EE Times' ACE Awards Committee Selected eASIC's Configurable Logic Product Award Finalist
San Jose, California, February 22, 2005 -- eASIC® Corporation, a provider of Configurable Logic and Structured ASIC products, today announced that its Configurable Logic product, eASICore was selected as ACE (Annual Creativity in Electronics) Awards finalist by CMP Media's EE Times. Based on its innovative technology and usability advantages, the eASICore was nominated for Ultimate Product of the Year in the category of Logic and Programmable Logic. In this ACE Awards program, EE Times stated it will recognize the people, companies and products that demonstrated leadership in the electronics industry. The review Committee for the ACE Awards is composed of the leading voices of academia, industry visionaries and Wall Street's top executives. The honors will be presented at the first annual ACE awards gala on March 9, 2005, as part of the Embedded Systems Conference in San Francisco.
“We are delighted that leading technologists and executives in our industry have chosen eASIC’s product as an ACE Award finalist,” said Zvi Or-Bach, eASIC Founder and CEO. “This recognition is in praise of our breakthrough configurable logic technology that is aimed at providing a viable and affordable electronics design methodology. The industry is experiencing a tremendous increase of interest in innovative solutions such as Structured ASIC that can cope with major deep-submicron design and manufacturing issues. This opens the window of opportunity for new and innovative ASIC designs which were recently in a significant declining trend. The configurable logic and Structured ASIC technologies has been gaining momentum as the existing Standard Cell and FPGA solutions can no longer answer the cost and performance needs of the majority of today’s semiconductor applications. We look forward to serving this market together with our strategic partner, Flextronics Semiconductor”.
Innovative Configurable Logic Technology - Structured eASIC
eASIC has a unique Configurable Logic technology implemented in its Structured eASIC products. The patented architecture consists of SRAM-based logic cells and flip-flops that are interconnected by a segmented wiring grid utilizing upper metal layers. The logic cells programming is done similarly to an FPGA, by loading a bit-stream to program the LUTs (Look-up-Tables) and initialize the flip-flops after powering up the device. The routing and interconnection is performed similar to other ASICs, but utilizes just a single via-layer for customization. Thus, a customer design is implemented on the Structured eASIC fabric by using a combination of bit-stream to program the LUTs and a single custom Via-mask for customizing the routing. Moreover, the single mask can be eliminated for prototyping and low-volume by using Direct-write eBeam. Hence, eASIC’s use of maskless lithography removes the customization tooling cost, shortens time-to-market, and adds manufacturing flexibility, allowing eASIC to provide the industry with an NRE-Free customized ASIC devices with densities, power and performance akin to a standard cell ASIC.
About eASIC
eASIC® has developed a breakthrough Configurable Logic technology aimed at dramatically reducing the overall fabrication cost and time of customized high-performance semiconductor chips. Its Structured eASIC architecture enables rapid and low-cost ASIC and SoC (System-on-Chip) designs by innovative use of proven programmable logic fabric in conjunction with single-via customizable segmented routing. As single-via generates ten times higher throughput of Direct-write e-Beam customization, it enables eASIC to offer NRE-free Structured ASIC. The Structured eASIC technology was successfully proven in silicon and validated by world-class semiconductor vendors. Partnering with industry leaders to jointly develop, manufacture and market Structured ASIC products, the company is positioned to become the preferred Structured ASIC solution.
eASIC Corporation is a privately held company, Venture Capital backed by Kleiner Perkins Caufield and Byers. Headquartered in San-Jose, California, eASIC was founded in 1999 by Zvi Or-Bach, the founder of Chip Express.
www.eASIC.com
Copyright © 2005 eASIC Corporation. All rights reserved. All company and/or product names may be trade names, trademarks and/or registered trademarks of the respective owners with which they are associated. Features, pricing, availability, and specifications are subject to change without notice.
|
Related News
- eASIC Technology Helps STMicroelectronics Achieve a Landmark: 24 hours From RTL to Tapeout Using eASIC's Innovative Configurable Logic Technology
- Virage Logic's Yervant Zorian Named as One of Top Industry Influencers by EE Times Magazine
- eASIC Announces Implementation of Its Configurable Logic Core in UMC's 0.15 Micron Process
- eASIC Corporation to Employ Numerical Technologies' Phase Shifting to Significantly Boost Performance of Configurable Logic Chips
- Weebit Nano's ReRAM IP Awarded "Embedded Solution Product of the Year" in the Electronic Industry Awards
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |