Leica Geosystems selects Wipro-NewLogic to provide turnkey IC design & supply chain management services

Wipro-NewLogic successfully brings new IC design into production and provides on-time delivery of component ICs for market-leading laser measurement products

Lustenau, Austria -- December 10, 2007 -- Wipro-NewLogic, the European IC design and semiconductor IP (Intellectual Property) business of Wipro Technologies has been selected by Leica Geosystems AG, a leading provider of spatial information products, to provide turnkey IC supply services to support the launch of new laser measurement products.

Wipro Technologies is an independent design services provider working on complete product development including IC design services and IP (Intellectual property) for complex digital, mixed signal and RF IC developments.   Wipro-NewLogic is the European IC design and semiconductor IP group of Wipro Technologies. It supports semiconductor and system companies in the IC design services area and also offers semiconductor IP.  The team provides services from system-engineering, IC design and final layout through to test development, characterization and supply-chain management of packaged and tested components.

Wipro-NewLogic helped Leica Geosystems Precision Tools Division to develop a key ASIC used in Leica DISTO laser measurement products and is now supplying these ASICs directly to Leica Geosystems product manufacturing facility. Leica Geosystems strives to provide the highest possible product quality and reliability. Wipro-NewLogic was selected to supply the ASIC as its design expertise allowed Wipro-NewLogic to develop a very comprehensive test program to assist Leica Geosystems in meeting its quality goals.

“It was most important for us that the production started as scheduled and that the test works reliably and stably” stated Reto Metzler, Senior Design Engineer Electronics at Leica Geosystems. “Wipro-NewLogic managed to commence delivery of production components ahead of our demanding schedule and we are very pleased with the results.”

“We are delighted, that Leica Geosystems selected Wipro-NewLogic as their Turnkey ASIC Design services and Supply chain management Partner”, says Senthil Murugesan, Vice President and CEO at Wipro-NewLogic. “Leica Geosystems originated the use of lasers in distance measurement equipment and so it is a privilege to support Leica Geosystems in developing and manufacturing their outstanding products.”

Leica Geosystems – when it has to be right

With close to 200 years of pioneering solutions to measure the world, Leica Geosystems products and services are trusted by professionals worldwide to help them capture, analyze, and present spatial information. Leica Geosystems is best known for its broad array of products that capture accurately, model quickly, analyze easily, and visualize and present spatial information.

Those who use Leica Geosystems products every day trust them for their dependability, the value they deliver, and the superior customer support. Based in Heerbrugg, Switzerland, Leica Geosystems is a global company with tens of thousands of customers supported by more than 2,400 employees in 22 countries and hundreds of partners located in more than 120 countries around the world. Leica Geosystems is part of the Hexagon Group, Sweden.

About Wipro- NewLogic

Wipro-NewLogic is a leading semiconductor design services provider and supplier of IP cores for complex wireless and wireline applications; thanks to its expertise in complex transceivers, its CMOS RF and its design services capabilities, Wipro-NewLogic has become the partner of choice to design digital, RF and mixed signal CMOS SoCs (system-on-chip).

Wipro-NewLogic's IP portfolio includes Wireless LAN (IEEE 802.11), Bluetooth, Ultra WideBand (UWB) and FireWire (IEEE1394). The IP cores consist of software, digital signal processing & algorithms, silicon proven CMOS radios (RF) and mixed-signal blocks such as AFEs, ADC/DACs, PLLs.

Wipro-NewLogic's turnkey services cover the whole process of IC design, from feasibility studies to digital/analog/RF design, including the development of complete RF-plus-digital SoCs, engineering sample evaluation, test program development, device characterization, reliability testing, and management of the IC production supply chain including wafer sourcing, device packaging & test.