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Deals / Success Stories News

• Hailo Selects Avnet ASIC as Channel Partner for TSMC Silicon Production (Thursday Apr. 10, 2025)
  Avnet ASIC announced today that it has been selected by Hailo, the pioneering chipmaker of edge artificial intelligence (AI) processors, as its silicon channel partner for future chips on its product roadmap. Avnet ASIC, one of a select number of TSMC-certified Value Chain Aggregators (VCA), has already completed two projects with Hailo.
  
  
• JPEG XS Technology Integrated by Cobalt Digital with intoPIX TicoXS FIP Codec, supporting High Profile and new TDC Profile (Tuesday Apr. 08, 2025)
  intoPIX’s TicoXS FIP Codec Enables Cobalt Digital to Offer High-Quality, Low-Latency Encoding and Decoding for SMPTE 2110, IPMX and Cloud Workflows
  
  
• Latest intoPIX JPEG XS Codec Powers FOR-A's FA-1616 for Efficient IP Production at NAB 2025 (Thursday Apr. 03, 2025)
  intoPIX, a leader in lightweight video compression, announces the integration of its JPEG XS technology into FOR-A FA-1616, a multi-channel signal processor designed for high-end broadcast and professional video applications.
  
  
• BrainChip Partners with RTX's Raytheon for AFRL Radar Contract (Wednesday Apr. 02, 2025)
  BrainChip, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI, today announced that it is partnering with Raytheon Company, an RTX business, to service a contract for $1.8M from the Air Force Research Laboratory on neuromorphic radar signaling processing.
  
  
• Movellus and RTX's SEAKR Engineering Collaborate on Advancing Mission-Critical ASICs (Tuesday Apr. 01, 2025)
  Movellus announced today that RTX’s, SEAKR Engineering, LLC, selected the Aeonic™ Generate Intellectual Property (IP) Platform for its next-generation radiation-tolerant ASIC designs.
  
  
• Village Island Enhances its AI100 with intoPIX's JPEG XS Technology for Advanced Real-Time Analysis (Tuesday Apr. 01, 2025)
  intoPIX announces the successful addition of its JPEG XS technology to the new Village Island  AI100 system. The AI100 is a professional real-time test and measurement analyzer that offers comprehensive ST 2110 support.
  
  
• intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production (Friday Mar. 28, 2025)
  Leveraging intoPIX’s SMPTE ST 2110-22 JPEG XS technology, the IPX-100 now supports visually lossless video compression with imperceptible latency, making remote production over IP more efficient than ever. With selectable compression levels, users can optimize bandwidth usage while preserving image quality, allowing for seamless 4K/UHD transport over 1GbE or 10GbE networks.
  
  
• EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract (Thursday Mar. 27, 2025)
  EnSilica is pleased to announce that it has been awarded an $18m design and supply contract by a leading European based supplier of electromechanical products for an Arm-based mixed signal sensor interface ASIC to be used across a range of automotive and industrial applications.
  
  
• Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design (Thursday Mar. 27, 2025)
  Silvaco’s FlexCAN controller is compliant with ISO 11898-1 and supports the CAN Flexible Data Rate (CAN-FD), which defines the parameters for digital information exchange between modules utilizing the CAN data link layer.
  
  
• intoPIX JPEG XS Cores Power Delta Video's IP Video Transmission Solutions (Wednesday Mar. 26, 2025)
  intoPIX has integrated its JPEG XS technology into Delta Digital Video’s 5480 Series Encoder and Decoder, enabling ultra-low latency and bandwidth-efficient IP video transmission.
  
  
• Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology (Tuesday Mar. 18, 2025)
  Arteris’ FlexNoC network-on-chip (NoC) interconnect IP with the Functional Safety option provides Nextchip with optimal flexibility and superior performance to advance automotive technology including vision-based sensing edge to central architecture for ADAS.
  
  
• BOS Semiconductors Signed Development Contract for ADAS Chiplet SoC with an European OEM (Wednesday Mar. 12, 2025)
  The development contract includes BOS’ s recently introduced Eagle-N (250 TOPS of automotive AI accelerator) and Eagle-A (stand-alone ADAS SoC) in the chiplet system configuration using a high-speed UCIe interface.
  
  
• Kudelski IoT and u-blox collaborate to bring advanced security to autonomous driving, drones and agricultural applications (Tuesday Mar. 11, 2025)
  Kudelski’s Security IP integrated with u-blox’s latest X20 all-band high-precision GNSS chipset provides highly robust security and trust for GNSS applications such as autonomous driving, drones and agricultural applications.
  
  
• Imagination GPU Powers Renesas R-Car Gen 5 SoC (Monday Mar. 10, 2025)
  The IMG BXS graphics processor licensed by Renesas has the parallel processing capabilities to manage the immersive graphics and mixed criticality workloads of emerging automotive systems. It is considerably more efficient at translating its theoretical performance (TFLOPS) into real-world performance (FPS) when compared to competition solutions.
  
