English
Video: Virage's McCranie says IP is alive and well
EE Times (06/10/2008 4:35 AM EDT)
At the Design Automation Conference (DAC) in Anaheim, Calif., Mark LaPedus, semiconductor editor from EE Times, caught up with Daniel McCranie, president, chief executive and chairman of Virage Logic Corp. In a video, McCranie talks about the outlook, challenges and trends in intellectual property (IP).
At the Design Automation Conference (DAC) in Anaheim, Calif., Mark LaPedus, semiconductor editor from EE Times, caught up with Daniel McCranie, president, chief executive and chairman of Virage Logic Corp. In a video, McCranie talks about the outlook, challenges and trends in intellectual property (IP).
|
||||||
Related News
- Russian SoC Leader MRI Progress Licenses Virage Logic's ARC(R) Video 401V Subsystem for Digital TV Applications
- ViXS Systems Selects Virage Logic's High-Performance Intelli(TM)DDR 2/3 Memory Interface IP Solution for Video Processing Systems
- Movidia Selects Virage Logic's Intelli(TM) LPDDR Interface IP Solution to Meet Stringent Mobile Video Application Requirements
- China's EDA startup X-Epic forced to lay off staff, says report
- China and US Bolster Semiconductor Independence as Taiwan's Foundry Capacity Share Projected to Decline to 41% by 2027, Says TrendForce
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
|
E-mail This Article | 
|
|
Printer-Friendly Page |