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Deals / Success Stories News

• CAST JPEG IP Cores Deliver Outstanding Results in the New High Resolution LXT Cameras by Baumer (Friday Dec. 11, 2020)
  CAST, Inc. has received accolades by Baumer, Ltd., one of the worldwide leading manufacturers of components for automated image processing, for its JPEG image compression IP cores that have been integrated in their new LXT camera series.
  
  
• Daiteq Selected as the First ESA NOEL-V User (Friday Dec. 11, 2020)
  Cobham Advanced Electronic Solutions (CAES), a leading provider of mission critical electronic solutions, proudly announced from the RISC-V Summit that its new NOEL-V processor model developed out of its design center, Cobham Gaisler, is in use by daiteq’s European Space Agency (ESA) research activity, “Evaluation and Instruction Set Extension of a RISC-V Soft Core for Space.”
  
  
• C-DAC Selects Valtrix STING For Design Verification Of RISC-V Based Microprocessors (Tuesday Dec. 08, 2020)
  Valtrix Systems announced today that Centre for Development of Advanced Computing (C-DAC), a premier R&D organization of Government of India, has licensed STING for the verification of RISC-V based designs being developed for use in a number of strategic sectors.
  
  
• OpenFive Licenses Flex Logix's eFPGA to Develop a Low Power Communications SoC Requiring a Large eFPGA (Monday Dec. 07, 2020)
  Flex Logix® Technologies, Inc., supplier of the fastest and most-efficient AI edge inference accelerator and the leading supplier of eFPGA IP, announced today that OpenFive, a leading provider of domain-specific custom silicon solutions with differentiated IP, has licensed the EFLXÒ eFPGA for use in a low power communications SoC, powerful and flexible enough to be used in data center and edge applications, for a mutual customer of OpenFive and Flex Logix.
  
  
• Faraday Supplies 28eHV Memory Compilers for Mobile OLED Display Driver IC (Thursday Nov. 26, 2020)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its memory compilers based on UMC’s 28nm embedded High Voltage (eHV) process technology have been subsequently used by major mobile OLED driver IC customers in multiple project tapeouts.
  
  
• SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge (Thursday Nov. 19, 2020)
  SiMa.ai™, the machine learning company enabling high performance compute at the lowest power, today announced the adoption of low-power Arm® compute technology to build its purpose-built Machine Learning SoC (MLSoC™) platform.
  
  
• Bouffalo Lab Standardizes on SiFive RISC-V Embedded CPU Core IP for New IoT Products (Wednesday Nov. 18, 2020)
  SiFive and Bouffalo Lab today announced the adoption of SiFive E2-Series Core IP based on RISC-V as part of Bouffalo’s new IoT Bluetooth, Zigbee, Thread and WiFi products, the BL70x and BL602.
  
  
• Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications (Tuesday Nov. 17, 2020)
  T2M-IP, the global independent semiconductor IP Cores & Technology provider, is pleased to announce the licensing of its Ultra-low power Multi-Constellation GNSS Digital IP for integration into a NB-IOT SoC for lOT logistical and wearable applications.
  
  
• CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC (Wednesday Nov. 11, 2020)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).
  
  
• Imagination's new BXS GPU enables automotive graphics in Texas Instruments processor family (Wednesday Nov. 04, 2020)
  Imagination Technologies announces that its BXS-4-64 GPU will be included in Texas Instruments (TI) Jacinto™ processor families for automotive applications. BXS offers up to 60% higher performance for automotive graphics applications, like surround view technology, thanks to its bespoke design for the automotive market needs.
  
  
• Arteris IP FlexNoC Interconnect Products Licensed by Bosch for Multiple Automotive Chips (Tuesday Nov. 03, 2020)
  Arteris IP today announced that Bosch has licensed Arteris FlexNoC Interconnect IP and the accompanying Resilience Package for use in multiple ISO 26262-compliant automotive projects.
  
  
• NeuLinker Licenses Codasip Bk5 and Studio for Powering Innovative AI and Blockchain Solutions (Tuesday Nov. 03, 2020)
  Codasip GmbH, the leading supplier of customizable RISC-V® embedded processor IP, announced today that NeuLinker, a high-profile Beijing-based company focused on cutting-edge custom computing technologies, has selected Codasip’s Bk5 RISC-V-based core and the Codasip Studio customization toolset for their AI and security-powering solutions.
  
  
• Telink and Andes Announce the TLSR9 SoC with RISC-V Processor (Monday Nov. 02, 2020)
  Telink Semiconductor and Andes Technology are proud to introduce the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series.
  
  
• Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Processor (Thursday Oct. 29, 2020)
  Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, in collaboration with design services provider, VeriSilicon, has successfully supported the on-time market launch of AI Edge computing startup Blaize’s hardware platform, despite the COVID-19 pandemic.
  
  
• Realtek Semiconductor Selects Allegro DVT's H.266/VVC Compliance Streams (Thursday Oct. 29, 2020)
  Allegro DVT today announced that Realtek Semiconductor, one of the world’s largest and most successful fabless semiconductor companies, has selected Allegro DVT’s VVC test streams and will be used to ensure compliance of Realtek’s products with the new emerging VVC video compression standard.
  
  
• Mixel MIPI D-PHY IP Integrated Into Hercules Microelectronics Award-Winning FPGA/Processor (Tuesday Oct. 27, 2020)
  Mixel®, a leading provider of mixed-signal intellectual property (IP), and Hercules Microelectronics (HME), a China-based developer of programmable FPGA cores, announced today that Mixel’s MIPI® IP solution has been successfully integrated into HME-H1D03 FPGA and is in mass production.
  
  
• Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade (Thursday Oct. 22, 2020)
  Collaboration with IBM Research's AI Hardware Center Addresses the Challenges of Developing New AI Chip Architectures with Innovative Design Methodologies
  
  
• Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI (Monday Oct. 19, 2020)
  The resistive ram (ReRAM)-based technology was pioneered by Adesto Technologies which was recently acquired by Dialog Semiconductor in 2020. GLOBALFOUNDRIES will first offer Dialog’s CBRAM as an embedded, non-volatile memory (NVM) option on its 22FDX® platform, with the plan to extend to other platforms.
  
  
• Arteris IP FlexNoC Interconnect Again Licensed by KYOCERA for Enterprise Printing and Imaging Solutions (Tuesday Oct. 13, 2020)
  Arteris IP today announced that KYOCERA Document Solutions Inc. (“Kyocera”) has licensed Arteris® FlexNoC® interconnect IP for use as the on-chip communications backbone of its custom systems-on-chip (SoC) powering its flagship enterprise document imaging and management solutions.
  
  
• Innosilicon selects Imagination's new BXT Multi-Core GPU IP for cloud computing (Tuesday Oct. 13, 2020)
  Using its highly innovative SoC and chiplet architectures, Innosilicon have integrated the newly launched IMG B-Series BXT multi-core GPU IP in PCI-E form-factor GPU SoCs for desktop and data centre applications.
  
  
• OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset (Tuesday Oct. 13, 2020)
  
  
  
• Numem Selected by NASA for 'DNN Radiation Hardened Co-Processor Companion Chip to NASA's Upcoming High-Performance Spaceflight Computing Processor' (Monday Oct. 12, 2020)
  Numem, the leading provider of NuRAM & SmartMem Smart Compute Memory IP Cores based on MRAM, has been selected for Phase I of the “DNN Radiation Hardened Co-processor as companion chip to NASA’s upcoming High-Performance Spaceflight Computing Processor” to enable AI processing.
  
  
• Instrumentation Technology Systems adds intoPIX TICO-XS to their upcoming NetVIDxs (Thursday Oct. 08, 2020)
  intoPIX is proud that Instrumentation Technology Systems, the market-leading supplier of HD-SDI video-data fusion products, adds intoPIX TICO-XS technology in their NetVIDxs products.
  
  
• Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System (Wednesday Oct. 07, 2020)
  Movellus announced today that Everactive has adopted Movellus’ ultra-low power clocking solution for its batteryless Machine Health Monitoring (MHM) IoT product. Everactive’s core SoC is clocked by Movellus ultra low power PLL.
  
  
• Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs (Thursday Oct. 01, 2020)
  Renesas selected the AndesCore™ IP 32-bit RISC-V CPU cores to embed into its new application-specific standard products that will begin customer sampling in the second half of 2021.
  
  
• Arteris IP FlexNoC Interconnect Products Again Licensed by Samsung Foundry for Worldwide Use (Wednesday Sep. 30, 2020)
  Arteris IP today announced that the Samsung Foundry has again licensed Arteris FlexNoC Interconnect IP for use by its worldwide networking, mobile, Internet engine, consumer, and automotive customers.
  
  
• Moortec's In-Chip Sensing Fabric Enables Deeply Embedded Monitoring of Dynamic Conditions for Picocom's Baseband SoC for 5G Small Cells (Wednesday Sep. 30, 2020)
  Moortec, the go-to leaders of innovative in-chip monitoring solutions today announced that its complete in-chip sensing fabric has been selected by Picocom, the 5G Open RAN baseband semiconductor and software specialist, in order to improve power consumption, performance and reliability for its compelling system-on-chip (SoC) for 5G small cell infrastructure.
  
  
• Nordic Semiconductor to ship its billionth Arm Cortex-M based wireless SoC in October (Wednesday Sep. 30, 2020)
  Nordic Semiconductor will reach a major new commercial milestone in early October this year, having shipped more than one billion Arm® Cortex®-M based ultra-low power wireless SoCs in just eight years.
  
  
• Bluetooth Dual Mode v5.2 Protocol Stack SW, Profiles & LC3 codec licensed to leading Tier 1 Company for ultra-low power TWS Hearable Audio SoC (Monday Sep. 28, 2020)
  T2MIP, the global independent semiconductor IP technology & SW provider, is pleased to announce the licensing of its’ partners Bluetooth Dual Mode v5.2 Protocol Stack SW, Profiles and LC3 codec IP to a Tier 1 Semiconductor company for use in its ultra-low power True Wireless Stereo (TWS) Earbud/Hearing Aid SoCs.
  
  
• Storage system based on WD 100Gb NVMe-oF Bridge ASIC with ePHY IP (Wednesday Jan. 29, 2020)