  
• EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM (Thursday Mar. 06, 2025)
  EMASS to demonstrate 22nm solution in Weebit Nano booth at embedded world 2025
  
  
• AONDevices Partners with Faraday to Enhance Production Capabilities (Wednesday Mar. 05, 2025)
  AONDevices, a leader in super-low-power, high-accuracy edge AI solutions, is pleased to announce a strategic partnership with Faraday Technology Corporation, a renowned ASIC design service and silicon IP provider.
  
  
• Ceva and Sharp Collaborate on "Beyond 5G" IoT Terminals (Monday Mar. 03, 2025)
  Ceva today announced that Sharp Semiconductor Innovation Corporation (SSIC), a subsidiary of Sharp Corporation, has developed "ASUKA", a System-on-Chip (SoC) for Beyond 5G (6G) IoT terminals, based on scalable 5G modem platform IP, the Ceva-PentaG2.
  
  
• QuickLogic Announces $1.1M eFPGA IP Contract with new Defense Industrial Base Customer (Thursday Feb. 27, 2025)
  QuickLogic Corporation (NASDAQ: QUIK), a leading developer of embedded FPGA (eFPGA) IP and User Tools, ruggedized FPGAs, and Endpoint AI/ML solutions, is proud to announce its selection by a Defense Industrial Base company for eFPGA IP targeting the GlobalFoundries'® 12LP, 12nm low-power process.  IP delivery for this contract is scheduled during Q2 2025.
  
  
• Dolphin Semiconductor Provides High-Performance LDO Regulators in TSMC 22nm to Ingenic for IPC Applications (Thursday Feb. 27, 2025)
  Dolphin Semiconductor is proud to announce its collaboration with Ingenic, a key player in the high performance SoC design in China. Dolphin Semiconductor will provide Low Dropout (LDO) regulators in TSMC 22nm to Ingenic for camera applications, reinforcing its position as a trusted partner in power management IP solutions.
  
  
• BrainChip Collaborates with Onsor Technologies To Power Epileptic Seizure-Detecting Glasses (Wednesday Feb. 26, 2025)
  BrainChip today announced a collaboration with Onsor Technologies to enable an innovative approach using neuromorphic computing to predict epileptic seizures utilizing the Akida™ Platform in a wearable design.
  
  
• Qualitas Semiconductor entered into IP Licensing Agreement with a Leading Korean System Semiconductor Design Company (Friday Feb. 14, 2025)
  QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as "Qualitas") (KOSDAQ: 432720), a leading provider of high-speed interconnect solutions, has announced today that it has signed an IP licensing agreement with a leading Korean system semiconductor design company.
  
  
• ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio (Tuesday Feb. 11, 2025)
  Ceva today announced that ListenAI Technology (ListenAI), a pioneering leader in intelligent terminal system-on-chip (SoC) solutions, has licensed the Ceva-Waves Wi-Fi 6 IP to enhance its portfolio of Edge AI processors.
  
  
• Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip (Wednesday Feb. 05, 2025)
  Ceva today announced that WUQI Microelectronics, a leading semiconductor fabless company focus on connectivity and edge AI chips, has licensed and deployed the Ceva-Waves Wi-Fi 6 High-Performance STA IP platform in its WQ9201 Wi-Fi/Bluetooth combo chip.
  
  
• EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC (Thursday Jan. 30, 2025)
  EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.
  
  
• BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool (Monday Jan. 20, 2025)
  BrainChip today announced its integration into an innovative technology offering that leverages the Akida™ processor to provide cybersecurity protection for WiFi access, home router, small enterprise routers and other network access devices.
  
  
• Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella (Monday Jan. 20, 2025)
  Under this agreement, Ambarella will utilize Qualitas C/D-PHY IP, implemented on the 5nm process, to apply it to its next-generation AI engine, CVflow®-based SoCs (System-on-Chips).
  
  
• M31's 12nm GPIO IP Adopted by C*Core Technology, Powering Innovation in Advanced Process Automotive Chips (Thursday Jan. 09, 2025)
  M31 Technology (M31), a global leader in silicon intellectual property (IP), and C*Core Technology (C*Core) have announced the further deepening of collaboration, making a first joint entry into the advanced process technology field.
  
  
• Qualitas Semiconductor and Verisilicon signed a licensing agreement for 4nm PCIe 6.0 PHY IP (Thursday Jan. 09, 2025)
  QUALITAS SEMICONDUCTOR, a leading provider of high-speed interconnect solutions, has announced the supply of its 4nm PCIe 6.0 PHY IP to VeriSilicon Inc., a global design house.
  
  
• Ceva Powers Oritek's Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles (Wednesday Jan. 08, 2025)
  Lonquan 560 SoCs leverage Ceva-SensPro Vision AI DSP to advance ADAS capabilities amidst China's rapidly growing EV market and global shift towards more sustainable and intelligent transportation solutions
  
  
• Ceva Embedded AI NPUs Gain Traction in AIoT and MCU Markets, with Multiple Customer Wins and Enhanced AI Software Studio (Tuesday Jan. 07, 2025)
  Ceva today announced that its award-winning Ceva-NeuPro-Nano Embedded AI NPUs have gained significant traction in the AIoT and MCU markets, with multiple customer wins and an enhanced development studio that covers the full software design cycle for AI and embedded applications.