, Inc.
Introducing Agile Analog's New CEO
Agile Analog
Krishna Anne, CEO
Agile Analog
Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)
Synopsys, Inc.
Kamal Desai
Synopsys, Inc.
Inside A Car's Digital Brain: MCUs, the Engine Powering SDV Innovation
Wael Fakhreldin, End-Market Director of Automotive Processing
GlobalFoundries
What is the Right Metric to Understand 5G Processing Throughput? Well, it's not Peak Speed....
AccelerComm Limited
Barry Graham, Chief Marketing Officer
AccelerComm Limited
Enhancing Edge AI with the Newest Class of Processor: Tensilica NeuroEdge 130 AICP
Cadence Design Systems, Inc.
SriramK
Cadence Design Systems, Inc.
Synopsys Interconnect IPs Enabling Scalable Compute Clusters
Synopsys, Inc.
Neeraj Paliwal
Synopsys, Inc.
Rapid eFPGA Configurator
Rapid Silicon
Bhavin Shah, SVP of Engineering & Product
Rapid Silicon
Bringing Silicon Agility to Life with eFPGA and Intel's 18A Technology
QuickLogic Corp.
Brian Faith
QuickLogic Corp.
UCIe Full SI Analysis Flow with Compliance Check for Heterogeneous Integration
Cadence Design Systems, Inc.
Cadence Design Systems, Inc.
Alphawave Semi and Arm Accelerate Scalable Computing with CSA-Compliant Chiplets
Alphawave Semi
Shivi Arora, Director , ASIC IP Solutions, and Sue Hung Fung, Principal Product Marketing Manager,
Alphawave Semi

Articles

Transition Fixes in 3nm Multi-Voltage SoC Design
eInfochips, Inc.
Rahul Parmar and Mayursinh Vansadiya
eInfochips, Inc.
Breaking the Memory Bandwidth Boundary. GDDR7 IP Design Challenges & Solutions
Innosilicon Technology Ltd
Innosilicon Technology Ltd
Nine Compelling Reasons Why Menta eFPGA Is Essential for Achieving True Crypto Agility in Your ASIC or SoC
Menta
Menta
Menta
How to design secure SoCs, Part III: Secure Boot
KiviCore
Kivicore
KiviCore
Automating NoC Design to Tackle Rising SoC Complexity
Arteris IP
Andy Nightingale
Arteris IP
One Platform, Five Libraries: Certus Semiconductor's I/O IP Portfolio for Every Application on TSMC 22nm ULL/ULP Technologies
Certus Semiconductor
Certus Semiconductor
Fault Management and Design-for-Test Strategies in Network Chip Architectures
Choosing the Right RFIC Design Partner
asicNorth
AsicNorth
asicNorth
Boosting RISC-V SoC performance for AI and ML applications
Arteris IP
Andy Nightingale
Arteris IP
MIPI in FPGAs for mobile-influenced devices
Enabling the next generation of smart glasses
GlobalFoundries
Optimizing 16-Bit Unsigned Multipliers with Reversible Logic Gates for an Enhanced Performance
Asic Technology
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Today on Design And Reuse

bullet_arrow  Andes Technology Announces AndeSight™ IDE v5.4 to Streamline AI and Embedded Software Development on RISC-V - June 10, 2025

bullet_arrow  VeriSilicon's Ultra-Low Energy NPU Provides Over 40 TOPS for On-Device LLM Inference in Mobile Applications - June 10, 2025

bullet_arrow  IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability - June 10, 2025

bullet_arrow  Qualitas Semiconductor Successfully Develops UCIe v2.0-Compliant PHY IP, Enabling Up to 512Gbps Die-to-Die Connectivity - June 10, 2025

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bullet_arrow  Silicon Proven DisplayPort 1.4 Tx & Rx PHY IP Cores, Ready to license in 12/28/40/55nm - June 10, 2025

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RISC-V

bullet_arrow  Andes Technology Announces AndeSight™ IDE v5.4 to Streamline AI and Embedded Software Development on RISC-V - June 10, 2025

andes.com, Jun. 10, 2025 – ​​​​​​​Hsinchu, Taiwan – June 09, 2025 – Andes T

bullet_arrow  Metanoia Communications Selects Andes Technology RISC-V Processor to Boost 5G O-RAN Efficiency and Accelerate Development - June 2, 2025

The MT5824, powered by the AndesCore™ AX45MP, delivers the industry's smallest and most power-efficient 5G 4T4R O-RU platform.www.andestech.com,

bullet_arrow  SCI Semiconductor raises £2.5m to develop security-enhanced microcontroller based on CHERI - May 29, 2025

May. 29, 2025 – UK start-up SCI Semiconductor has raised £2.5m towards developing its security-enhanced microcontroller based on
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Design IP

bullet_arrow  VeriSilicon's Ultra-Low Energy NPU Provides Over 40 TOPS for On-Device LLM Inference in Mobile Applications - June 10, 2025

verisilicon.com, Jun. 10, 2025 – The energy-efficient architecture scales across AI-enabled devices, including AI phones and AI P

bullet_arrow  Qualitas Semiconductor Successfully Develops UCIe v2.0-Compliant PHY IP, Enabling Up to 512Gbps Die-to-Die Connectivity - June 10, 2025

Jun. 10, 2025 – SEOUL, South Korea – June 10, 2025  – QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referre

bullet_arrow  sureCore launches comprehensive suite of silicon services - June 10, 2025

Jun. 10, 2025 – Enabling robust, power-efficient design and faster time-to-market for next generation devices Sheffield, UK – J
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Audio / Video

bullet_arrow  IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability - June 10, 2025

www.intopix.com, Jun. 10, 2025 – Accelerate AV-over-IP transition with JPEG XS, IPMX, ST2110… and Software Orlando &ndash

bullet_arrow  IntoPIX And Nextera-Adeas Announce Latest IPMX Demo Design With JPEG XS On Compact FPGAs At Infocomm 2025 - June 6, 2025

Orlando, Jun. 06, 2025 – intoPIX, a pioneering provider of low-latency, lightweight AV-over-IP compression solutions, is thrilled

bullet_arrow  IntoPIX Showcases Smart Image Sensor Compression At AutoSens US 2025 - June 5, 2025

Jun. 05, 2025 – TicoRAW and JPEG XS technologies boost perception, reduce power, and accelerate data workflows Mont-Saint-Guibert, Be
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Business

bullet_arrow  Qualcomm To Acquire UK's Alphawave For US$2.4 Billion - June 9, 2025

www.businesstoday.com.my, Jun. 09, 2025 – Qualcomm Inc has agreed to acquire Alphawave IP Group plc, a London-listed semiconducto

bullet_arrow  €1.1bn plan for GF fab in Dresden – reports - June 6, 2025

eenewseurope.com, Jun. 06, 2025 – GlobalFoundries (GF) is reported to be spending €1.bn to double production at its chip fab

bullet_arrow  Dolphin Semiconductor Provides High-Efficiency DC-DC Converter in 40nm to XHSC for High-end Industrial Products Applications - June 4, 2025

Jun. 04, 2025 – Meylan, France – June 3rd, 2025 – Dolphin Semiconductor, a leading provider of semiconductor IP

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Chiplet / Multi-Die

bullet_arrow  Sarcina Technology advances photonic package design to address key data center challenges - June 9, 2025

Jun. 09, 2025 – Enabling a new era of high data rate, high bandwidth and low power interconnects Palo Alto, CA – June 4, 2025 &

bullet_arrow  Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes - June 5, 2025

Jun. 05, 2025, Jun. 05, 2025 – First UCIe Die-to-Die IP Subsystem on TSMC’s 2nm Process with CoWoS® Advanced Packaging

bullet_arrow  300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz - May 29, 2025

May. 29, 2025 – Flexible integration of digital, analog, RF-to-sub-THz CMOS and III/V chiplets on a single carrier paves the way for h
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Automotive

bullet_arrow  VeriSilicon's Scalable High-Performance GPGPU-AI Computing IPs Empower Automotive and Edge Server AI Solutions - June 9, 2025

Provide AI acceleration with high computing density, multi-chip scaling, and 3D-stacked memory integrationverisilicon.com, Jun. 09, 2025 &nd

bullet_arrow  IntoPIX Accelerates Automotive Innovation With TicoRAW & JPEG XS On Lattice Low Power FPGAs - June 9, 2025

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bullet_arrow  CAST Expands Functional Safety Line with Additional Certified IP Cores - June 5, 2025

Jun. 05, 2025, Jun. 05, 2025 – Certified design IP cores save automotive engineers substantial time and expense in developing Fun
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Design Platform

bullet_arrow  Keysight and Synopsys Deliver an AI-Powered RF Design Migration Flow for Transition from TSMC's N6RF+ to N4P Process Node - June 6, 2025

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bullet_arrow  Plug and Play Expands Semiconductor Ecosystem Program with New Synopsys Collaboration to Accelerate Chip Design Innovation - June 5, 2025

SUNNYVALE, Calif., Jun. 05, 2025 – Plug and Play, the world's largest innovation platform based in Silicon Valley, has announced

bullet_arrow  Using Design-to-Test Workflows and Managing the IP Lifecycle in Chiplet Designs - June 4, 2025

In his Chiplet Summit keynote, Nilesh Kamdar, General Manager at Keysight EDA, addresses chiplet test and lifecycle management.electronicdesign.com,&n
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Green Electronics

bullet_arrow  Project GENESIS minimizes ecological footprint in Europe's semiconductor industry - June 6, 2025

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bullet_arrow  Addressing e-waste with recyclable, healable circuit boards - June 3, 2025

A study by two Virginia Tech research teams potentially addresses the ever-growing e-waste problem facing the world through circuit boards made from r

bullet_arrow  How Cadence Is Powering Greener Semiconductor Innovation - May 30, 2025

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Embedded Processing

bullet_arrow  Automakers Can Launch AI-Defined Vehicles a Full Year Sooner - Powered by Arm Zena CSS - June 5, 2025

Jun. 05, 2025 –  By Dipti Vachani, SVP and GM of the Automotive Line of Business, Arm Bringing innovation to drivers faster is one

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Foundry

bullet_arrow  GlobalFoundries Announces $16B U.S. Investment to Reshore Essential Chip Manufacturing and Accelerate AI Growth - June 5, 2025

Jun. 05, 2025 – Backed by leading tech giants, the investment reinforces domestic semiconductor production and U.S.-based innovation i

bullet_arrow  Intel Foundry Direct Connect 2025 Expands Roadmap And Partnerships - June 5, 2025

forbes.com, Jun. 05, 2025 – At Intel’s annual Direct Connect conference, the company’s CEO and foundry leadership tea

bullet_arrow  TSMC Achieves 90% Yield in 2nm Memory Chip Production - June 5, 2025

.eteknix.com, Jun. 05, 2025 – TSMC’s development of its 2-nanometer process seems to be moving ahead smoothly. According to
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Internet of Things

bullet_arrow  What's making smart cities and homes even smarter? - June 2, 2025

Innovations in AI, AIoT, edge computing, and sensor fusion are driving the next generation of advances in smart cities and homes.www.electronicproduct
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Artificial Intelligence

bullet_arrow  Japan's Softbank will join hands with U.S. Intel to develop a new memory semiconductor that will be used for artificial intelligence (AI) - June 1, 2025

The Nihon Keizai Shimbun (Nikkei) reported on the 1st that the two companies are pushing to develop a new large-capacity memory that reduces power con
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