TTPCom implements AMR codec in GX20 camera phone from Sharp Corporation
Dedicated support team speeds time to market for new technology
January 7, 2004 - The GX20 camera phone from Sharp Corporation is the first to implement TTPCom’s adaptive multi-rate (AMR) speech codec. The inclusion of the AMR codec in the GX20 enables the phone to deliver enhanced multimedia messaging services (MMS) – such as the recording and playing of voice clips. AMR is included in the 3rd Generation Partnership Project (3GPP) specification and is in demand from network operators for the deployment of 3G style services; AMR is fully compatible with 3G phones and services.
To reduce development time for the GX20 Sharp took advantage of TTPCom’s new enhanced engineering services. This service gives access to a dedicated support team for a defined period during the development process and can be used to address specific product or technology needs, to support conformance testing or to conduct operator field trials. For the GX20, TTPCom provided dedicated engineers at the development and integration stages and undertook extensive interoperability trials to ensure compatibility of the AMR technology with existing hardware.
“AMR is an important step forwards in the provision of exciting new multimedia services and we’re working closely with Sharp to ensure that the very latest service and technology upgrades are integrated quickly into their new handsets,” stated Gordon Aspin, Operations Director at TTPCom. “With over 13 years experience in wireless technology TTPCom has developed an enviable reputation for getting customers to market with leading edge GSM and GPRS products. As the mobile phone market becomes more competitive and as new product development times decrease, we felt it was essential that we developed a service that enables our customers to access specific TTPCom expertise as and when they need it. The result of this new service is reduced product development time and much faster time to market”.
Steve Bold, Managing Director of Sharp Telecoms of Europe said “The GX10, built on TTPCom’s GSM/GPRS technology, has been a tremendous success. We are always looking for ways in which we can enhance our handsets and give our users an even more rewarding experience. We are very pleased with TTPCom’s responsiveness and their new engineering service has made the development process run smoothly and enabled us to meet the tight deadlines for the launch of the GX20 camera phone”.
TTPCom and Sharp have a long-term vision to deliver advanced features on mobile phones and the two companies are already working on the next generation of GSM/GPRS phones and applications.
|
Related News
- NTT DOCOMO, Renesas, Fujitsu, and Sharp to Jointly Develop Platform for HSUPA Mobile Phone
- DSP Group Becomes a Licensee of SPIRIT DSP Low Bitrate Voice Codec for Digital Phone Baseband Processors and SoCs
- Paragon Wireless Chooses SoftRISC's Codec Solution for its GSM/VoWLAN Dual-Mode Smart Phone
- Renesas Technology Starts Sample Shipments of SH-Mobile G3 System LSI Jointly Developed With NTT DoCoMo, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson for 3G Mobile Phone Handsets
- NTT DoCoMo, Renesas, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson to Jointly Develop Platform for 3G Mobile Phone Handsets
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |