SoC-e's MTSN Switch IP Core solution now supports 802.1AB (LLDP)
SoC-e is continually investing much of its effort in periodically renewing its products to meet the needs of the market and its customers.
February 21 , 2018 -- The MTSN Switch IP Core, launched in October last year, continues to receive numerous updates which include new features and enhancements. In the last major update support for 802.1AB or LLDP (Link Layer Discovery Protocol) has been included. This software-implemented feature allows TSN devices to discover the topology of the network to which it is connected and the devices that form it.
This technology is especially important in TSN networks. In this networks, the configuration of the entire network is centralized in a single node and it needs to have a global vision of the network in order to be able to configure the nodes that compose it (time slots, stream configurations…).
More information about SoC-e TSN Solutions:
- Multiport TSN Switch (MTSN) IP Web Site
- MTSN Kit Web Site
- SoC-e TSN White paper: Enabling the Road to TSN
For more information about these, you can contact us through the web form or writing us to info@soc-e.com
|
Related News
- SoC-e's Managed Ethernet Switch now supports up-to 32 ports
- SoC-e's 1588Tiny IP Core now supports Layer-3 PTP operation
- Stage Tec introduces HSR for Professional Audio Broadcasting using SoC-e Technology
- SoC-e Announces New Release of Managed Ethernet Switch (MES) IP Core Supporting DLR for Ethernet/IP
- The new release of SoC-e IEEE 1588 IP Core supports 10 Gigabit Ethernet
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
E-mail This Article | Printer-Friendly Page |