InnoCOMM rolls out single-chip Bluetooth device
![]() |
InnoCOMM rolls out single-chip Bluetooth device
By Semiconductor Business News
January 18, 2001 (1:07 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010117S0077
SAN DIEGO -- Hoping to drive down the costs of personal-area networks, InnoCOMM wireless Inc. has rolled out a single-chip, Bluetooth-enabled radio transceiver based on a CMOS process technology. The new chip, called the ICM3101, enables cellular phones, PDAs, notebook PCs, and other products to communicate over a wireless network at speeds up to 1-megabits-per-second. Using a proprietary smart radio technology, innoCOMM wireless's chip technology significantly reduces power consumption in a system, said Bernard Xavier, president and chief executive of innoCOMM. Based on a 0.25-micron process, the ICM3101 has no external filters or inductors, thereby reducing cost and board space. To save battery life, a proprietary smart radio technology is incorporated into the design that allows the chip to run at a lower power when idle. "CMOS is the obvious route to take," said Ken Lazarus, vice president of engineering for the company. "The real benef it with this Bluetooth chip is that we are able to achieve power efficiencies similar to those normally attributed to silicon germanium, BiCMOS, and silicon-on-insulator technologies without sacrificing performance, chip size and integration." Volume production will begin in mid-2001, with samples available in the first quarter. The chip is $7.00 in quantities of 500,000.
Related News
- Two-year-old Transilica rolls out single-chip Bluetooth solution in small BGA
- Broadcom Announces Groundbreaking 65 Nanometer Single-Chip Bluetooth 2.1 + EDR Solution for Mobile Handsets
- STMicroelectronics Announces STLC2500 Single-Chip Bluetooth Product, Raises the Bar for Radio Performance and Low Power Consumption
- Ericsson Technology Licensing Offers Unique Design Solution for Single-chip Bluetooth Radio
- Chipidea Microelectronics SA Licenses ARCtangent for Single-chip Bluetooth Application
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |