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IP / SOC Products Articles

• Traceability for Embedded Systems (Feb. 03, 2022)
  Traceability can seem an obscure and/or bureaucratic concept to most. It entails cross-checking requirements between a spreadsheet, specifications, and the implementation and verification, rinse and repeat. From a view in the trenches where real problems must be solved, it can be hard to understand how this exercise adds value.
  
  
• The Future of Embedded FPGAs - eFPGA: The Proof is in the Tape Out (Jan. 27, 2022)
  Embedded FPGA (eFPGA) is the next big market for semiconductor IP. It can be used on almost every kind of digital chip and has a significant software value add as well—much like the market for embedded processors.
  
  
• Ruggedizing Buck Converters For Space And Other High Radiation Environments (Jan. 20, 2022)
  In this article, we review the effect of radiation on passive and active electronic components and the technologies, processes and device techniques that make them radiation-tolerant or radiation-hard.
  
  
• Designing Cloud based Multimedia Solutions (Jan. 19, 2022)
  Custom IP integration along with other cloud services showcases better feasibility of using Open-Source codec, to use one’s transcoder instead of cloud media-converter for multimedia solutions. In this article, we will see how an Open-Source codec like AV1 is selected as a custom IP for encoding to integrate over the cloud as a service.
  
  
• Reinventing Traceability: Adding domain intelligence with Arteris Harmony Trace (Jan. 13, 2022)
  Harmony Trace is an enterprise level server-based application with a web-based UI that interfaces to your existing requirements, EDA tool, documentation, and support systems, creating a system-of-systems that allows complete visibility of requirements traceability through the entire SoC design flow and product life cycle.
  
  
• Solving Chip Security's Weakest Link (Jan. 13, 2022)
  With the invention of Physical Unclonable Functions (PUF), we can now create a unique, inborn, unclonable key at the hardware level. The natural follow-up question to this is, “but how do we protect this key?” It is like storing your key to secrets in a drawer, a surefire way to break the secure boundary and create vulnerabilities.
  
  
• Convey 4K & 8K over Gigabit Network, Cat5E cables and Wifi-6 (Jan. 06, 2022)
  Created and engineered by intoPIX, TicoXS FIP combines JPEG XS with an advanced Flawless Imaging Profile (FIP) to deliver more compression efficiency on any content guaranteeing the best AV over IP experience using ONE Gigabit Network infrastructure.
  
  
• System on Modules (SOM) and its end-to-end verification using Test Automation framework (Dec. 22, 2021)
  The goal of this article is to walk through what is SOM (system on module), which all are available most commonly SOM today in the market, and the benefits of uses.
  
  
• NVM on Advanced Nodes for Smartphone & HPC Platforms (Nov. 22, 2021)
  In the applications of high-performance computing and high-end smartphones, chip designers are chasing high-profit margins, and customers are looking for products with the best performance and security. These demands create a powerful driving force, pushing foundries to keep up with Moore’s Law and IP vendors to keep providing high-performance IPs
  
  
• Rapid Validation of Post-Silicon Devices Using Verification IP (Nov. 18, 2021)
  A well-repeated truism throughout the semiconductor industry is that chip design verification is complex and often takes up the largest portion of a design project’s schedule –– sometimes as much as 70% –– and an ongoing challenge facing verification engineers.
  
  
• Low Power Design in SoC Using Arm IP (Nov. 15, 2021)
  This paper discusses about the low power IP components from ARM can help one to realize the low power features in the SoC. It should be noted that this paper does not discuss about the low power concepts or design techniques. Rather, it focuses on the implementation approaches using ARM low power IP.
  
  
• Three ways of looking at a sigma-delta ADC device (Nov. 15, 2021)
  The growing availability of digital ICs like microcontrollers, microprocessors, and field-programmable gate arrays (FPGAs) allows developers to use complex digital processing techniques rather than analog signal conditioning. For this reason, analog-to-digital converters (ADCs) have become a widely-used component in mixed-signal circuits.
  
  
• Connecting the Digital World - The Path to 224 Gbps Serial Links (Nov. 08, 2021)
  This paper review of the challenges faced with scaling rates to 200 Gbps and the different modulation schemes needed to accomplish the feat.
  
  
• The Internet of Cars Is Paved With Silicon (Nov. 08, 2021)
  Technologists often overuse words such as “disruptive” and “revolutionary,” but the recent evolution of automobile design and manufacturing is undoubtedly both disruptive and revolutionary.
  
  
• Why Low Complexity Video Coding is Answer to UHD TV Success (Nov. 02, 2021)
  Ever since regular TV broadcasting began by the BBC from my home town London on 26th August 1936, the broadcast industry and the technology ecosystem around it has been continually striving to improve it and make it look better.
  
  
• An Unexpected IoT Problem: Not Enough Randomness (Oct. 28, 2021)
  A critical flaw in random number generators puts the security of billions of low-cost IoT devices at risk. This means a new approach for generating random numbers is needed, which can be found in extracting entropy from SRAM behaviour.
  
  
• Why 400G/800G and Beyond Ethernet for High-Performance Computing Systems (Oct. 12, 2021)
  Over the last decade, workflows on high-performance computing (HPC) systems have greatly diversified, often blending AI/ML processing with traditional HPC. In response, a wide variety of specialized HPC computer systems (cluster nodes) have been designed and used to address specific application and framework performance optimization.
  
  
• What makes JPEG XS technology different from other codecs? (Oct. 11, 2021)
  Antonin Descampe is co-founder of intoPIX and member of the JPEG committee since 2005. He will explain how the JPEG XS technology differs from other codecs & what are the advantages of JPEG XS compared to other existing codecs.
  
  
• Securing the IC Supply Chain - Integrating PUF-Based hardware security (Oct. 04, 2021)
  The semiconductor supply chain is vulnerable to hacks that threaten valuable intellectual property and the operation of electronic devices that we depend on. This article outlines how a combination of Physical Unclonable Function (PUF) + blockchain + smart contract technology can help safeguard the industry.
  
  
• Paving the way for the next generation of audio codec for True Wireless Stereo (TWS) applications - PART 5 : Cutting time to market in a safe and timely manner (Sep. 30, 2021)
  In this fifth and last part of Paving the way for the next generation audio codec for True Wireless Stereo (TWS) applications whitepaper, a hastened but safe and improved design flow by Dolphin Design will be discussed.
  
  
• Chiplet Strategy is Key to Addressing Compute Density Challenges (Sep. 30, 2021)
  Data center workloads are quickly evolving, demanding high compute density with varying mixes of compute, memory and IO capability. This is driving architectures that are moving away from a one-size-fits-all monolithic solution to disaggregated functions that can be independently scaled for specific applications.
  
  
• High Bit-Rate Controllers for MIPI CSI2 (Sep. 27, 2021)
  The imbalance between I/O speed and internal logic speed in integrated circuits has shifted in recent years in favor of the I/O. While in the past, the performance of integrated circuits was often limited by the I/O rate, today, in both ASICs and FPGAs, internal logic struggles to keep up with the I/O performance.
  
  
• How NoCs ace power management and functional safety in SoCs (Sep. 16, 2021)
  In a car, power usage may not be considered an important factor, but this may change as power-hungry smart electronics devices play a bigger role than ever in modern automobiles.
  
  
• How PUF-based RoT Can Solve IoT Security Issues (Sep. 13, 2021)
  The security issues surrounding the internet of things (IoT) devices range from tiny semiconductors to global supply chains.
  
  
• eNVM towards 40nm and beyond (Aug. 30, 2021)
  As the semiconductor industry is prominently marching into the nanometer era, fundamental elements face their physical limits significantly, such as electric field across gate dielectric layers, leakage from an ultra-short channel or steep doping profile, newly incorporated leakage/current models, etc.
  
  
• The Elements of Traceability (Aug. 02, 2021)
  Europe is an interesting place to observe complex systems’ development activity. It may not have hyperscalers or smartphone leaders, but on the world stage, it has one of the two dominant commercial aircraft manufacturers, an active space agency, several premium car brands and leading Tier 1s with supporting automotive semiconductor companies.
  
  
• TOPS: The Truth Behind a Deep Learning Lie (Jul. 01, 2021)
  AI companies generally home in on one criterion: more tera operations per second (TOPS). Unfortunately, when silicon manufacturers promote their TOPS metrics, they are not really providing accurate guidance. In most cases, the numbers being hyped aren’t real TOPS, but peak TOPS.
  
  
• The network-on-chip interconnect is the SoC (Jun. 24, 2021)
  Functions in an SoC communicating with each other through an interconnect architecture is not so different from a network.
  
  
• The Markets and Applications for eFPGA (Jun. 14, 2021)
  Andy Jaros of Flex Logix discusses how embedded FPGA has grown from a technology pushed into the market into something that satisfies multiple application sectors and how technical development, not yet ended, will be increasingly customer-driven.
  
  
• How eNVM Helps Power Controllers Be Smarter (Jun. 14, 2021)
  PMIC designers have learned that using eNVMs like OTP in their chips can be very beneficial. A simple state machine with OTP can store power sequences and parameters, which can help manage the power between ICs efficiently.