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Deals / Success Stories News

• BrainChip Awarded Air Force Research Laboratory Radar Development Contract (Tuesday Dec. 17, 2024)
  BrainChip today announced that it was awarded a development contract for $1.8M from Air Force Research Laboratory (AFRL) on neuromorphic radar signaling processing technologies.
  
  
• Frontgrade Gaisler Licenses BrainChip's Akida IP to Deploy AI Chips into Space (Monday Dec. 16, 2024)
  BrainChip today announced that Frontgrade Gaisler, a leading provider of radiation-hardened microprocessors for space applications, has licensed its Akida™ IP for incorporation into space-grade, fault-tolerant system-on-chip solutions for hardware AI acceleration.
  
  
• Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip (Wednesday Dec. 11, 2024)
  Jmem Tek’s PUF-based security chip, designed with Andes compact and efficient N25F RISC-V processor and Jmem Tek’s comprehensive hardware security module IP, is the world’s first NIST post-quantum cryptographic algorithm chip based on RISC-V. This collaboration brings customers an industrial-grade cyber-security solution designed to withstand future quantum computing threats.
  
  
• UPMEM selects Semidynamics RISC-V AI IP for Large Language Model Application (Monday Dec. 09, 2024)
  Semidynamics, the leading IP company for high performance, AI-enabled, RISC-V processors, is happy to announce that UPMEM has selected Semidynamics as its core provider for its next generation of LPDDR5X Processing In Memory device.
  
  
• Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU (Friday Dec. 06, 2024)
  Qualitas Semiconductor announced that its MIPI D-PHY IP has been integrated into an artificial intelligence (AI) and vision processing microprocessor (MPU) developed by Renesas Electronics. The relationship between Qualitas and Renesas began in 2021, when they started collaborating on multiple successful projects.
  
  
• AST SpaceMobile and Cadence Collaborate to Advance the World's First and Only Planned Space-Based Global Cellular Broadband Network (Wednesday Dec. 04, 2024)
  Cadence Design Systems and AST SpaceMobile announced today their collaboration to advance AST SpaceMobile’s mission to eliminate connectivity gaps and connect people around the world with high-speed, space-based internet access.
  
  
• Arteris Deployed by Menta for Edge AI Chiplet Platform (Tuesday Dec. 03, 2024)
  Arteris Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Menta has deployed Arteris network-on-chip (NoC) IP in their MOSAICS-LP chiplet platform. The NoC addresses technical challenges related to performance and area efficiency in the company’s chiplet platform for edge and IoT computing for various applications including AI.
  
  
• SmartDV Licenses SDIO IP Family to Ranix for V2X Products (Tuesday Dec. 03, 2024)
  Collaboration will enhance communication and connectivity in ISO 26262 compliant V2X systems, accelerating innovation for safer and smarter automotive systems and vehicles
  
  
• Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards (Tuesday Nov. 19, 2024)
  FlexNoC 5 interconnect IP with physical awareness improves place and route efficiency and reduces interconnect area and power consumption.
  
  
• Grass Valley Adds JPEG XS Support to AMPP, Powered by intoPIX FastTicoXS Technology, Enhancing Cloud-Based Live Production (Friday Nov. 15, 2024)
  intoPIX today announced that its innovative JPEG XS software technology now powers the support of JPEG XS VSF TR-07 within Grass Valley’s Agile Media Processing Platform (AMPP).
  
  
• LG and Tenstorrent Expand Partnership to Enhance AI Chip Capabilities (Thursday Nov. 14, 2024)
  Through this partnership, LG aims to enhance its design and development capabilities for AI chips tailored to its products and services, aligning with its vision of “Affectionate Intelligence.” LG is dedicated to advancing AI-driven innovation, with a focus on enhancing its AI-powered home appliances and smart home solutions, as well as expanding its capabilities in future mobility and commercial applications.
  
  
• intoPIX and Media Links: Powering Next-Generation IP Media Transport with JPEG XS at InterBEE 2024 (Tuesday Nov. 12, 2024)
  intoPIX is excited to announce that its advanced JPEG XS technology, TicoXS, is now integrated into the Media Links Xscend platform, an IP Media Platform designed for transporting up to 128 high-quality media services across managed and unmanaged IP networks.
  
  
• Oriole Networks Selects EnSilica as ASIC Partner and Contract Award for Photonics Controller ASIC (Monday Nov. 11, 2024)
  EnSilica is pleased to announce that it has been selected by Oriole Networks, a developer of artificial intelligence (“AI”) optimisation technology, as its ASIC partner. EnSilica has also been awarded a contract for the design and supply of Oriole's Photonics Controller ASICs to be used in its optical network switch products.
  
  
• intoPIX JPEG XS Powers Village Island's VICO-2L-XS for Cost-effective SDI/IP Conversion (Thursday Nov. 07, 2024)
  intoPIX announces the integration of its JPEG XS technology into Village Island’s VICO-2L-XS.
  
  
• Tenstorrent Expands Deployment of Arteris' Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions (Tuesday Nov. 05, 2024)
  
  
  
• PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC (Thursday Oct. 31, 2024)
  Ceva-SensPro2 DSP supports audio/video/sensor fusion processing in S300 edge computing chip for wearables, cameras, smart healthcare and more
  
  
• DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU) (Wednesday Oct. 30, 2024)
  Through the agreement, DENSO will acquire the intellectual property (IP) core license for Quadric's Chimera general purpose NPU (GPNPU) and the two companies will co-develop IP for an in-vehicle semiconductor.
  
  
• Arteris Selected by TIER IV for Intelligent Vehicles (Tuesday Oct. 29, 2024)
  FlexNoC 5 network-on-chip IP and Magillem Connectivity SoC integration automation software accelerate autonomous driving chip project timelines while meeting automotive functional safety and performance requirements and reducing the development risks.
  
  
• DeepComputing and Andes Technology Partner to Develop the World's First RISC-V AI PC with 7nm QiLai SoC, Featuring Ubuntu Desktop (Tuesday Oct. 22, 2024)
  Together, the two companies collaborate to develop the world’s first RISC-V AI PC, powered by Andes’ 7nm QiLai SoC.
  
  
• Fractile Licenses Andes Technology's RISC-V Vector Processor as It Builds Radical New Chip to Accelerate AI Inference (Tuesday Oct. 22, 2024)
  Andes Technology are proud to announce a partnership with Fractile, the company building the chips and systems needed to reach the next frontier of AI performance.
  
  
• EnSilica plc - Award of £2 million Controller ASIC Design Services Contract (Monday Oct. 21, 2024)
  EnSilica is pleased to announce that it has been awarded an ASIC design services contract with a prestigious supplier of power and propulsion systems used in the air, at sea, and on land (the “Contract”).
  
  
• EnSilica - Design and Supply contract award for a controller ASIC for automotive and industrial markets (Thursday Oct. 17, 2024)
  EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased to announce that it has been awarded a design and supply contract for a mixed signal controller ASIC to be used in automotive and industrial motorised actuators.
  
  
• Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company (Wednesday Oct. 16, 2024)
  Chip Interfaces is pleased to announce that the Industry’s first commercially available JESD204D IP core has been taped out with a Tier 1 semiconductor company
  
  
• SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel (Friday Oct. 11, 2024)
  SEMIFIVE has announced the conclusion of a contract with HyperAccel to develop a generative AI chip, Bertha, for mass production.
  
  
• Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs (Thursday Oct. 03, 2024)
  Crypto Quantique has announced a collaboration with ADLINK Technology Inc., a global leader in edge computing, to simplify the secure boot process for industrial PCs (IPCs) using its QuarkLink security platform.
  
  
• EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP (Wednesday Oct. 02, 2024)
  EXTOLL has been selected by Frontgrade Technologies, a leading provider of mission critical electronics for aerospace and defense, as a key SerDes IP block supplier for its ASIC development portfolio.
  
  
• SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment (Thursday Sep. 26, 2024)
  SIAE MICROELETTRONICA has selected EnSilica to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.
  
  
• EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP (Thursday Sep. 26, 2024)
  EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BAE Systems as a key partner for the STEAM PIPE project to provide a power-optimized very short-reach SerDes IP solution.
  
  
• GUC Announces Adoption of HBM3E IP by CSP Data Center (Tuesday Sep. 24, 2024)
  Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and several High-Performance Computing (HPC) solution providers.
  
  
• SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller (Tuesday Sep. 24, 2024)
  Dolphin Design, the leader in Power management IP, and SigmaSense, the leader in direct-to-digital precision sensing, today announced a partnership to deliver Dolphin Design’s advanced power management solutions in the development of SigmaSense’s latest touch controller SDC300, now in volume production.