As many of you know, 3D technologies in the marketplace today have huge TSVs. For example, TSMC's 28nm technology has 6um diameter TSVs with 5um keep-out zone. Other manufacturers are offering similar TSV sizes too. When you start comparing these with on-chip feature sizes (28nm), you'll understand why I use the term "huge" to describe these TSVs. In contrast, fine-grain 3D technologies are defined as those having TSV pitches smaller than 500nm.
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