Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
London, United Kingdom and Santa Clara, October 19, 2020 -- DIALOG SEMICONDUCTOR (XETRA:DLG), a leading provider of battery and power management, Wi-Fi® and Bluetooth® low energy (BLE) and Industrial edge computing solutions and GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES. The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired by Dialog Semiconductor in 2020. GLOBALFOUNDRIES will first offer Dialog’s CBRAM as an embedded, non-volatile memory (NVM) option on its 22FDX® platform, with the plan to extend to other platforms.
Dialog’s proprietary and production proven CBRAM technology is a low power NVM solution designed to enable a range of applications from IoT and 5G connectivity to artificial intelligence (AI). Low power consumption, high read/write speeds, reduced manufacturing costs and tolerance for harsh environments make CBRAM particularly suitable for consumer, medical, and select industrial and automotive applications. Furthermore, CBRAM technology enables cost-effective embedded NVM for advanced technology nodes required for products in these markets.
“CBRAM is one of Adesto’s marquee memory technologies and a game-changing addition to Dialog’s portfolio. This new licensing partnership with GLOBALFOUNDRIES speaks to just how quickly Dialog and Adesto have hit the ground running together,” said Mark Tyndall, Senior Vice President of Corporate Development and General Manager of the Industrial Mixed Signal Business Group at Dialog Semiconductor.
“Looking ahead, I am very positive about our strong relationship with GLOBALFOUNDRIES. This agreement not only enables a state-of-the-art technology for the industry, but it also creates the opportunity for Dialog to adopt leading-edge CBRAM technology for its next generation of System on Chips (SoCs),” added Tyndall.
“Our partnership with Dialog demonstrates GF’s commitment to intensify investment in areas where we can further differentiate and add value for our customers,” said Mike Hogan, Senior Vice President and General Manager of Automotive, Industrial and Multi-market at GF. “Dialog’s ReRAM technology is a great addition to our family of leading-edge eNVM solutions. This memory solution, coupled with our FDX platform, will enable our customers to push the envelope and deliver a new generation of secure IoT and edge-AI applications.”
Overcoming the integration and reliability challenges often associated with ReRAM, Dialog’s CBRAM technology offers a reliable low-cost embedded memory while maintaining ReRAMs low voltage operation. This translates to lower energy write and read access as compared to standard embedded Flash offerings.
CBRAM will be available in production for use by GF customers as an embedded NVM option on its 22FDX platform in 2022. Through IP customization, customers may modify the CBRAM cell to optimize their SoC designs, enhance security, or even adapt the cell for new applications. Additionally, CBRAM being a “back-end-of-line” technology enables relatively easy integration into other technology nodes.
Learn more about Dialog CBRAM technology here.
Learn more about GLOBALFOUNDRIES’ 22FDX platform here.
|
Related News
- GlobalFoundries Acquires Renesas' Non-Volatile Resistive RAM Technology to Proliferate IoT and 5G Applications
- QuickLogic's eFPGA Qualified on GLOBALFOUNDRIES 22FDX Platform for IoT and Edge AI Applications
- VeriSilicon Releases Most Advanced FD-SOI Design IP Platform on GLOBALFOUNDRIES 22FDX for Edge AI and IoT Applications
- QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries™ 22FDX® Platform
- Vidatronic Announces Power Management IP Now Certified on Globalfoundries' 22FDX® Platform for IoT Applications
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |