ByteTools' Low-Cost Catapult Probe Supports Tensilica's Processors
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, Calif. – March 27, 2007 – ByteTools and Tensilica, Inc. today announced that ByteTools' Catapult JTAG probes are available for Tensilica's Diamond Standard and Xtensa configurable processors. The high-performance, low-cost Catapult devices work out-of-the-box with Tensilica's software development tools, meaning that users need not install any additional software. Catapult probes interface to the standard XOCD 14-pin JTAG header, with Catapult EJ-1 offering an Ethernet host interface, and Catapult UJ-1 offering a USB host interface.
“We worked with Tensilica because their processor cores have become very popular in a wide variety of applications, ranging from networking and storage to consumer electronics and multimedia,” stated Nandini Rajan, CEO, ByteTools.
“ByteTools offers highly cost-effective probes for debugging, and we are happy to work with them as they support our mutual customers,” stated Steve Roddy, Tensilica's vice president of marketing.
Pricing and Availability
The Catapult EJ-1 and UJ-1 probes are available now directly from ByteTools and are priced at $495 and $395 respectively.
About ByteTools
ByteTools, Inc. is a provider of test and development productivity tools for hardware and software development that can be purchased direct or through OEMs, value-added resellers and distributors. We are proud users of our own products, some on a daily basis for our own development and testing. We also build customized products to meet specific requirements, either for hardware or software. For more information, see www.byte-tools.com.
About Tensilica
Tensilica offers the broadest line of controller, CPU and specialty DSP processors on the market today, in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. Tensilica's low-power, benchmark proven processors have been designed into high-volume products at industry leaders in the digital consumer, networking and telecommunications markets. All Tensilica processor cores are complete with a matching software development tool environment, portfolio of system simulation models, and hardware implementation tool support. For more information on Tensilica's patented approach to the creation of application-specific building blocks for SOC design, visit www.tensilica.com.
|
Related News
- Tensilica Adds Support for Low-Cost, Hardware-Based Simulations of Diamond Standard Processors
- TTP Controller IP in Altera's Low-Cost Cyclone FPGA Families for Aerospace Applications
- CEVA Selected for NXP's Ultra Low-Cost Cellular Solutions
- EtherCAT Real-Time Protocol IP Support Now Available on Altera's Low-Cost Cyclone III FPGAs
- Altera Ships Industry's First 65-nm Low-Cost FPGA
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |