Trial Court Denies Infineon Request for Stay of Rambus Patent Claim Trial
Number of Claims to be Tried Also Limited by Trial Court
Los Altos,CA - January 08, 2004 - Rambus Inc. (Nasdaq: RMBS), a leading developer of chip-to-chip interface products and services, today announced that in its lawsuit against Infineon Technologies AG (NYSE: IFX) the United States District Court for the Eastern District of Virginia issued several rulings today. Included among them was the denial of a request by Infineon to stay the trial pending rulings by the Federal Trade Commission (FTC) in its own complaint against Rambus.Rambus' patent infringement trial against Infineon is now set to begin on May 10, 2004.
In other rulings from the bench, the District Court limited to four the number of patent claims to be tried against Infineon, ruling that other claims were not the subject of Rambus' successful appeal decided by the Court of Appeals for the Federal Circuit on January 29, 2003.
About Rambus Inc.Rambus is one of the world's leading providers of chip-to-chip interface products and services. The company's breakthrough technology and engineering expertise have helped leading chip and system companies to solve their challenging I/O problems and bring industry-leading products to market. Rambus's interface solutions can be found in numerous computing, consumer electronic and networking products. Additional information about the company is available at www.rambus.com.
|
Related News
- United States Supreme Court Denies FTC Request to Review Rambus Matter
- Rambus Announces Resetting of Infineon Patent Trial Date
- Rambus and Infineon Renew Patent License Agreement
- US District Court Accepts Kilopass' Expanded Complaint and Denies Sidense's Motion for Dismissal in Patent Lawsuit
- Court Declares Rambus Patents in Suit Unenforceable in Micron Delaware Case
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |