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Deals / Success Stories News

• QuickLogic Announces $1.1M eFPGA IP Contract with new Defense Industrial Base Customer (Thursday Feb. 27, 2025)
  QuickLogic Corporation (NASDAQ: QUIK), a leading developer of embedded FPGA (eFPGA) IP and User Tools, ruggedized FPGAs, and Endpoint AI/ML solutions, is proud to announce its selection by a Defense Industrial Base company for eFPGA IP targeting the GlobalFoundries'® 12LP, 12nm low-power process.  IP delivery for this contract is scheduled during Q2 2025.
  
  
• Dolphin Semiconductor Provides High-Performance LDO Regulators in TSMC 22nm to Ingenic for IPC Applications (Thursday Feb. 27, 2025)
  Dolphin Semiconductor is proud to announce its collaboration with Ingenic, a key player in the high performance SoC design in China. Dolphin Semiconductor will provide Low Dropout (LDO) regulators in TSMC 22nm to Ingenic for camera applications, reinforcing its position as a trusted partner in power management IP solutions.
  
  
• BrainChip Collaborates with Onsor Technologies To Power Epileptic Seizure-Detecting Glasses (Wednesday Feb. 26, 2025)
  BrainChip today announced a collaboration with Onsor Technologies to enable an innovative approach using neuromorphic computing to predict epileptic seizures utilizing the Akida™ Platform in a wearable design.
  
  
• Qualitas Semiconductor entered into IP Licensing Agreement with a Leading Korean System Semiconductor Design Company (Friday Feb. 14, 2025)
  QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as "Qualitas") (KOSDAQ: 432720), a leading provider of high-speed interconnect solutions, has announced today that it has signed an IP licensing agreement with a leading Korean system semiconductor design company.
  
  
• ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio (Tuesday Feb. 11, 2025)
  Ceva today announced that ListenAI Technology (ListenAI), a pioneering leader in intelligent terminal system-on-chip (SoC) solutions, has licensed the Ceva-Waves Wi-Fi 6 IP to enhance its portfolio of Edge AI processors.
  
  
• Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip (Wednesday Feb. 05, 2025)
  Ceva today announced that WUQI Microelectronics, a leading semiconductor fabless company focus on connectivity and edge AI chips, has licensed and deployed the Ceva-Waves Wi-Fi 6 High-Performance STA IP platform in its WQ9201 Wi-Fi/Bluetooth combo chip.
  
  
• EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC (Thursday Jan. 30, 2025)
  EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.
  
  
• BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool (Monday Jan. 20, 2025)
  BrainChip today announced its integration into an innovative technology offering that leverages the Akida™ processor to provide cybersecurity protection for WiFi access, home router, small enterprise routers and other network access devices.
  
  
• Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella (Monday Jan. 20, 2025)
  Under this agreement, Ambarella will utilize Qualitas C/D-PHY IP, implemented on the 5nm process, to apply it to its next-generation AI engine, CVflow®-based SoCs (System-on-Chips).
  
  
• M31's 12nm GPIO IP Adopted by C*Core Technology, Powering Innovation in Advanced Process Automotive Chips (Thursday Jan. 09, 2025)
  M31 Technology (M31), a global leader in silicon intellectual property (IP), and C*Core Technology (C*Core) have announced the further deepening of collaboration, making a first joint entry into the advanced process technology field.
  
  
• Qualitas Semiconductor and Verisilicon signed a licensing agreement for 4nm PCIe 6.0 PHY IP (Thursday Jan. 09, 2025)
  QUALITAS SEMICONDUCTOR, a leading provider of high-speed interconnect solutions, has announced the supply of its 4nm PCIe 6.0 PHY IP to VeriSilicon Inc., a global design house.
  
  
• Ceva Powers Oritek's Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles (Wednesday Jan. 08, 2025)
  Lonquan 560 SoCs leverage Ceva-SensPro Vision AI DSP to advance ADAS capabilities amidst China's rapidly growing EV market and global shift towards more sustainable and intelligent transportation solutions
  
  
• Ceva Embedded AI NPUs Gain Traction in AIoT and MCU Markets, with Multiple Customer Wins and Enhanced AI Software Studio (Tuesday Jan. 07, 2025)
  Ceva today announced that its award-winning Ceva-NeuPro-Nano Embedded AI NPUs have gained significant traction in the AIoT and MCU markets, with multiple customer wins and an enhanced development studio that covers the full software design cycle for AI and embedded applications.
  
  
• Qualitas Semiconductor Secures Multiple Project Licensing Agreements with Pansemi Following Successful Initial Collaboration (Tuesday Jan. 07, 2025)
  QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as QUALITAS) (QUALITAS, KOSDAQ: 432720), a leading provider of high-speed interconnect IP, has announced the multiple project licensing agreements with Pansemi, a Chinese SoC (System on Chip) design specialist.
  
  
• Ceva Wi-Fi 6 and Bluetooth IPs Power Bestechnic's New Combo Products (Monday Jan. 06, 2025)
  Bestechnic integrates market leading Ceva-Waves Wi-Fi 6 IP together with Ceva-Waves Bluetooth Dual Mode IP in low power silicon products targeting smart wearables, smart home and smart audio applications
  
  
• MediaTek and Ceva Collaborate for More Immersive Spatial Audio Mobile Entertainment Experience (Monday Jan. 06, 2025)
  Companies partner to bring Ceva-RealSpace Elevate multi-channel spatial audio solution with head tracking to the MediaTek Dimensity 9400 flagship 5G smartphone chip, delivering immersive audio experiences to True Wireless Stereo (TWS) earbuds and headphones using Bluetooth® LE Audio
  
  
• Weebit Nano licenses its ReRAM technology to onsemi (Thursday Jan. 02, 2025)
  Weebit Nano Limited (ASX:WBT) (Weebit or Company), a leading developer and licensor of advanced memory technologies for the global semiconductor industry, has licensed its resistive random access memory (ReRAM) technology to tier-1 semiconductor supplier, onsemi (Nasdaq:ON).
  
  
• BrainChip Awarded Air Force Research Laboratory Radar Development Contract (Tuesday Dec. 17, 2024)
  BrainChip today announced that it was awarded a development contract for $1.8M from Air Force Research Laboratory (AFRL) on neuromorphic radar signaling processing technologies.
  
  
• Frontgrade Gaisler Licenses BrainChip's Akida IP to Deploy AI Chips into Space (Monday Dec. 16, 2024)
  BrainChip today announced that Frontgrade Gaisler, a leading provider of radiation-hardened microprocessors for space applications, has licensed its Akida™ IP for incorporation into space-grade, fault-tolerant system-on-chip solutions for hardware AI acceleration.
  
  
• Jmem Tek and Andes Technology Partner on the World' s First Quantum-Secure RISC-V Chip (Wednesday Dec. 11, 2024)
  Jmem Tek’s PUF-based security chip, designed with Andes compact and efficient N25F RISC-V processor and Jmem Tek’s comprehensive hardware security module IP, is the world’s first NIST post-quantum cryptographic algorithm chip based on RISC-V. This collaboration brings customers an industrial-grade cyber-security solution designed to withstand future quantum computing threats.
  
  
• UPMEM selects Semidynamics RISC-V AI IP for Large Language Model Application (Monday Dec. 09, 2024)
  Semidynamics, the leading IP company for high performance, AI-enabled, RISC-V processors, is happy to announce that UPMEM has selected Semidynamics as its core provider for its next generation of LPDDR5X Processing In Memory device.
  
  
• Qualitas Semiconductor's MIPI D-PHY IP Powers Mass Production of Renesas AI MPU (Friday Dec. 06, 2024)
  Qualitas Semiconductor announced that its MIPI D-PHY IP has been integrated into an artificial intelligence (AI) and vision processing microprocessor (MPU) developed by Renesas Electronics. The relationship between Qualitas and Renesas began in 2021, when they started collaborating on multiple successful projects.
  
  
• AST SpaceMobile and Cadence Collaborate to Advance the World's First and Only Planned Space-Based Global Cellular Broadband Network (Wednesday Dec. 04, 2024)
  Cadence Design Systems and AST SpaceMobile announced today their collaboration to advance AST SpaceMobile’s mission to eliminate connectivity gaps and connect people around the world with high-speed, space-based internet access.
  
  
• Arteris Deployed by Menta for Edge AI Chiplet Platform (Tuesday Dec. 03, 2024)
  Arteris Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Menta has deployed Arteris network-on-chip (NoC) IP in their MOSAICS-LP chiplet platform. The NoC addresses technical challenges related to performance and area efficiency in the company’s chiplet platform for edge and IoT computing for various applications including AI.
  
  
• SmartDV Licenses SDIO IP Family to Ranix for V2X Products (Tuesday Dec. 03, 2024)
  Collaboration will enhance communication and connectivity in ISO 26262 compliant V2X systems, accelerating innovation for safer and smarter automotive systems and vehicles
  
  
• Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards (Tuesday Nov. 19, 2024)
  FlexNoC 5 interconnect IP with physical awareness improves place and route efficiency and reduces interconnect area and power consumption.
  
  
• Grass Valley Adds JPEG XS Support to AMPP, Powered by intoPIX FastTicoXS Technology, Enhancing Cloud-Based Live Production (Friday Nov. 15, 2024)
  intoPIX today announced that its innovative JPEG XS software technology now powers the support of JPEG XS VSF TR-07 within Grass Valley’s Agile Media Processing Platform (AMPP).
  
  
• LG and Tenstorrent Expand Partnership to Enhance AI Chip Capabilities (Thursday Nov. 14, 2024)
  Through this partnership, LG aims to enhance its design and development capabilities for AI chips tailored to its products and services, aligning with its vision of “Affectionate Intelligence.” LG is dedicated to advancing AI-driven innovation, with a focus on enhancing its AI-powered home appliances and smart home solutions, as well as expanding its capabilities in future mobility and commercial applications.
  
  
• intoPIX and Media Links: Powering Next-Generation IP Media Transport with JPEG XS at InterBEE 2024 (Tuesday Nov. 12, 2024)
  intoPIX is excited to announce that its advanced JPEG XS technology, TicoXS, is now integrated into the Media Links Xscend platform, an IP Media Platform designed for transporting up to 128 high-quality media services across managed and unmanaged IP networks.
  
  
• intoPIX JPEG XS Powers Village Island's VICO-2L-XS for Cost-effective SDI/IP Conversion (Thursday Nov. 07, 2024)
  intoPIX announces the integration of its JPEG XS technology into Village Island’s VICO-2L-XS.