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YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets (Thursday Dec. 05, 2024)
YorChip, Inc. and Digitho extend partnership to develop a breakthrough 2D low cost advanced Chiplet Packaging solution. Currently advanced packaging is too expensive and unsuitable for mass market applications as packaging costs can easily exceed silicon costs.
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Alphawave Semi Drives Innovation in Hyperscale AI Accelerators with Advanced I/O Chiplet for Rebellions Inc (Tuesday Nov. 26, 2024)
Alphawave Semi is pleased to announce that South Korean AI chip firm Rebellions Inc. has selected Alphawave Semi’s multiprotocol I/O Connectivity Chiplets for their next-generation product REBEL.
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Cadence Unveils Arm-Based System Chiplet (Wednesday Nov. 20, 2024)
Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.
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SEMIFIVE Collaborates with Synopsys to Develop Advanced Chiplet Platform for High-Performance Multi-Die Designs (Tuesday Nov. 12, 2024)
SEMIFIVE today announced their collaboration with Synopsys to develop a cutting-edge high-performance computing (HPC) platform integrating SEMIFIVE's CPU chiplet with a third-party I/O chiplet into a unified package.
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ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform (Wednesday Oct. 16, 2024)
ADTechnology has announced a collaboration with Samsung Foundry, Arm, and Rebellions to develop a next-generation AI CPU chiplet platform based on chiplet technology.
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Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec's Automotive Chiplet Program (Thursday Oct. 10, 2024)
Imec invites the global automotive ecosystem to join its effort to mutually explore the opportunities presented by chiplet technology
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Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production (Tuesday Oct. 08, 2024)
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage.
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Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets (Tuesday Sep. 10, 2024)
Faraday Technology today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services - design, packaging, and production.
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YorChip announces Low Latency 200G Chiplet for edge AI (Wednesday Jun. 19, 2024)
YorChip Chiplet supports both Advanced and Standard UCIe packaging options and features 4 x 56G Long Reach PHY for a total bandwidth of 200Gbps.
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Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet (Thursday Jun. 06, 2024)
Alphawave Semi’s chiplet-based custom silicon design platform adds a differentiator in our portfolio that includes IO extension chiplets, memory chiplets, and compute chiplets, as well as Alphawave Semi’s ultra-high-speed connectivity IP and advanced packaging capabilities.
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YorChip announces partnership with Digitho for enabling Secure Chiplets (Monday Feb. 05, 2024)
The supply chain and security of Chiplets are critical to assuring Known Good Die (KGD) are being used in final assembly – one defective Chiplet means entire package of Chiplets may become scrap.
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YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona (Wednesday Jan. 17, 2024)
YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona.