DSP Group Announces Availability of Its First XpandR III Reference Design for Connected Multimedia Terminals
Facilitates Home-Phone Makeover With HD Video, Multimedia Streaming, and Integrated Wi-Fi and DECT/CAT-iq Connectivity to Create a Superior User Experience
SAN JOSE, Calif., Sep 1, 2011 -- DSP Group(R), Inc. DSPG -0.61% , a leading global provider of wireless chipset solutions for converged communications at home, announced today the availability of the first in a series of connected multimedia terminal reference designs based on the XpandR(R) III system on a chip (SoC). XpandR III is DSP Group's state-of-the-art multimedia chipset solution supporting High Definition voice with DECT/CAT-iq 2.0, High Definition video communication with Wi-Fi 11n, powerful graphic and security and more. In addition to accelerating time to market and reducing development and BOM costs, the initial reference design enables OEMs to add smartphone functionality to advanced cordless phones, video phones, and diverse connected multimedia terminals to create a superior home phone user experience.
XpandR III includes several integrated functions, including Wi-Fi and DECT/CAT-iq connectivity, high-definition (HD) video decoding and encoding, and 2D/3D graphics processing. Such functionality, along with the chipset solution's integrated USB2.0, LCD controller and camera interface peripheral modules, enable cost-effective development of a range of converged communications products. DSP Group's connected multimedia terminal reference design also comes with a comprehensive Android 2.3-integrated software development kit (SDK). By making fixed-line telephony and broadband/VoIP connectivity available to the traditional home phone, the reference design opens the door to a wide array of new services and opportunities for application developers, services providers and consumers.
Delivering an outstanding home phone user experience, the reference design includes a 3.7" LCD display and touch-screen panel, and supports HD voice quality. In addition, it enables users to automatically synchronize home phone contact lists with a mobile device, and to remotely activate call forwarding, listen to voice messages, and receive email notifications of missed calls.
The reference design drives a host of cutting-edge applications including HD video communications, playback and streaming, advanced telephony, multimedia streaming, gaming, electronic program guides (EPGs), advanced remote control, home security and surveillance, and baby monitoring.
In addition to the initial reference design, DSP Group provides other connected multimedia terminal reference designs, based on XpandR III, for media phones, tablet phones and a host of other multimedia devices.
DSP Group will be demonstrating its initial connected multimedia terminal reference design at the IFA consumer electronics and home appliance global trade show in Hall 7.2A, Room 105, at the Messe Berlin in Berlin, Germany, on September 2-7, 2011.
About DSP Group
DSP Group, Inc. DSPG -0.61% is a leading global provider of wireless chipset solutions for converged communications at home. Delivering system solutions that combine semiconductors and software with reference designs, DSP Group enables consumer electronics (CE) manufacturers to cost-effectively develop new revenue-generating applications with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, and with a growing share of the wireless home telephony market, DSP Group provides a broad portfolio of wireless chipsets integrating DECT, Wi-Fi, PSTN and VoIP technologies with state-of-the-art application processors. Enabling converged voice, audio, video and data connectivity across diverse consumer products -- from cordless and VoIP phones to home gateways and connected multimedia screens -- DSP Group proactively partners with CE manufacturers to shape the future of converged communications at home. For more information, visit www.dspg.com .
|
Related News
- DSP Group Releases Groundbreaking XpandR III Wireless Multimedia Chip
- XpandR - a Wireless Multimedia System-on-Chip Platform to Be Launched by DSP Group
- Brite Semiconductor Brings Audio/Voice DSP Reference Design Platform to Low-Power "Smart and Connected" Devices
- GDA Technologies Announces Availability of Advanced Mezzanine Reference Platform for Freescale's High-Performance MPC8548E PowerQUICC(TM) III Processor
- SkyWater Announces Availability of Cadence Open-Source PDK and Reference Design for SkyWater's 130 nm Process
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |