Sunplus Technology Picks Cadence Transaction-Level Modeling Flow for Next-Gen Multimedia ICs
Multimedia IC Design Company Speeds Design and Verification Time by Moving to Higher-Abstraction Design
SAN JOSE, CA -- Aug 08, 2011 -- Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Sunplus Technology Co., Ltd. (taiex:2401) UK:SUPD 0.00% , a leading multimedia IC design company, adopted the Cadence(R) transaction-level modeling (TLM) flow with Cadence C-to-Silicon Compiler for its next-generation multimedia system-on-chip (SoC) design. The Cadence TLM approach and technology help Sunplus boost design team productivity and control development costs while ensuring high-quality chips for their TV, set-top box, and DVD offerings.
By deploying transaction-level modeling with Cadence C-to-Silicon Compiler, which delivers high-level synthesis, Sunplus engineers can design and verify their chips at a higher level of abstraction. This enables them to explore more architectural options and more quickly re-target IP to satisfy various performance, power consumption, and cost needs.
"In order to accelerate system development time, we decided to adopt the Cadence C-to-Silicon Compiler for our next product because it can generate the best quality of results," said Cheng-Yuh Wu, director of DVD IC Design Division I at Sunplus. "In addition, C-to-Silicon Compiler, as part of a TLM flow, helps our engineering teams optimize their designs early in the design cycle, including power characteristics. Perhaps most important, we can use a more abstract language -- SystemC -- than traditional Verilog/VHDL to do our design. This translates into shorter development time for complex designs, with higher IP reuse for subsequent end products."
As a key element of the Cadence system realization offerings, the TLM flow provides a connected path from system development down to silicon realization. This TLM-driven flow is scalable, greatly improving verification productivity and enabling more IP re-use, saving time and costs. Additionally, the open flow is standards-based, with Cadence C-to-Silicon Compiler reading in designs described in the IEEE1666(TM) SystemC standard.
"TLM design and verification continues to grow in importance and industry use as time-to-market pressures mount in the highly competitive consumer electronics markets," said Jack Erickson, director, product marketing, System Realization at Cadence. "The Cadence TLM flow with the C-to-Silicon Compiler is currently helping many leading semiconductor and system companies, including Sunplus, tackle the challenges of today's complex system designs. This open, connected, and scalable approach to system realization delivers significantly faster turnaround time for the development and re-use of complex designs -- and delivers on the EDA360 vision."
The selection of the Cadence TLM flow over other vendors' point products is the latest in a series of Sunplus Technology working closely with Cadence to deliver innovative complex products.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com .
|
Cadence Design Systems, Inc. Hot IP
Cadence Design Systems, Inc. Hot Verification IP
Related News
- Konica Minolta Accelerates Hardware Debugging with EVE's ZEMI-3 Transaction-Level Modeling Methodology
- Virtutech Announces Simics Full-System Checkpointing for SystemC Based Transaction-Level Modeling
- Cadence Speeds Systems Development with Automated Transaction-Level Verification
- Open SystemC Initiative Announces Proposal for Significant Extensions to Transaction-Level Modeling (TLM) Standard
- Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |