USB2.0 OTG PHY supporting UTMI+ level 3 interface - 28HK/55LL
Mobile Semiconductor Introduces A New 55nm High Density Memory Compiler Especially Designed For IoT Devices
SEATTLE -- February 4, 2019 -- Today, Mobile Semiconductor announced a new 55nm HD (High Density) memory compiler targeted at the cost sensitive IoT market. The new memory compiler boasts one of the highest density footprints in the industry dramatically reducing the die area and reducing customer product costs for sensors, smart locks, trackers and smart light bulbs.
Cameron Fisher, CEO and Founder of Mobile Semiconductor, said, "We believe that our success in the current 55nm Memory Compilers sets us apart from competitive offerings. This new high-density product is well positioned to support our customer's IoT products as they grow in features and capabilities. Our goal is to ensure that our customers can meet and exceed their silicon area goals and therefore reduce their costs."
Key features include:
- 15% to 33% smaller than previous 55nm compilers
- At least 11% smaller than competitive solutions
- Built on Mobile Semi's volume designs at 55nm and 65nm
- Available off the shelf today
Fisher continued, "Mobile Semiconductor remains the leader in providing memory compliers that target the needs of specific industries. We are proud of the fact that repeat customer purchases are close to 100%. This includes customers moving to the next smaller node or building new products on the same node. Reducing the memory size offered by this new 55nm memory compiler gives our customers a compelling reason to choose Mobile Semiconductor for their cost sensitive IoT products."
The 55nm HD memory compiler takes advantage of industry standard Bitcells provided by the top foundries. All Mobile Semiconductor memory compilers are supported by a wide range of industry leading licensing options. Contact Mobile Semiconductor at info@mobile-semi.com with your specific product needs.
About Mobile Semiconductor:
Mobile Semiconductor develops SRAM, ROM and Register File Memory compilers optimized for applications requiring ultra-low power, low leakage or ultra-high performance.
100% of Mobile Semiconductor's design and support takes place inside the United States and the tools have zero open source software. Their customers include aerospace giants, medical device manufacturers, key semiconductor companies, and foundries supporting their customers.
Cameron Fisher has served as CEO of Mobile Semiconductor since co-founding the company in 2006. Prior to founding Mobile Semiconductor, Mr. Fisher served as the Director of the Low Power SRAM Design Group at Virage Logic Corporation in Seattle, Washington where he patented several low power design innovations.
|
Related News
- Mobile Semiconductor Introduces a 22nm FDX (FDSOI) ULP Memory Compiler with Market Leading Features
- Mobile Semiconductor Introduces 40nm ULP Memory Compiler Support
- Mobile Semiconductor Introduces 28nm Memory Compiler Support
- X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices
- SkyWater Announces Availability of SRAM Memory Compiler for 90 nm Strategic Rad Hard by Process Offering
Breaking News
- Logic Design Solutions launches Gen4 NVMe host IP
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- M31 is partnering with Taiwan Cooperative Bank to launch an Employee Stock Ownership Trust to strengthen talent retention
- Sondrel announces CEO transition to lead next phase of growth
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
Most Popular
- Arm's power play will backfire
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PUFsecurity Collaborate with Arm on PSA Certified RoT Component Level 3 Certification for its Crypto Coprocessor to Provide Robust Security Subsystem Essential for the AIoT era
E-mail This Article | Printer-Friendly Page |