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Fabless / IDM News

• BOS and Tenstorrent Unveil Eagle-N, Industry's First Automotive AI Accelerator Chiplet SoC (Thursday Dec. 12, 2024)
  BOS Semiconductors, the Korean automotive fabless company, and Tenstorrent, an AI design company, are pleased to announce the first debut of industry’s first automotive AI accelerator chiplet SoC, Eagle-N, jointly developed by BOS and Tenstorrent.
  
  
• Quobly announces key milestone for fault-tolerant quantum computing (Wednesday Dec. 11, 2024)
  Quobly, a leading French quantum computing startup, has reported that FD-SOI technology can serve as a scalable platform for commercial quantum computing, leveraging traditional semiconductor manufacturing fabs and CEA-Leti’s R&D pilot line.
  
  
• PIMIC Unveils Business Strategy, and Silicon Technology to Revolutionize AI at the Edge (Wednesday Dec. 11, 2024)
  Ultra-Efficient Silicon Solutions Deliver Industry-Leading Performance and Energy Savings for Next Generation Smart Devices
  
  
• Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure (Tuesday Dec. 03, 2024)
  New Ara PAM4 DSP Reduces Optical Module Power by 20%, Enabling Mass Adoption of 200 Gbps per Lane and 1.6 Tbps Network Infrastructure to Meet Rising AI Bandwidth Demands
  
  
• Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers (Thursday Nov. 21, 2024)
  Frontgrade Gaisler has launched its latest radiation-hardened microcontroller, the GR716B. Building on the success of the GR716A, this latest innovation is a step forward in the development of energy-efficient and adaptable microcontrollers for space applications.
  
  
• Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC (Monday Nov. 18, 2024)
  The cooperation is expected to leverage NEC’s deep experience and expertise in HPC supercomputer design and development of HPC software stacks along with Esperanto’s technology and expertise in high-performance energy-efficient multiprocessor chips based on the RISC-V instruction set.
  
  
• Renesas Unveils Industry's First Automotive Multi-Domain SoC Built with 3-nm Process Technology (Thursday Nov. 14, 2024)
  5th-Generation R-Car SoC Offers Future-Proof Multi-Domain Compute Solutions for Centralized E/E Architecture with Chiplet Extensions
  
  
• ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available (Monday Nov. 04, 2024)
  Specifically dedicated to the automotive market, the new Cortus ULYSS1 is a RISC-V MCU that addresses the needs of Body control applications and much more.
  
  
• Alchip Announces Successful 2nm Test Chip Tapeout (Monday Oct. 28, 2024)
  Alchip Technologies reports that it has taped out a 2nm test chip and expects the results by the first quarter of next year. It also announced that it is actively engaged with customers on high performance 2nm ASIC development.
  
  
• SCI Semiconductor announces Global-First CHERI enabled devices and Early Access Program (Thursday Oct. 24, 2024)
  SCI Semiconductor are very pleased to announce the global-first CHERI-enabled family of devices, based on the RISC-V RV32E architecture and leveraging the Microsoft CHERIoT-Ibex processor core.
  
  
• Efficient and GlobalFoundries Partner to Enable a New Category of Ultra Energy-Efficient, High-Performance Processors (Thursday Aug. 29, 2024)
  Today, Efficient announced a strategic partnership with GlobalFoundries (GF) to bring to market a new high-performance computer processor that is up to 166x* more energy-efficient than industry-standard embedded CPUs.
  
  
• GigaDevice Semiconductor expands its Arm MCU product roadmap through Arm Total Access (Tuesday Aug. 27, 2024)
  GigaDevice announces it has signed an Arm® Total Access (ATA) licensing agreement, laying the foundation for ongoing advancement in the design of embedded chips and the strategic expansion of its GD32 MCU product roadmap.
  
  
• SEALSQ Introduces QS7001, a Newly Developed Cutting-Edge RISC-V Secure Hardware Platform, Specifically Designed for IoT security in the Post-Quantum Era (Monday Aug. 19, 2024)
  In response to the growing quantum threat, SEALSQ has introduced the QS7001, a cutting-edge RISC-V secure hardware platform specifically designed for IoT security in the post-quantum era. The platform incorporates NIST’s recommended quantum-resistant algorithms, Kyber and Dilithium, to ensure robust protection against quantum-enabled breaches
  
  
• NEO Semiconductor Announces the Development of its 3D X-AI Chip; Targeted to Replace Existing HBM Chips and Solve Data Bus Bottlenecks (Monday Aug. 05, 2024)
  NEO Semiconductor announced today the development of its 3D X-AI™ chip technology, targeted to replace the current DRAM chips inside high bandwidth memory (HBM) to solve data bus bottlenecks by enabling AI processing in 3D DRAM.
  
  
• Rambus Expands Industry-Leading Memory Interface Chip Offering to High-Performance PCs with DDR5 Client Clock Driver (Tuesday Jul. 30, 2024)
  Rambus today announced the availability of its DDR5 Client Clock Driver (CKD) for next-generation, high-performance desktops and notebooks.
  
  
• SEALSQ RISC-V Semiconductors is Pioneering Sustainability Through Decentralized Processing (Friday Jul. 12, 2024)
  SEALSQ, a leader in developing and selling semiconductors, PKI, and post-quantum technology hardware and software products, announces the breakthrough adoption and future potential of its RISC-V technology.
  
  
• Microchip Technology Expands Processing Portfolio to Include Multi-Core 64-bit Microprocessors (Tuesday Jul. 09, 2024)
  Microchip’s PIC64GX family manages mid-range intelligent edge compute requirements using a 64-bit RISC-V® quad-core processor with Asymmetric Multiprocessing (AMP) and deterministic latencies.
  
  
• Vybium, develops European AI/ML accelerators based on the Stream Computing NPU IP (Monday Jul. 08, 2024)
  Vybium is a fabless semiconductor startup building RISC-V-based solutions that will support European Digital Strategic Sovereignty & Semiconductor self-reliance
  
  
• NUMEM & IC'ALPS Collaborate to Develop an ultra-low-power SOC for Sensor and AI applications (Thursday May. 30, 2024)
  Numem and IC’ALPS have pooled their expertise to meet the challenge of developing an ambitious integrated circuit with RISC-V processors, 2MBytes of NuRAM and a DSP/AI Custom Datapath Accelerator.
  
  
• SEALSQ RISC-V Chips Adoption is Predicted to Get AI Boost Making it a Viable Competitor to Traditional GPUs (Monday May. 27, 2024)
  RISC-V technology is revolutionizing the microchip industry, challenging established giants and paving the way for transformative changes. By the end of 2022, the industry had already embraced over 10 billion RISC-V cores, with thousands of engineers globally contributing to RISC-V projects.
  
  
• Esperanto Technologies and Rapidus Partner to Enable More Energy-Efficient Designs for the Coming "Post GPU Era" (Wednesday May. 15, 2024)
  Esperanto Technologies today announced the signing of a Memorandum of Cooperation with Rapidus, a new Japanese company that is a burgeoning leader in advanced 2nm semiconductor manufacturing with a strong focus on enabling faster time-to-market (TTM).
  
  
• Fabless semiconductor startup Mindgrove launches India's first indigenously designed commercial high-performance MCU chip (Monday May. 06, 2024)
  Mindgrove Technologies has launched India’s first commercial high-performance SoC (system on chip) named Secure IoT. The RISC-V-based chip will allow Indian Original Equipment Manufacturers (OEMs) to use an Indian SoC in their products and help reduce the cost of their feature-rich devices, without compromising on high-end features.
  
  
• Rambus Expands Chipset for Advanced Data Center Memory Modules with DDR5 Server PMICs (Monday Apr. 29, 2024)
  Rambus today announced the availability of its new family of state-of-the-art DDR5 server Power Management ICs (PMICs), including an industry-leading extreme current device for high-performance applications.
  
  
• SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product (Thursday Mar. 28, 2024)
  SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the mass production of its 14nm AI Inference SoC Platform in collaboration with its lead partner Mobilint, an AI hardware and software solution startup based in South Korea.
  
  
• Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core (Tuesday Mar. 26, 2024)
  RISC-V MCUs Offer Developers a New Low-Power, High-Performance Option along with Full Toolchain Support
  
  
• CoreHW, in Partnership with Unikie, Introduces a Novel RTLS Technology that Significantly Enhances Power Efficiency and Positioning Accuracy (Monday Mar. 25, 2024)
  This year marks a significant milestone for CoreHW, as it introduces advanced Real-Time Location System (RTLS) technology to the market.
  
  
• Marvell Announces Industry's First 5nm Transmit-Only 800G PAM4 Optical DSP for AI and Cloud Interconnects (Monday Mar. 25, 2024)
  Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Spica Gen2-T, the industry’s first 5nm 800 Gbps transmit-only PAM4 optical DSP.
  
  
• Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon (Thursday Mar. 07, 2024)
  Marvell is extending its collaboration with TSMC to develop the industry’s first technology platform to produce 2nm semiconductors optimized for accelerated infrastructure.
  
  
• Ethernovia Unveils World's First Single and Quad Port, 10G to 1G Automotive PHY in 7nm (Wednesday Mar. 06, 2024)
  
  
  
• Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs (Monday Feb. 26, 2024)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations.