Grace Semiconductor Readies 0.15um+HV for Small Panel Applications

SHANGHAI, CHINA - Jan. 17, 2006 - Grace Semiconductor Manufacturing Corporation (Grace), announced their new achievement on the internal development of 0.15um+HV technology for small panel LCD Driver ICs, with various applications such as handheld devices. As a result of its lower power consumption and smaller die size, the 0.15um+HV process technology is well suited for high-resolution, one chip solutions, for small panel LCD driver ICs.  Grace, a leader in HV technology, is the only foundry, worldwide, that can provide product proven 0.15um+HV technology for TFT LCD Driver ICs.

“With the availability of 0.15 um +HV process, we have broadened our HV technology portfolio to service both large panel and small panel applications. Customers have engaged with Grace to design their driver chips with this new technology offering and expect that products should be available to the market as early as Q2/06. Besides 0.15um+HV readiness, we also plan to continue our development efforts in 0.13 um+HV in the near future. Currently, Grace has proven experience in mass production of 0.25 um and 0.18 um HV processes. ” Said Dr. Arthur Kuo, Grace’s Executive Vice President of Worldwide Sales and Marketing.

About Grace Semiconductor Manufacturing Corporation

Grace Semiconductor Manufacturing Corporation (Grace) is a pure IC wafer foundry that specializes in integrated circuit (IC) fabrication. Grace's mission is to become a leading foundry in China by supplying high quality and advanced process technology to domestic and global customers.

Grace is located in Zhangjiang Hi-Tech Park in Pudong, Shanghai, with a total land area of 240,000 square meters. Two fabs, based on 12-inch wafer specifications, have been constructed. Currently, Fab 1A (8") is in full production, having already attained a monthly capacity of 27,000 8-inch wafers at the end 2004. More information about Grace is available at www.gsmcthw.com.