English
Inapac gains funding, tips IP roadmap
Mark LaPedus, EE Times
(05/03/2006 9:46 PM EDT)
SAN JOSE, Calif. — Seeking to bring its intellectual-property (IP) chip business to the next level, Inapac Technology Inc. has outlined its product roadmap, obtained a new round of funding and named a new sales executive.
Inapac, a system-in-package (SiP) memory integrator, has secured $14 million in a fourth round of financing. This latest round was led by Third Point Ventures and included support from previous investors, according to the company, based here.
The IP chip company also announced that Karen Lamar has joined the management team as vice president of sales. Lamar was previously vice president of worldwide sales and marketing at Monolithic Systems Technology Inc. (Mosys).
(05/03/2006 9:46 PM EDT)
SAN JOSE, Calif. — Seeking to bring its intellectual-property (IP) chip business to the next level, Inapac Technology Inc. has outlined its product roadmap, obtained a new round of funding and named a new sales executive.
Inapac, a system-in-package (SiP) memory integrator, has secured $14 million in a fourth round of financing. This latest round was led by Third Point Ventures and included support from previous investors, according to the company, based here.
The IP chip company also announced that Karen Lamar has joined the management team as vice president of sales. Lamar was previously vice president of worldwide sales and marketing at Monolithic Systems Technology Inc. (Mosys).
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Chiplet interconnect pioneer Eliyan gains additional financial backing from AI chip ecosystem with strategic investment from VentureTech Alliance
- Tips to get funding for your IoT product idea
- Peraso Closes Oversubscribed $20 Million Equity Financing Led by Roadmap Innovation Fund
- Kilopass Receives $8 Million Funding to Expand Technology Roadmap
- Silicon Ventures tips plan to stem fabless VC drought
Breaking News
- Alphawave Semi Q4 2024 Trading and Business Update
- ST-GloFo fab plan shelved
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets