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Fabless / IDM News

• Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core (Tuesday Mar. 26, 2024)
  RISC-V MCUs Offer Developers a New Low-Power, High-Performance Option along with Full Toolchain Support
  
  
• CoreHW, in Partnership with Unikie, Introduces a Novel RTLS Technology that Significantly Enhances Power Efficiency and Positioning Accuracy (Monday Mar. 25, 2024)
  This year marks a significant milestone for CoreHW, as it introduces advanced Real-Time Location System (RTLS) technology to the market.
  
  
• Marvell Announces Industry's First 5nm Transmit-Only 800G PAM4 Optical DSP for AI and Cloud Interconnects (Monday Mar. 25, 2024)
  Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Spica Gen2-T, the industry’s first 5nm 800 Gbps transmit-only PAM4 optical DSP.
  
  
• Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon (Thursday Mar. 07, 2024)
  Marvell is extending its collaboration with TSMC to develop the industry’s first technology platform to produce 2nm semiconductors optimized for accelerated infrastructure.
  
  
• Ethernovia Unveils World's First Single and Quad Port, 10G to 1G Automotive PHY in 7nm (Wednesday Mar. 06, 2024)
  
  
  
• Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs (Monday Feb. 26, 2024)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations.
  
  
• Qualinx partners with EU Space Agency to develop a GNSS receiver for a service to detect spoofing and boost resilience (Thursday Jan. 25, 2024)
  Qualinx is partnering with the European Union Agency for the Space Programme (EUSPA) under the Fundamental Elements EU R&D funding mechanism to develop a consumer-grade, low-power GNSS receiver for the agency’s GNSS authentication service.
  
  
• POLYN Announces Agreement with SkyWater Technology to Produce its First Commercial Voice Processing Chip (Wednesday Jan. 17, 2024)
  POLYN Technology has finalized an agreement with SkyWater Technology (NASDAQ: SKYT), to fabricate POLYN’s first commercial chip for voice processing, with the tapeout planned by the end of the year.
  
  
• Innatera shows RISC-V neuromorphic edge AI microcontroller (Wednesday Jan. 17, 2024)
  Dutch chip startup Innatera has shown its neuromorphic microcontroller for edge AI sensor applications based on the RISC-V open instruction set architecture.
  
  
• Atmosic Introduces the Multiprotocol ATM34/e Series Adding 802.15.4 Support for Thread and Matter to its Bluetooth LE Portfolio (Wednesday Jan. 10, 2024)
  Building on the legacy of Atmosic’s innovative ATM3 and ATM33/e SoCs which support Bluetooth LE, the ATM34/e series adds support for IEEE 802.15.4 based protocols including Thread and Matter, as well as enhanced Bluetooth LE support for the latest 5.4 standard revision.
  
  
• Rambus Advances Data Center Server Performance with Industry-First Gen4 DDR5 RCD (Thursday Dec. 28, 2023)
  Rambus today announced the availability of its state-of-the-art Gen4 DDR5 Registering Clock Driver (RCD) which began sampling to the major DDR5 memory module (RDIMM) manufacturers in the fourth quarter of 2023.
  
  
• BSC presents Sargantana, the new generation of the first open-source chips designed in Spain (Friday Dec. 15, 2023)
  The Barcelona Supercomputing Center - Centro Nacional de Supercomputación (BSC-CNS) presented on Wednesday the new Sargantana chip, the third generation of open source processors designed entirely at the BSC.
  
  
• Renesas Unveils the First Generation of Own 32-bit RISC-V CPU Core Ahead of Competition (Thursday Nov. 30, 2023)
  Renesas Electronics announced today that it has designed and tested a 32-bit CPU core based on the open-standard RISC-V instruction set architecture (ISA).
  
  
• SPARK Microsystems Revolutionizes Wireless Headsets with Ultra-Wideband Audio Technology (Thursday Nov. 09, 2023)
  SPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has released its Golion wireless headset reference design leveraging SPARK ultra-wideband (UWB) audio technology to deliver an unparalleled audio experience.
  
  
• Renesas Unveils Processor Roadmap for Next-Gen Automotive SoCs and MCUs (Wednesday Nov. 08, 2023)
  Renesas Electronics today laid out plans for its next-generation system on chips (SoCs) and microcontrollers (MCUs) targeting all major applications across the automotive digital domain.
  
  
• Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor (Tuesday Oct. 31, 2023)
  Renesas Electronics today introduced the world’s most powerful microcontrollers (MCUs), delivering breakthrough performance of over 3000 CoreMark points, and fully deterministic, low latency, real-time operation that satisfies customers’ most demanding application needs.
  
  
• Prophesee launches the world's smallest and most power-efficient event-based vision sensor, bringing more intelligence, privacy and safety than ever to consumer Edge-AI devices (Thursday Oct. 19, 2023)
  Prophesee today announced the availability of the GenX320 Event-based Metavision sensor, the industry’s first event-based vision sensor developed specifically for integration into ultra-low-power Edge AI vision devices.
  
  
• Qualcomm to Bring RISC-V Based Wearable Platform to Wear OS by Google (Wednesday Oct. 18, 2023)
  Qualcomm Technologies, Inc. announced today that they are building on their long-standing collaboration with Google by bringing a RISC-V based wearables solution for use with Wear OS by Google.
  
  
• LeapMind's New AI Chip Paves the Way for Unprecedented Cost-Effective AI Computing (Monday Oct. 16, 2023)
  LeapMind Inc, has announced the commencement of the new AI chip development that accelerates the training and inference of large-scale AI models.
  
  
• Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet (Thursday Oct. 05, 2023)
  Tenstorrent, a company that sells AI processors and licenses AI and RISC-V IP, announced today that it selected Samsung Foundry to bring Tenstorrent’s next generation of AI chiplets to market.
  
  
• Tachyum Books Purchase Order to Build System with 25,000x ChatGPT4 Capacity and 25x Faster than Current Supercomputers (Tuesday Oct. 03, 2023)
  
  
  
• Nanusens technology is key to enabling AI to be smarter (Thursday Sep. 28, 2023)
  The problem at the moment is that sensors are currently manufactured on a tiny sliver of silicon, or die, by a small number of specialist companies with each sensor type being produced on a dedicated production line so it is hard to ramp up production.
  
  
• SambaNova Unveils New AI Chip, the SN40L, Powering its Full Stack AI Platform (Tuesday Sep. 26, 2023)
  SambaNova unveils an intelligent AI chip capable of running models up to 5 trillion parameters, enabling fast and scalable inference and training, without sacrificing model accuracy
  
  
• Kalray announces the availability of its new processor "Coolidge™2", the first DPU optimized for AI and data intensive processing (Thursday Sep. 21, 2023)
  Kalray, a leading provider of hardware and software technologies and solutions for high-performance, data-centric computing markets from Cloud to Edge today announces the availability of Coolidge™2, the new version of its 3rd generation DPU processor.
  
  
• Realtek and V-Nova Announce Support for MPEG-5 Part 2 LCEVC on Set-Top-Box SoCs (Thursday Sep. 14, 2023)
  Realtek Semiconducto and V-Nova today announced support for MPEG-5 Part 2 LCEVC in Realtek STB SoCs. This makes Realtek the first chipset provider to offer support for LCEVC.
  
  
• Esperanto Technologies Introduces First Generative AI Appliance Based on RISC-V, Enabling Developers to Easily Create and Deploy Purpose-Built Vertical Applications (Wednesday Sep. 13, 2023)
  Esperanto Technologies™, the leading developer of high-performance, energy-efficient artificial intelligence (AI) and high-performance computing (HPC) solutions based on the RISC-V instruction set, today announced the industry’s first Generative AI Appliance based on RISC-V technology.
  
  
• Indie Semiconductor Expands Quality Operations (Monday Sep. 04, 2023)
  indie Semiconductor, an Autotech solutions innovator, has expanded its operations to include a best-in-class quality lab facility at its engineering center of excellence in Dresden, Germany.
  
  
• Milk-V Launches Milk-V Vega, the World's First RISC-V Open Source 10 Gigabit Ethernet Switch (Tuesday Aug. 22, 2023)
  Shenzhen MilkV Technology Co., Ltd (Milk-V) unveiled the world’s first RISC-V open-source 10-gigabit Ethernet switch - the Milk-V Vega. The core control chip utilizes the FSL1030M network switch chip developed by Wuhan Binary Semiconductor Corporation.
  
  
• Marvell Introduces Industry's First 5nm Multi-Gigabit PHY Platform (Thursday Aug. 17, 2023)
  Marvell today introduced its technology platform for 5nm multi-gigabit copper Ethernet PHYs to enable enterprise network equipment manufacturers and others to meet the exacting energy efficiency and performance targets of next generation multi-gigabit network technologies such as Wi-Fi 7.
  
  
• Kneron Unveils the KL730 AI Chip, Propelling Low-Energy GPT Solutions at Scale (Wednesday Aug. 16, 2023)
  Kneron, the San Diego-based full stack AI company known for pioneering neural processing units (NPUs), is today announcing the launch of KL730, an auto-grade NPU chip with an integrated Image Signal Processor (ISP).