Rambus and Fujitsu Semiconductor Sign Patent License Agreement
Six-year agreement covers a broad range of integrated circuit products
SUNNYVALE, Calif.-- September 27, 2012 -- Rambus Inc. (NASDAQ:RMBS), one of the world's premier technology licensing companies, announced today it has signed a patent license agreement with Fujitsu Semiconductor Limited. This six-year agreement covers the use of Rambus patented innovations implemented in a broad range of integrated circuit (IC) products offered by Fujitsu Semiconductor. Financial terms of the agreement are confidential.
"As a global leader in the semiconductor market, Fujitsu Semiconductor is an important customer and this agreement validates the continued strength of our portfolio," said Dr. Ronald Black, chief executive officer of Rambus. "We look forward to the opportunity to expand our customer relationships beyond patent license agreements to showcase our technical contributions and system know-how with our customers."
Since its founding in 1990, Rambus has developed solutions that advance electronic system performance through innovations in logic and memory interfaces, controller architectures, and system design. The result is a broad portfolio of patented innovations that enables semiconductor manufacturers and system designers to achieve ever-increasing levels of functionality and performance, to lower system costs, to mitigate risk with silicon-proven designs, and to reduce time-to-market.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies. As a company of inventors, Rambus focuses on the development of technologies that enrich the end-user experience of electronic systems. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Additional information is available at www.rambus.com.
|
Related News
- Fujitsu and Rambus Sign Patent License Agreement Covering Systems and Semiconductors
- WiLAN and Several Subsidiaries Sign Comprehensive Semiconductor License Agreement with SK hynix
- Rambus and Socionext Sign Broad Patent License Agreement
- Rambus and Marvell Sign Patent License Agreement
- Cryptography Research and Fairchild Semiconductor Sign Patent License Agreement for DPA Countermeasures
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |