English
Innovium and Broadcom Settle Legal Dispute
SAN JOSE, Calif., April 28, 2016 – Innovium, Inc. today announced that it has settled all outstanding litigation with Broadcom Limited. As part of the settlement agreement, the companies agreed to dismiss all litigation between the parties. Other terms of the settlement were not disclosed.
“We are pleased to put this legal dispute behind us and focus on developing innovative, ground-breaking products for the infrastructure market,” said Rajiv Khemani, CEO & Founder of Innovium.
About Innovium
Innovium is a venture-funded, pre-launch startup developing innovative hardware and software solutions for the infrastructure market. Innovium team members have track records of delivering market-leading products that have collectively generated billions of dollars in revenues and valuation. Innovium is headquartered in Silicon Valley, Calif. For more information, please visit: www.innovium.com.
|
||||||
Related News
- Infineon Reaches Agreement to Settle Legal Dispute with Fairchild
- Via Licensing and Pegatron Settle Patent License Dispute Concerning AAC Essential Patents
- Infineon and Atmel Reach Agreement to Settle Patent Dispute
- HTC and Apple Settle Patent Dispute
- Fujitsu Microelectronics and Nanya Technology Sign License Agreement to Settle Patent Dispute
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
|
E-mail This Article | 
|
|
Printer-Friendly Page |