Is IPO in China Imagination's Only Possible Exit Path?
By Nitin Dahad, EETimes (April 30, 2020)
Next week the U.K. government will hold a parliamentary hearing to consider establishing an instrument similar to America’s CFIUS (Committee on Foreign Investment in the U.S.) to protect UK companies from takeovers deemed against the national interest. The impetus for considering such a measure is what’s going on with Imagination Technologies.
The hearing will call upon former CEO Hossein Yassaie, one of the more prolific campaigners to “keep Imagination Technologies British” and current management team Steve Evans, chief product officer, and John Rayfield, chief technical officer, who have threatened resignation if the company’s ultimate owners, China Reform Holdings, exercise more control within the company’s governance.
Imagination’s saga is being spun at least four different ways, as those with different agendas and vested interests attempt to control the perception of what is happening with the company. Here’s the essence of each of those views:
|
Imagination Technologies Group plc Hot IP
Related News
- Does China Have Imagination?
- Can We Believe The Hype About China's Domestic IC Production Plans?
- Google and eSilicon at DAC 2019: Doing EDA in the Cloud? Yes, It's Possible!
- Will Imagination Deals Deliver MIPS to China?
- Imagination's new PowerVR GPUs enable chip companies and OEMs to create the best possible user experience in cost-sensitive devices
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
E-mail This Article | Printer-Friendly Page |