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Deals / Success Stories News

• Arteris IP Selected By ASICLAND for Automotive, AI Enterprise and AI Edge SoCs (Wednesday Apr. 12, 2023)
  The silicon-proven FlexNoC interconnect IP and supporting AI options from Arteris facilitate faster time to market and reduce design time for ASICLAND customers across various industries.
  
  
• APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC (Wednesday Apr. 12, 2023)
  Semiconductor intellectual property provider CAST today announced that design services provider APlabs, Inc., has chosen CAST IP for a new automobile system-on-chip APlabs is developing for a major Korean automaker.
  
  
• Lawo and intoPIX Partner to Deliver End-to-End JPEG XS Support! (Wednesday Apr. 12, 2023)
  intoPIX, the leading provider of innovative compression technology, and Lawo proudly announce that, following the popularity of Lawo’s vm_jpegXS app for its V__matrix platform, several new Lawo products will be natively JPEG XS-compliant thanks to Lawo’s adoption of the intoPIX TicoXS codec.
  
  
• Village Island VICO-XI is Revolutionizing IP Video Conversion with Reduced Bandwidth and Microsecond Latency using intoPIX Technology (Tuesday Apr. 11, 2023)
  intoPIX, the leading provider and co-creator of lightweight low-latency compression solutions, and Village Island are proud to announce the release of VICO-XI, which is equipped with the intoPIX visually lossless JPEG XS codec, allowing IP conversion between uncompressed ST2110-20 streams and JPEG XS compressed ST2110-22 streams of 4K and HD video.
  
  
• intoPIX Partners with Panasonic Connect to Enable new JPEG XS Cameras for Live Video Production (Thursday Apr. 06, 2023)
  intoPIX, the leading provider of lightweight low-latency compression solutions, today proudly announced its partnership with Panasonic Connect regarding the integration of its JPEG XS technology in their PTZ and studio cameras.
  
  
• Synopsys Accelerates First-Pass Silicon Success for Banias Labs' Networking SoC (Thursday Apr. 06, 2023)
  Synopsys, Inc. (Nasdaq: SNPS) today announced that Banias Labs achieved first-pass silicon success for its optical DSP SoC using Synopsys 112G Ethernet PHY IP and EDA Design Suite.
  
  
• OPENEDGES' LPDDR5 Memory Subsystem IP Licensed by Aisin for Automotive Application (Wednesday Apr. 05, 2023)
  OPENEDGES Technology today announced that Aisin Corporation has licensed the ORBIT DDR Memory Controller IP (OMC) and ORBIT DDR PHY IP (OPHY) for its high-performance automotive application. Aisin Corp develops components and systems for the automotive industry and is a member of the Toyota Group.
  
  
• Rambus and SK hynix Extend Comprehensive License Agreement (Wednesday Apr. 05, 2023)
  Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced it has extended its comprehensive patent license agreement with SK hynix, a world leader in advanced semiconductor technology, for an additional ten years.
  
  
• Google extends license agreement for AAC codec range with Fraunhofer IIS (Wednesday Apr. 05, 2023)
  Fraunhofer IIS, primary developer of the xHE-AAC audio codec, is pleased to announce the extension of its AAC family software license agreement with Google.
  
  
• Orthogone and Napatech collaborate to deliver state-of-the-art, ultra-low latency FPGA-based SmartNIC platform for high-frequency trading applications (Wednesday Apr. 05, 2023)
  Orthogone Technologies and Napatech today announced a strategic partnership to deliver a state-of-the-art SmartNIC platform for high-frequency trading (HFT) applications.
  
  
• Introducing STAGE RACER 2 with intoPIX JPEG XS: The Future of Fiber Transmission for Broadcast Events (Tuesday Apr. 04, 2023)
  intoPIX and ERECA have joined forces to introduce a ground-breaking addition to the broadcast industry: the integration of the ultra-low latency JPEG XS codec into the ERECA Stage Racer 2, a complete optical fiber transmission solution for all types of broadcast events.
  
  
• Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors (Thursday Mar. 30, 2023)
  VeriSilicon today announced Blue Ocean Smart System, an AI chiplet and SoC design company, has deployed high-performance AI chips with scalable chiplet architecture powered by multiple processors from VeriSilicon, including the CC8400 General-Purpose Graphics Processor Unit (GPGPU), VIP9400 Neural Network Processor (NPU), and VC8000D Video Processor Unit (VPU).
  
  
• BrainChip's Neuromorphic Technology Enables Intellisense Systems to Address Needs for Next-Generation Cognitive Radio Solutions (Wednesday Mar. 22, 2023)
  BrainChip today announced that Intellisense Systems Inc. has selected its neuromorphic technology to improve the cognitive communication capabilities on size, weight and power (SWaP) constrained platforms (such as spacecraft and robotics) for commercial and government markets.
  
  
• ASUS IoT Announces Tinker V (Tuesday Mar. 14, 2023)
  ASUS IoT, the global AIoT solution provider, today announced the all-new Tinker V — a versatile single-board computer (SBC) powered by a 64-bit RISC-V-based processor, which supports both Linux Debian and Yocto operating systems.
  
  
• CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC (Monday Mar. 13, 2023)
  CEVA today announced that Beijing ESWIN has licensed and deployed the RivieraWaves Wi-Fi 6 1x1 IP platform in its ECR6600 smart connectivity IC targeting smart homes, smart transportation, industrial IoT and more.
  
  
• Attopsemi OTP IP embedded in Fingerprints™ biometric solution to facilitate biometric technology (Tuesday Mar. 07, 2023)
  Attopsemi, the innovative one-time programming (OTP) IP provider of the revolutionary I-fuse®, Fingerprint Cards AB (publ), a world leading biometric company based in Sweden, has launched a series of collaborations integrating the new design of I-fuse S3™ OTP, multi benefit storage and memory device, to provide several biometric applications toward semiconductor industry globally.
  
  
• Andes Technology's N25F RISC-V Processor Enables Superior Immersive Scenarios for ASPEED Technology's Powerful Image Stitching SoC AST1230 (Tuesday Mar. 07, 2023)
  Andes Technology today announced that its AndesCore™ N25F Processor has been adopted by ASPEED’s latest Cupola360 Spherical Image Processor AST1230.
  
  
• Mixel MIPI D-PHY IP Integrated into Teledyne e2v's new Topaz CMOS Image Sensors (Tuesday Feb. 28, 2023)
  Mixel®, a leading provider of mixed-signal intellectual property (IP), and Teledyne e2v, a part of Teledyne Technologies [NYSE: TDY], announced today that Mixel’s MIPI® IP solution has been successfully integrated into the Topaz™ family of 2MP and 1.5MP resolution industrial CMOS sensors that are now in mass production.
  
  
• Arteris and SiFive Partner to Accelerate RISC-V SoC Design of Edge AI Applications (Tuesday Feb. 28, 2023)
  The combination of the SiFive Intelligence™ processor IP and Arteris Ncore interconnect IP accelerates the path for customers to realize Edge AI SoCs.
  
  
• Ventana Micro Selects Imperas Solutions for RISC-V Processor Verification (Thursday Feb. 23, 2023)
  Imperas RISC-V reference models, simulator, tests, and verification IP are supporting Ventana Micro in delivering a performance-leading family of data center class CPU cores
  
  
• Andes And IAR Systems Together Enable Leading Vendor ILITEK To Accelerate The Development Of Its ISO 26262 Ready TDDI SoC ILI6600A (Wednesday Feb. 15, 2023)
  The joint Functional Safety solution from Andes and IAR Systems helps ILITEK develop its High-Performance Touch and Display Driver Integration (TDDI) SoC
  
  
• Würth Elektronik Partners with Crypto Quantique for IoT Security (Monday Feb. 13, 2023)
  Würth Elektronik has signed a partnership agreement with Crypto Quantique. Collaboration with the specialist in quantum-based cyber security in the Internet of Things (IoT) enhances security for Würth Elektronik’s wireless modules.
  
  
• Sino Wealth License and Deploy CEVA Bluetooth® Low Energy IP for its Connectivity MCUs (Friday Jan. 06, 2023)
  CEVA today announced that Sino Wealth Electronic has licensed and deployed CEVA's Bluetooth connectivity platform - RivieraWaves Bluetooth Low Energy 5 IP in its latest SH87F881X family of connectivity MCUs targeting white goods and the broader Industrial IoT (IIoT) markets.
  
  
• CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution (Thursday Jan. 05, 2023)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, announced today that Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, has licensed and deployed the CEVA-XC4500 Communication Processor and CEVA-BX1 Digital Signal Controller in its 3rd generation V2X chipsets, TEKTON3 and SECTON3.
  
  
• CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances (Wednesday Jan. 04, 2023)
  CEVA today announced that LG Electronics (LG) has licensed and deployed the CEVA-XM4 intelligent vision DSP in its Edge AI system-on-chip (SoC) 'LG8111' to advance the user experience of a new generation of smart home appliances.
  
  
• Dream Chip Technologies Licensed its Real-time Pixel Processor IP to Renesas (Wednesday Dec. 21, 2022)
  Dream Chip Technologies by Goodix, a leading provider of Image Signal Processing IP and SoC Design with engineering sites in Hannover, Hamburg, Eindhoven and Brunswick, has licensed their Real-time Pixel Processor (RPP) to Renesas for the integration into their new generation of R-Car system-on-chip (SoC).
  
  
• PEZY Computing Selects proteanTecs to Monitor Die-to-Die Interconnects in Next-Generation Supercomputer Processors (Wednesday Dec. 21, 2022)
  proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that PEZY Computing has selected the company’s 2.5D interconnect monitoring solution for interface validation, quality assurance and reliability monitoring.
  
  
• KI-FLEX AI chip tapes out with flexible videantis processor platform (Tuesday Dec. 13, 2022)
  videantis today announced the tape-out of the FlexAISIC AI chip based on its flexible v-MP6000UDX unified processing platform. The tape-out has been achieved in collaboration with the Fraunhofer Institute for Integrated Circuits IIS, and the chip development is funded by the German Federal Ministry of Education and Research (BMBF) within the KI-FLEX project.
  
  
• MIPS Partners With Mobileye to Accelerate Next Generation Autonomous Driving Technologies and Advanced Driver Assistance Systems (Monday Dec. 12, 2022)
  MIPS, a leading developer of highly scalable RISC processor IP, announced it is continuing its partnership with Mobileye, in accelerating innovation in autonomous driving technologies and advanced driver-assistance systems (ADAS).
  
  
• Mixel Patented MIPI D-PHY RX+ IP Integrated into Lumissil Automotive Microcontroller (Tuesday Dec. 06, 2022)
  Mixel, Inc.® (Mixel), a leading provider of mixed-signal intellectual property (IP), and Lumissil Microsystems (Lumissil), a division of Integrated Silicon Solution, Inc. (ISSI), announced today that Mixel’s MIPI® IP solution has been successfully integrated into Lumissil’s automotive microcontroller which will go to production next year.