MoSys Announces Renesas Electronics Support of GigaChip Interface for Chip-to-Chip Communications
SANTA CLARA, Calif.-- Jan. 22, 2013-- MoSys (NASDAQ: MOSY), a leader in semiconductor solutions that enable fast, intelligent data access for network and communications systems, today announced that Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, will support the GigaChip™ Interface in its Networking ASIC business.
The GigaChip Interface (GCI) is a scalable, high-performance, serial protocol for chip-to-chip communications that is differentiated in efficiency and reliability, resulting in system level benefits of reduced power, cost and complexity. Current implementations built with compatible CEI-11G or XFI SerDes electrical transport standards deliver up to 144Gbps of full duplex data throughput using 16 serdes lanes when running at a 10G rate. A key differentiator for the GCI protocol is high transport efficiency, even for small payloads. Alternative serial interfaces are typically less than 50 percent efficient when transferring 8B and 16B data, which means that they deliver less than half the performance at a given bandwidth. The combination of 90 percent transport efficiency, from small to large payloads, combined with power efficient short reach physical interconnect makes GCI ideal for co-processor, memory, or multi-chip communication. The interface also includes CRC error detection and automatic error recovery provisions to meet the high reliability requirements of enterprise, service provider, and mission critical communications and compute applications. GCI is an open, royalty-free, interface specification designed for use with the MoSys Bandwidth Engine family of ICs and is suitable for any chip-to-chip interconnect.
“As a leading ASIC provider to the industry, we see a major trend towards serial chip-to-chip interconnect, which is necessary to enable systems at 100G and beyond,” said Akira Denda, General Manager, 2nd Industrial Network Business Division of Renesas Electronics Corp. “We believe the GigaChip Interface provides the reliability, performance, efficiency, and openness needed, and we are pleased to expand our strong IP portfolio for our networking ASIC customers.”
“Renesas Electronics is one of the world’s leading providers of high-performance ASICs and we are pleased to have them support the GigaChip Interface in their networking ASIC business,” said John Monson, Vice President of Marketing for MoSys. “Through our collaboration, MoSys and Renesas will be able to offer our mutual customers powerful solutions that combine MoSys' Bandwidth Engine® ICs connected with ASICs from Renesas Electronics through the GigaChip Interface.”
About MoSys, Inc.
MoSys, Inc. (NASDAQ: MOSY) is an IP-rich fabless semiconductor company that provides high performance solutions for fast, intelligent data access in network and communications systems. Engineered and built for high-reliability carrier and enterprise applications, MoSys' products are breaking bandwidth barriers™ in data processing to allow for faster packet access and analysis, expanded user capacity and new capabilities required by the expanding global infrastructure. MoSys' Bandwidth Engine® family of ICs combines the company's patented 1T-SRAM® high-density, embedded memory and high-speed, 10 Gigabits per second serial interface with its intelligent access technology and a highly efficient GigaChip™ Interface transport protocol to eliminate bottlenecks in high-speed data access. MoSys is headquartered in Santa Clara, California, and more information is available at www.mosys.com.
|
Related News
- MoSys Launches the GigaChip(TM) Alliance for Serial Chip-to-Chip Communications
- MoSys Announces Breakthrough Bandwidth Engine ICs and Serial Chip-to-Chip Communications Interface for Next Generation Networking Applications
- MoSys Announces Tabula Support of GigaChip Interface
- Open-Silicon Unveils Interlaken IP Core with 600 Gbps Chip-to-Chip Interface Support for Networking, Storage and High-Performance Computing Products
- OpenFive and AnalogX to Provide Optimized Chip-to-Chip Interface IP Solutions
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |