5/10/40G Ultra Low Latency MAC PCS with AXI-4 and UCIe support
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Deals / Success Stories News
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Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI (Monday Oct. 19, 2020)
The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired by Dialog Semiconductor in 2020. GLOBALFOUNDRIES will first offer Dialog’s CBRAM as an embedded, non-volatile memory (NVM) option on its 22FDX® platform, with the plan to extend to other platforms.
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Arteris IP FlexNoC Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging Solutions (Tuesday Oct. 13, 2020)
Arteris IP today announced that KYOCERA Document Solutions Inc. (“Kyocera”) has licensed Arteris® FlexNoC® interconnect IP for use as the on-chip communications backbone of its custom systems-on-chip (SoC) powering its flagship enterprise document imaging and management solutions.
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Innosilicon selects Imagination's new BXT Multi-Core GPU IP for cloud computing (Tuesday Oct. 13, 2020)
Using its highly innovative SoC and chiplet architectures, Innosilicon have integrated the newly launched IMG B-Series BXT multi-core GPU IP in PCI-E form-factor GPU SoCs for desktop and data centre applications.
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OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset (Tuesday Oct. 13, 2020)
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Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor' (Monday Oct. 12, 2020)
Numem, the leading provider of NuRAM & SmartMem Smart Compute Memory IP Cores based on MRAM, has been selected for Phase I of the “DNN Radiation Hardened Co-processor as companion chip to NASA’s upcoming High-Performance Spaceflight Computing Processor” to enable AI processing.
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Instrumentation Technology Systems adds intoPIX TICO-XS to their upcoming NetVIDxs (Thursday Oct. 08, 2020)
intoPIX is proud that Instrumentation Technology Systems, the market-leading supplier of HD-SDI video-data fusion products, adds intoPIX TICO-XS technology in their NetVIDxs products.
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Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System (Wednesday Oct. 07, 2020)
Movellus announced today that Everactive has adopted Movellus’ ultra-low power clocking solution for its batteryless Machine Health Monitoring (MHM) IoT product. Everactive’s core SoC is clocked by Movellus ultra low power PLL.
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Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs (Thursday Oct. 01, 2020)
Renesas selected the AndesCore™ IP 32-bit RISC-V CPU cores to embed into its new application-specific standard products that will begin customer sampling in the second half of 2021.
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Arteris IP FlexNoC Interconnect Products Again Licensed by Samsung Foundry for Worldwide Use (Wednesday Sep. 30, 2020)
Arteris IP today announced that the Samsung Foundry has again licensed Arteris FlexNoC Interconnect IP for use by its worldwide networking, mobile, Internet engine, consumer, and automotive customers.
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Moortec's In-Chip Sensing Fabric Enables Deeply Embedded Monitoring of Dynamic Conditions for Picocom's Baseband SoC for 5G Small Cells (Wednesday Sep. 30, 2020)
Moortec, the go-to leaders of innovative in-chip monitoring solutions today announced that its complete in-chip sensing fabric has been selected by Picocom, the 5G Open RAN baseband semiconductor and software specialist, in order to improve power consumption, performance and reliability for its compelling system-on-chip (SoC) for 5G small cell infrastructure.
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Nordic Semiconductor to ship its billionth Arm Cortex-M based wireless SoC in October (Wednesday Sep. 30, 2020)
Nordic Semiconductor will reach a major new commercial milestone in early October this year, having shipped more than one billion Arm® Cortex®-M based ultra-low power wireless SoCs in just eight years.
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Bluetooth Dual Mode v5.2 Protocol Stack SW, Profiles & LC3 codec licensed to leading Tier 1 Company for ultra-low power TWS Hearable Audio SoC (Monday Sep. 28, 2020)
T2MIP, the global independent semiconductor IP technology & SW provider, is pleased to announce the licensing of its’ partners Bluetooth Dual Mode v5.2 Protocol Stack SW, Profiles and LC3 codec IP to a Tier 1 Semiconductor company for use in its ultra-low power True Wireless Stereo (TWS) Earbud/Hearing Aid SoCs.
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NSITEXE selects Imperas RISC-V and Vectors Reference Model (Thursday Sep. 24, 2020)
Imperas today confirmed the selection by NSITEXE, Inc., a group company of the DENSO Corporation that develops and sells high-performance semiconductor IPs, for the development and verification of the next generation Automotive processor IP based on RISC-V with vector instruction extension.
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Silex Insight's Public Key Cryptography Selected for Fungible's Groundbreaking DPU (Wednesday Sep. 23, 2020)
Silex Insight, a leading provider of embedded security IP cores, has entered into an agreement with Fungible Inc., a leading developer of hardware and software solutions to improve the performance, economics, reliability and security of data centers, to deliver asymmetric key acceleration IP for the industry’s first DPU.
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Arteris IP FlexNoC & Resilience Package Support SemiDrive ISO 26262-Compliant Chip Production (Tuesday Sep. 22, 2020)
Arteris IP today announced that SemiDrive’s new ISO 26262-compliant smart e-cockpit, central gateway, autonomous driving and ADAS chips are powered by Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package as the on-chip communications backbone.
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Analog Bits Provides Enabling IP for Graphcore IPU-Machine M2000 (Friday Sep. 18, 2020)
Analog Bits’ low power, wide-range integer/fractional, ultra-low jitter PLL and small footprint, integrated sensor for PVT and power supply monitoring, both in 7nm were key IP for the design to deliver reliable clocking and power management
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Cobham Gaisler Awarded ESA Contract for Development and Validation of New LEON3FT Microcontroller for Space Applications (Thursday Sep. 17, 2020)
Cobham Gaisler announced today that it has received a contract from the European Space Agency (ESA) for the development and validation of a new mixed-signal LEON3FT microcontroller. This development helps meet market demands for high reliability, radiation-hardened microcontrollers based on the existing LEON processor technology.
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Arteris IP FlexNoC Interconnect Licensed by VITEC for High Resolution Video Encoder and Decoder Chips (Tuesday Sep. 15, 2020)
Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that VITEC has licensed Arteris FlexNoC Interconnect IP for use in its high resolution video encoder and decoder systems.
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HDMI 2.1 Rx PHY (TSMC 12FFC) & Controller Semiconductor IP licensed to a Tier1 Chinese Semiconductor company for integration into a TV SOC by T2MIP (Tuesday Sep. 15, 2020)
T2MIP, the global independent semiconductor IP provider, is pleased to announce the licensing of its partners silicon proven HDMI 2.1 Rx PHY (TSMC 12FFC) & Controller Semiconductor IP to a Tier -1 Chinese Semiconductor company.
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DSP Group Selects Synopsys' ARC EM Processor IP for Adaptive Processing Smart Codecs (Thursday Sep. 10, 2020)
Synopsys today announced that DSP Group selected Synopsys DesignWare® ARC® EM5D Processor IP for its high-efficiency control and signal processing capabilities to enable development of its DBMC2-TWS advanced adaptive processing audio codec for true wireless stereo (TWS) headsets.
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Chips&Media Announces Making the First License Deal of Upscaling HW IP, c.WAVE120 (Thursday Sep. 03, 2020)
Chips&Media, the leading global provider of video and computer vision HW IPs, today announced making its first license deal of super-resolution HW IP, c.WAVE120, to one of the largest top-tier television and set-top box System-on-Chip (SoC) companies located in Taiwan.
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Kneron Boosts On-Device Edge AI Computing Performance with Cadence Tensilica IP (Thursday Sep. 03, 2020)
Cadence today announced that Kneron, a leading provider of on-device edge AI solutions, has integrated the Cadence® Tensilica® Vision P6 DSP in its next-generation KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveillance, security, robotics and industrial control applications.
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Chelsio Adopts Synopsys DesignWare 56G Ethernet PHY IP to Accelerate Development of High-Performance Computing SoC (Thursday Aug. 27, 2020)
Synopsys, Inc. (Nasdaq: SNPS) today announced that Chelsio has adopted its silicon-proven DesignWare® 56G Ethernet PHY IP to accelerate development of Chelsio's System-on-Chip (SoC) design targeting high-performance smart network interface card (NIC) and server applications.
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NSITEXE Adopts Synopsys HAPS Prototyping to Validate Data Flow Processor IP (Thursday Aug. 20, 2020)
Synopsys, Inc. (Nasdaq: SNPS) today announced that NSITEXE adopted Synopsys HAPS®-80 prototyping solution to develop their current and next-generation Data Flow Processor (DFP) IP portfolio.
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Subaru Selects Xilinx to Power New-Generation EyeSight System (Thursday Aug. 20, 2020)
Xilinx today announced that its technology is powering the new version of Subaru’s vision-based advanced driver-assistance system (ADAS), EyeSight. Integrated into the all-new Subaru Levorg, the new EyeSight system will provide advanced features including adaptive cruise control, lane-keep assist and pre-collision braking, putting best-in-class safety technology into the hands of consumers.
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SiFive and Innovium Announce Collaboration to Accelerate Innovation in Data Center Networking (Tuesday Aug. 18, 2020)
Innovium TERALYNX® products integrate SiFive RISC-V processor cores to increase lead in breakthrough switch silicon for Cloud and Edge data center networks
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Mixel's Patented D-PHY RX+ IP Extends Market Share with Automotive Microcontrollers (Tuesday Aug. 18, 2020)
Mixel®, a leading provider of mixed-signal intellectual property (IP) announced today that Mixel’s patented MIPI® IP solution, MIPI D-PHY RX+, continues to expand its market share and provide advanced features for automotive microcontrollers.
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Silicon Creations' SerDes Technology Designed into Novatek 8K TV SoC on TSMC 12nm Process (Monday Aug. 17, 2020)
Silicon Creations announced today that its Deserializer PMA (Physical Media Attachment) technology has been deployed as a V-by-One HS receiver in an SoC designed by Novatek Microelectronics Corp. for an 8K digital TV application.
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CEVA NB-IoT IP Achieves Monumental Milestone; Awarded Full Certification from Deutsche Telekom (Wednesday Aug. 12, 2020)
CEVA-Dragonfly NB2 turnkey solution is industry’s first and only licensable NB-IoT IP to receive full certification from one of the world’s largest mobile network operators
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Picocom Embeds 32 Andes N25F RISC-V Cores into Its 5G NR Small Cell Baseband SoC (Tuesday Aug. 04, 2020)
Picocom has selected the AndesCore N25F RISC-V 32-bit core integrated with the AE350 peripherals platform for its forthcoming 5G small cell distributed unit (DU) System-on-Chip (SoC). Picocom is a 5G open RAN baseband semiconductor company with vast experience in the field of small cells.