Triad Semiconductor Hire Announcement: Bill Pratt, VP of Engineering
September 2, 2011 -- Eighteen-year veteran of the fabless semiconductor industry and employee number eleven at RF Micro Devices, Bill Pratt is now overseeing Triad’s engineering organization.
At Triad, Mr. Pratt will be responsible for overseeing and directing the rapidly growing engineering team tasked with creating mixed signal via configurable array (VCA) technology. Triad’s VCA solutions are developed by a veteran team of IC designers that have been handpicked from across the semiconductor industry. This engineering team, led by Mr. Pratt, is delivering semiconductor solutions that range from precision ITAR defense programs to high volume consumer applications.
After graduating from the Georgia Institute of Technology with a Bachelor of Science degree in Electrical Engineering in 1992, Mr. Pratt cut his teeth in the early days of RF Micro Devices (RFMD) as an RFIC designer. He was directly involved with the design of LNA’s, mixers, quadrature modulators, quadrature demodulators, automatic gain control (AGC) amplifiers, and driver amplifiers. Over the years, as RFMD grew from eleven people to over 4,000 employees, Pratt took on an ever-increasing set of responsibilities within an engineering organization of hundreds of engineers. He led teams and departments in developing wireless products that shipped in the hundreds of millions. Mr. Pratt brings a wealth of engineering and semiconductor experience to Triad with semiconductor process know-how spanning GaAs HBT, SiGe, BiCMOS and CMOS-only processes. “We are excited about the impact Billy has already made here at Triad and we are confident that he is the right man to oversee the continual engineering growth needed to support the tremendous demand for Triad’s VCA technology in the marketplace” said Lynn Hayden, President and CEO of Triad.
About Triad Semiconductor, Inc.
Triad Semiconductor, Inc., a privately held fabless semiconductor company with headquarters in Winston-Salem, North Carolina, develops, prototypes and produces mixed-signal ASICs. The company’s groundbreaking via-configurable array (VCA) technology delivers ASICs with silicon-proven analog and digital functions more quickly and at lower cost than traditional full-custom approaches. Triad’s single-mask, via-only routing cuts engineering effort and fabrication time, resulting in fast-turn prototypes and allowing design changes to be made at minimal cost. For more information, please visit http://www.triadsemi.com or call (336) 774-2150.
|
Related News
- EdgeCortix Expands Leadership Team with Semiconductor Industry Veteran Tim Vehling as Executive Vice President of Global Sales
- EdgeCortix Expands Leadership Team by Appointing Jeffry A. Milrod as Vice President of Product Engineering
- Veriest Solutions Promotes Dusica Glisic to Vice President of Frontend Engineering
- Quadric Appoints Former Cadence VP Dhanendra Jani as New VP of Engineering
- Logic Fruit appoints Vijay Pal Sharma as VP - Engineering
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |