D&R Headline News (October 2017)

Headlines for Tuesday Oct. 31, 2017

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Flex Logix to Provide Embedded FPGA IP to 'DesignShare' for SiFive Freedom Platform

SiFive and Flex Logix today announced they will partner to make Flex Logix EFLX® embedded FPGA available for the SiFive Freedom Platform as part of the DesignShare program.

• Intrinsic ID Signs Agreement with Open Security Research for China Representation
• Synopsys' DesignWare STAR Memory System's New Test and Repair Capabilities Speed Embedded Memory Repair Time by 10x
• ArterisIP Expands Worldwide Engineering Centers of Excellence and Talent Roster
• Truechip Announces First Customer Shipment Of USB 3.2 Verification IP
• DecaWave Deploys Synopsys TetraMAX II ATPG on Latest Automotive Design to Lower Test Time 50 Percent and Speed Runtime by 10x

Headlines for Monday Oct. 30, 2017

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Global Semiconductor Industry Posts Highest-Ever Quarterly Sales

SIA today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

• Thoughts on Jem Davies leading Arm's machine learning group
• Online BOM calculator simplifies costing process for IIoT custom ICs
• 19 Views of Arm Tech Con 2017
• Synopsys Introduces Complete Functional Safety Test Solution to Accelerate ISO 26262 Compliance for Automotive SoCs
• Synopsys Test Platform Tools Certified for the Most Stringent Level of Automotive Safety Measures Defined by the ISO 26262 Standard
• Guardtime and Intrinsic ID Awarded Dutch Government Contract for Distributed Energy Marketplace via a Decentralized Trading Platform
• Attopsemi Technology Published a Paper for the IEEE S3S Conference in October 16-19 2017, San Francisco
• OmniPHY to Demonstrate Automotive Design Solutions at IEEE-SA Automotive Ethernet Technology Day
• Lauterbach and SiFive Bring TRACE32 Support for High-Performance RISC-V Cores
• Vidatronic Announces Flexsupply Family of Switched-Capacitor DC-DC Converter IP Cores

Headlines for Thursday Oct. 26, 2017

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Arm Unveils New AI Group

A new machine learning group at ARM will create accelerator cores, blocks for its CPU and GPU cores and software to tie it all together. Exactly what the group will deliver and when remains under covers.

• Cadence Reports Third Quarter 2017 Financial Results
• NetSpeed and UltraSoC partner to accelerate development time for complex SoCs
• Intel Enables 5G, NFV and Data Centers with High-Performance, High-Density ARM-based Intel Stratix 10 FPGA
• Arm CEO Sounds Security Alarm

Headlines for Wednesday Oct. 25, 2017

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Sonics And Moortec Partner To Provide Temperature-Compensated DVFS Capability For SoC And MCU Designers

Sonics, Inc., the world's foremost supplier of on-chip network (NoC) and power management technologies and services, and Moortec, specialists in embedded in-chip sensing, today announced their partnership that integrates the companies' products to provide advanced power management techniques to system-on-chip (SoC) and MCU designers.

• Bringing an additional layer of fortification to SoCs powering the next trillion connected devices
• PCI-SIG Releases PCIe 4.0, Version 1.0
• Apple Talks About Sole Sourcing from TSMC
• asicNorth announces immediate availability of its IoT Endpoint ASIC Platform
• Fast Processor Models of Latest Arm Cores Released by Imperas and Open Virtual Platforms (OVP)
• Bitmain Introduces Its First Hardware for Accelerating Artificial Intelligence (AI) Applications

Headlines for Tuesday Oct. 24, 2017

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New ASIL-B Ready ISO 26262 Certified VESA DSC IP Cores Launched by Hardent

Hardent, a leading expert in VESA Display Stream Compression (DSC) technology, has announced the expansion of its IP portfolio to include new ASIL-B ready ISO 26262 certified IP products for the automotive marke

• Cadence and Arm Deliver First SoC Verification Solution for Low-Power, High-Performance Arm-Based Servers
• Flex Logix Demonstrates Flexible Microcontroller at Arm TechCon
• Rambus Reports Third Quarter 2017 Financial Results
• UltraSoC appoints Alberto Sangiovanni-Vincentelli as Chairman
• PLDA GROUP Announces Divestiture of REFLEX CES, Enabling an Increased Focus on Its Core Activities and Investments in High Potential Business Segments
• HEVC Advance Announces Revised Royalty Rates for Lower-Priced Devices
• Menta Joins GLOBALFOUNDRIES' FDXcelerator Partner Program
• eMemory Unveils Auto-Grade EEPROM IP with over 500K Cycle Endurance
• Andes 32-bit CPU IP Cores Implemented on GLOBALFOUNDRIES 22FDX Process Technology
• BrainChip Ships First BrainChip Accelerator To a Major European Car Maker for Evaluation in ADAS and AV Systems

Headlines for Monday Oct. 23, 2017

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Silvaco Introduces Arm Cortex M0-based I3C Sensor Subsystem

Silvaco today announced the availability for licensing the industry’s first Arm®-based I3C sensor IP subsystem core. The I3C Sensor Subsystem is an Arm AMBA® based system used to build low power SoCs supporting the new MIPI I3C standard for sensor connectivity.

• It's Here: A Common Industry Framework for Protecting a Trillion Connected Devices
• TSMC Expects 10nm Demand to Soar
• SiFive Selects Synopsys Verification Continuum Platform for Advanced RISC-V Processor Designs
• 90% Reduction in power consumption for RFID chips with Dolphin Integration's SESAME eLC standard cell library

Headlines for Friday Oct. 20, 2017

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Xylon Presents New Modular Video Logger

Xylon Presents logiRECORDER 3.0 Automotive Video Data Logger. This high-performance data logger inserts between the real vehicle's camera installation and the Electronic Control Units (ECUs) to non-invasively record Terabytes (TB) of uncompressed multi-camera video, networks sensory and ECU data per a single recording session.

• OVH launches Acceleration-as-a-Service Leveraging the New Intel Programmable Acceleration Card and App Store from FPGA Acceleration Partner Accelize
• ArterisIP Acquires iNoCs Software and Associated Intellectual Property Rights

Headlines for Thursday Oct. 19, 2017

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Rambus Validates Interoperability of DDR4 High-performance Memory IP Solution for Arm-based Datacenter Systems

Rambus today announced the validated interoperability of the Rambus DDR4 PHY and the Arm® CoreLink™ DMC-620 Dynamic Memory Controller. Together, these IP blocks offer speeds of up to 3200 Mbps, the highest performance memory speed available on the market. This partnership provides a verified solution to chip designers, reducing design time and improving time-to-market for demanding datacenter and communications applications.

• Microsemi Launches Mi-V Ecosystem to Accelerate Adoption of RISC-V
• CEVA and Cyberon Partner for Ultra-low Power Always-listening Voice Activation Solution
• Inside Secure brings to market industry's only complete and fully-certified cloud-based mobile payment solution
• Samsung Completes Qualification of 8nm LPP Process
• TSMC Reports Third Quarter EPS of NT$3.47
• IC Insights Raises 2017 IC Market Forecast to +22%
• M31 Technology and Corigine have launched the world's first USB-IF certified 28 nm Superspeed+ USB 3.1 Gen 2 IP Solution

Headlines for Wednesday Oct. 18, 2017

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Synopsys Expands DesignWare IP Portfolio with Acquisition of Sidense Corporation

Synopsys, Inc. (Nasdaq: SNPS) today announced that it has acquired Sidense Corporation, a leading provider of one-time programmable (OTP) non-volatile memory (NVM) for automotive, mobile, industrial and Internet of Things (IoT) applications.

• Allegro DVT Releases a New Generation of Encoder IPs
• Corigine Unveils First Certified SuperSpeed+ USB 3.1 Gen 2 IP With M31 28nm PHY
• Synopsys and NXP Extend Multiyear Automotive Center of Excellence Collaboration for NXP S32 Automotive Processing Platform
• CEVA and Brodmann17 Partner to Deliver 20 Times more AI Performance for Edge Devices

Headlines for Tuesday Oct. 17, 2017

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Mixel's MIPI C-PHY/D-PHY Combo IP is Silicon-Proven in Multiple Nodes

Mixel announced today that its MIPI® C-PHYSM/MIPI D-PHYSM combo IP is silicon-proven in both 40nm and 55nm process nodes and is going into high-volume production in its customer’s products. The IP is also available in 28nm. The MIPI C-PHY/MIPI D-PHY combo supports the MIPI Camera Serial Interface (CSISM) and MIPI Display Serial Interface (DSISM).

• Achronix Speedcore Custom Blocks Supercharge Data Acceleration Systems
• sureCore Joins GLOBALFOUNDRIES FDXcelerator Partner Program
• CENTRI Announces Immediate Availability of IoT Advanced Security for the Arm Mbed IoT Device Platform
• CEO interview: S3 Semi ready for custom opportunity
• Intel to Battle in FPGA-as-a-Service Race
• CEVA and LG Electronics Partner for Smart 3D Camera Solution
• Montage Technology Licenses Allegro DVT's Latest Multi-Format Video Encoder IP for Next Generation Set-Top Box Chips
• REFLEX CES Partners with NOLAM EMBEDDED SYTEMS to Provide Integrated CANbus IP Core Solutions on FPGA COTS Boards
• CAST Introduces GZIP Accelerator Through New Intel FPGA Data Center Acceleration Ecosystem
• NovaSparks introduces "U.S. Equities in a Box" solution
• Wafer Shipments Forecast to Increase in 2017, 2018 and 2019
• Microsemi's Lowest Power, Cost-Optimized Mid-Range PolarFire FPGAs Achieve Key Milestone by Passing PCI SIG's PCIe Endpoint Compliance Suites
• Gartner Says Worldwide Device Shipments Will Increase 2.0 Percent in 2018, Reaching Highest Year-Over-Year Growth Since 2015
• MIPI Alliance Announces Milestones in Membership Growth and Industry Influence

Headlines for Monday Oct. 16, 2017

• Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ARM TechCon in Santa Clara
• Accellera Systems Initiative advances the SystemC ecosystem with a new core language library
• Dolphin Integration Joins GlobalFoundries FDXcelerator Program to Provide Breakthrough Fabric IP
• SiFive Joins TSMC IP Alliance Program
• Thalia DA attracts fresh investment as semiconductor industry recognizes analog IP reuse challenge
• Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing and Networking Applications and Showcase its IoT Gateway SoC Reference Design for Smart City Applications at ARM TechCon 2017
• TSMC Senior Vice President Dr. Stephen Tso to Retire
• Dr. Haijun Zhao, Dr. Liang Mong Song Appointed as SMIC Co-CEO and Executive Director
• Codasip Hires IP Industry Veteran Chris Jones as Vice President of Marketing

Headlines for Friday Oct. 13, 2017

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IC Makers Maximize 300mm, 200mm Wafer Capacity

With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The number of 300mm wafer production-class fabs in operation worldwide is expected to increase each year between now and 2021 to reach 123 compared to 98 in 2016.

• Xilinx Selected by Alibaba Cloud for Next-Gen FPGA Cloud Acceleration
• Intel FPGAs Power Acceleration-as-a-Service for Alibaba Cloud
• Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX Process Technology

Headlines for Thursday Oct. 12, 2017

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Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14 ASIC Platform for Data Center and Enterprise

Rambus today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G MPSL (multi-protocol serial link), 30G C2C (chip-to-chip) and 30G VSR (very short reach) PHYs developed for GLOBALFOUNDRIES high-performance FX-14™ ASIC platform.

• Imec and Analog Devices sign strategic research partnership for development of next-generation IoT devices
• Hiroshima University Research Team Accelerates the Development of a Computer-Aided Medical Diagnosis System with Cadence Tensilica Vision P6 DSP Core and Protium S1 FPGA-Based Prototyping Platform
• S3 Semiconductors selected to advance Satellite Transceiver Technology in ESA ARTES Partner Programme
• Gartner Says Worldwide Semiconductor Revenue to Reach $411 Billion in 2017
• New MIPI Alliance Group Collaborates with Automotive Industry Experts to Address Interface Specifications for Automotive Applications
• GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow's Connected Car

Headlines for Wednesday Oct. 11, 2017

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Mobiveil Announces 25xN RapidIO Specification 4.1 (25G) Digital Controller IP for Next-Generation Wireless Networking, High-Performance Computing Applications

Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (IP), platforms and IP-enabled design services, today announced availability of its digital controller IP compliant with the 25xN RapidIO® Specification 4.1.

• QuickLogic Partners with AcconSys to Expand eFPGA Design Activity in China
• Cadence Achieves TUV SUD's First Comprehensive "Fit for Purpose - TCL1" Certification in Support of Automotive ISO 26262 Standard
• Sankalp Semiconductor receives investment from Stakeboat Capital Fund

Headlines for Tuesday Oct. 10, 2017

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ACTT's Complete IoT Solution Now Available on SMIC 55nm eFlash Platform

Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and Chengdu Analog Circuit Technology Inc. (ACTT), a leading Analog IP provider, today jointly announced the availability of ACTT's Analog IP solution on SMIC's 55nm eFlash technology.

• NAGASE Partners with Accelize Extending FPGA Acceleration-as-a-Service to Complex Data Analytics
• ArterisIP Joins GLOBALFOUNDRIES FDXcelerator Partner Program
• Sandia National Laboratories Licenses Flex Logix's Embedded FPGA IP For Multiple Products
• Teradyne Standardizes on Cadence Xcelium Parallel Logic Simulator
• Report: TSMC's 3nm Fab Could Cost $20 Billion
• Telco Systems, NXP and Arm Introduce New uCPE Offering

Headlines for Monday Oct. 09, 2017

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AImotive Highlights Significant Limitations In Hardware And Benchmarks For Fully Autonomous Vehicles

AImotive, the full-stack autonomous vehicle technology supplier, today announced the availability of its FPGA prototyping platform, designed to demonstrate the hardware acceleration potential of aiWare, using the company’s aiDrive software stack that targets Level 5 fully autonomous vehicles.

• Near zero power consumption for RFID chips with Dolphin Integration's SESAME eLC standard cell library
• SoC-e releases Multiport Time Sensitive Networking (TSN) IP Core
• Faraday Monthly Consolidated Sales Report - September 2017

Headlines for Friday Oct. 06, 2017

• UMC Reports Sales for September 2017
• BaySand Makes It Even Easier to Access Arm-based Custom ASIC, Using Arm DesignStart
• TSMC September 2017 Revenue Report

Headlines for Thursday Oct. 05, 2017

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Synopsys Delivers Industry's First USB 3.2 Verification IP and Test Suite for Higher Performance USB Designs

Synopsys today announced the availability of the industry's first verification IP (VIP) and UVM source code test suite to support the latest USB 3.2 specification.

• NetSpeed's Turing Brings Machine Learning to SoC Design
• GUC Monthly Sales Report - Sep 2017
• Dialog Semiconductor to Acquire Silego Technology, the Leader in Configurable Mixed-Signal ICs
• Pure-Play Foundries Boosting Their Presence in China
• Eta Compute's David Baker, Ph.D. To Present On Low-Power IP For The Internet of Things At Arm TechCon October 25

Headlines for Wednesday Oct. 04, 2017

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ArterisIP announces Ncore 3 Cache Coherent Interconnect

ArterisIP today announced the Ncore Cache Coherent Interconnect IP version 3 along with the optional Ncore Resilience Package for functional safety.

• SiFive Launches First RISC-V Based CPU Core with Linux Support
• Silicon Creations Named 2017 TSMC Partner of the Year for Analog Mixed Signal IP
• Cortus presenting at SEDEX 2017 in Seoul Korea, on the 17th October 2017

Headlines for Tuesday Oct. 03, 2017

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Xilinx Delivers Zynq UltraScale+ RFSoC Family Integrating the RF Signal Chain for 5G Wireless, Cable Remote-PHY, and Radar

Xilinx, Inc. (NASDAQ: XLNX) today announced delivery of its Zynq® UltraScale+™ RFSoC family, a breakthrough architecture integrating the RF signal chain into an SoC for 5G wireless, cable Remote-PHY, and radar.

• Inside Secure and Toshiba Information Systems (Japan) deepen cooperation to provide embedded security to Japanese market
• Intel Eases Use of FPGA Acceleration: Combines Platforms, Software Stack and Ecosystem Solutions to Maximize Performance and Lower Data Center Costs
• Monthly Semiconductor Sales Reach $35 Billion Globally for First Time in August

Headlines for Monday Oct. 02, 2017

Top Story

Q&A: Ray Bingham on Canyon Bridge, Imagination

If Canyon Bridge Capital Partners (Palo Alto, Calif.) succeeds in purchasing Imagination Technologies without a hitch, it will be the very first time the Chinese government-backed buyout fund has closed any deal since the firm was founded in 2016.

• Cadence Genus Synthesis Solution Enables Fuji Xerox to Improve Multi-Functional Printer SoCs Design Development
• Lattice and Helion Accelerate Embedded Vision Designs with Turnkey ISP Solution
• TSMC Dr. Morris Chang Announces Retirement in June 2018. Future Dual Leadership Will Be Mark Liu as Chairman And C.C. Wei as CEO.
• Altair Acquires Runtime Design Automation, Broadens Software Portfolio for High Performance Computing
• Tessera Files Legal Proceedings Against Samsung for Patent Infringement