Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022, SEMI Reports
MILPITAS, Calif. — September 27, 2022 — Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022, SEMI announced today in its latest quarterly World Fab Forecast report. The report also shows the global fab equipment industry increasing capacity this year and again in 2023.
“After achieving a record level in 2022, the global fab equipment market is projected to remain healthy next year driven by new fabs and upgrade activity,” said Ajit Manocha, SEMI President and CEO.
Fab Equipment Spending by Region
Taiwan is expected to lead fab equipment spending in 2022, increasing investments 47% YOY to US$30 billion, followed by Korea at US$22.2 billion, a 5.5% decline, and China at US$22 billion, a 11.7% drop from its peak last year. Europe/Mideast this year is forecast to log record high spending of US$6.6 billion, a 141% YOY surge this year though outlays remain comparatively smaller than in other regions. Strong demand for high-performance computing (HPC) advanced technologies is driving the region’s jump in spending. The Americas and Southeast Asia are also expected to register record high investments in 2023.
Semiconductor Industry Continues to Boost Capacity
The SEMI World Fab Forecast report shows a global capacity increase nearing 8% in 2022, reaching 7.7%, after a 7.4% rise in 2021. The fab equipment industry last saw a YOY growth rate of 8% in 2010, when it topped 16 million wafers per month (200mm equivalents) – nearly half of the 29 million wafers per month (200mm equivalents) projected for 2023. Capacity growth is expected to continue in 2023, increasing 5.3%.
Capacity increases at 167 fabs and production lines will account for over 84% of equipment spending in 2022, a proportion expected to slip to 79% next year as 129 known fabs and lines add capacity.
As expected, the foundry sector, with a share of 53%, will represent the bulk of equipment spending in 2022 and 2023, followed by memory at 32% in 2022 and 33% in 2023. The two sectors also account for the largest capacity increases.
The latest update of the SEMI World Fab Forecast report, published in September, lists 1,453 facilities and lines globally, including 148 volume facilities and lines with various probabilities that are expected to start production in 2022 or later.
About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org
|
Related News
- Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports
- Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports
- Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022, SEMI Reports
- 300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027, SEMI Reports
- Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |