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Transdimension introduces the industry's first High-Current, Full-Speed USB OTG transceiver
TD6100 Enables Connectivity with a Broad Range of USB Systems and Devices
IRVINE, Calif., October 19, 2004 - TransDimension, a leading provider of USB connectivity solutions for embedded applications, today introduced the TD6100, the industry's first high-current, full-speed USB On-the-Go (OTG) transceiver. The TD6100 has a built-in charge pump which can supply up to 100mA of current, enabling it to power a wide variety of standard USB devices. It enables direct connections between mobile devices such as cellular phones, PDAs, MP3 players, and digital cameras without a host PC.
The TD6100 enables the USB physical layer interface for systems that have SoCs, ASICs or FPGAs with an integrated USB host, peripheral, or OTG core but have no built-in transceiver. With SoC migration to smaller process geometries, the scalability and integration of a USB transceiver with mixed-signal circuitry into an SoC may introduce risks to the program schedule. The implementation of an external transceiver reduces this risk while providing a cost effective solution that achieves a customer's time-to-market requirements. The TD6100 is fully compliant to the OTG Transceiver Standard specification and the USB Analog Car Kit Standard.
"The TD6100 offers customers an OTG transceiver that is compatible with TransDimension's full-speed USB OTG IP core which has been licensed and adopted into many of the market's leading SoCs," said Paul Liu, director of marketing for TransDimension. "With the integrated high-current charge pump, which can supply up to 100mA, the TD6100 enables systems to power a wide variety of standard USB devices including thumb drives without the need for an external charge pump. This results in savings to the customer in both board space and BOM cost."
The TD6100 supports a serial I2C bus interface for OTG status and command control, and also supports the general purpose buffer mode serial communication interface used with UARTs. It offers a wide range of interface I/O voltages from 1.65V to 3.6V, is compatible with a broad range of battery-supplied operating voltages from +2.7V to 4.5V, and has a selectable power-down mode to extend battery life for mobile products. The TD6100 is rated for an industrial operating temperature range of -40 to +85o C to enable broad application usage and is available in a small 28-pin 4x5mm QFN package.
The TD6100 is offered for $1.50 in quantities of 10,000. Datasheets and samples of the TD6100 are available by contacting the nearest TransDimension sales office. Please visit the TransDimension website at http://www.transdimension.com for the location nearest you.
About TransDimension
Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market solutions targeting peripheral connectivity. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable direct connectivity for a wide range of PC peripheral applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, for exchanging data. TransDimension's SoftConnex USB software is a complete software solution for USB, including the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at http://www.transdimension.com.
IRVINE, Calif., October 19, 2004 - TransDimension, a leading provider of USB connectivity solutions for embedded applications, today introduced the TD6100, the industry's first high-current, full-speed USB On-the-Go (OTG) transceiver. The TD6100 has a built-in charge pump which can supply up to 100mA of current, enabling it to power a wide variety of standard USB devices. It enables direct connections between mobile devices such as cellular phones, PDAs, MP3 players, and digital cameras without a host PC.
The TD6100 enables the USB physical layer interface for systems that have SoCs, ASICs or FPGAs with an integrated USB host, peripheral, or OTG core but have no built-in transceiver. With SoC migration to smaller process geometries, the scalability and integration of a USB transceiver with mixed-signal circuitry into an SoC may introduce risks to the program schedule. The implementation of an external transceiver reduces this risk while providing a cost effective solution that achieves a customer's time-to-market requirements. The TD6100 is fully compliant to the OTG Transceiver Standard specification and the USB Analog Car Kit Standard.
"The TD6100 offers customers an OTG transceiver that is compatible with TransDimension's full-speed USB OTG IP core which has been licensed and adopted into many of the market's leading SoCs," said Paul Liu, director of marketing for TransDimension. "With the integrated high-current charge pump, which can supply up to 100mA, the TD6100 enables systems to power a wide variety of standard USB devices including thumb drives without the need for an external charge pump. This results in savings to the customer in both board space and BOM cost."
The TD6100 supports a serial I2C bus interface for OTG status and command control, and also supports the general purpose buffer mode serial communication interface used with UARTs. It offers a wide range of interface I/O voltages from 1.65V to 3.6V, is compatible with a broad range of battery-supplied operating voltages from +2.7V to 4.5V, and has a selectable power-down mode to extend battery life for mobile products. The TD6100 is rated for an industrial operating temperature range of -40 to +85o C to enable broad application usage and is available in a small 28-pin 4x5mm QFN package.
The TD6100 is offered for $1.50 in quantities of 10,000. Datasheets and samples of the TD6100 are available by contacting the nearest TransDimension sales office. Please visit the TransDimension website at http://www.transdimension.com for the location nearest you.
About TransDimension
Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market solutions targeting peripheral connectivity. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable direct connectivity for a wide range of PC peripheral applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, for exchanging data. TransDimension's SoftConnex USB software is a complete software solution for USB, including the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at http://www.transdimension.com.
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