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Fabless / IDM News

• SiTune Offers Production Samples of Industry's First Tuner Supporting Japan's 8K TV Satellite Standard (Tuesday Nov. 14, 2017)
  SiTune Offers Production Samples of Industry's First Tuner Supporting Japan's 8K TV Satellite Standard
  
  
• MegaChips Unveils Breakthrough 16nm Analog ASIC for 5G and Other High-Speed Applications (Tuesday Nov. 07, 2017)
  MegaChips today announced a new 16nm FinFET analog ASIC with integrated Gigabit-class data converters designed to meet the cost and performance demands of 5G networks and other high-volume applications.
  
  
• asicNorth announces immediate availability of its IoT Endpoint ASIC Platform (Wednesday Oct. 25, 2017)
  asicNorth is pleased to announce immediate availability of its silicon proven platform to rapidly deploy IoT Endpoint ASICs – IoTa. Samples are available for prototype development.
  
  
• Bitmain Introduces Its First Hardware for Accelerating Artificial Intelligence (AI) Applications (Wednesday Oct. 25, 2017)
  Today, Bitmain announced its first products for accelerating artificial intelligence (AI) applications, applying its industry-leading expertise in Bitcoin mining hardware and system design
  
  
• Gridbee Launches First FSK & OFDM Sub-GHz System-On-Chip compliant IEEE 802.15.4g/u/v for Smart Grid, Smart Cities and Industrial IoT Applications (Thursday Sep. 28, 2017)
  Gridbee Communications S.A.S. specialist in wireless communication IC development is pleased to announce the release of its GDB1000 SoC for Sub-GHz wireless communication solution and compliant with IEEE 802.15.4g/u/v.
  
  
• UPMEM Announces the First Processing In-Memory Chip Accelerating Big Data Applications (Monday Sep. 11, 2017)
  UPMEM, a fabless semiconductor startup company, announces UPMEM Processing In-Memory (PIM), the next generation hardware solution for data intensive applications in the datacenter, solving server-level efficiency and performance bottlenecks. UPMEM's programmer friendly acceleration technology is much awaited for by big data players as Moore's law is fading away.
  
  
• NFC Semicon sets a new standard for NFC Sensor Chip Solutions (Monday Sep. 04, 2017)
  NFC Semicon™ announce its 3rd generation NFC System-On-Chip Platform that comes with more interfaces and use possibilities than any other existing NFC transponder Chip.
  
  
• Socionext Partners with Advantech to Offer High-Density, Low-Cost Media Cloud Server Solutions (Thursday Aug. 31, 2017)
  Socionext Inc., a world leader in hardware HEVC encoding, and Advantech, creator of innovative video acceleration solutions, today announced a strategic partnership to provide live hardware transcoding solutions for the data center supporting MPEG2, AVC (H.264), and HEVC (H.265).
  
  
• New MediaTek Helio Chipsets Deliver Rich Features to Booming Mid-Range Market (Tuesday Aug. 29, 2017)
  MediaTek Inc. today introduced the newest members of the Helio chipset family, the Helio P23 and Helio P30 system-on-chips (SoCs). The new chipsets, designed to deliver performance and power efficiency, dual camera photography, dual SIM and dual 4G VoLTE capabilities, support the explosion of innovation in the mid market.
  
  
• Uniquify Announces Silicon Success for Latest Timing Controller (T-CON) for DTV (Wednesday Aug. 16, 2017)
  Uniquify, a fabless manufacturer of next generation SoCs for ultra resolution displays today announced silicon success for its latest Timing Controller SoC (T-CON) for ultra-high definition television.
  
  
• IntelliProp Announces Gen-Z Persistent Memory Controller Combining DRAM and NAND (Wednesday Aug. 09, 2017)
  IntelliProp announced today the IPA-PM185-CT, Gen-Z Persistent Memory Controller, code named "Cobra." This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.
  
  
• Everspin Announces Sampling of the World's First 1-Gigabit MRAM Product (Monday Aug. 07, 2017)
  Everspin Technologies, Inc. (NASDAQ: MRAM), has begun sampling its new 1-Gigabit Spin Torque Magnetoresistive Random Access Memory (ST-MRAM) with lead customers. This breakthrough product delivers a high-endurance, persistent memory with a DDR4- compatible interface.
  
  
• Rambus Launches JEDEC-Standard DDR4 NVRCD for Emerging NVDIMM Applications (Monday Jun. 19, 2017)
  Rambus Inc. (NASDAQ:RMBS) today announced the industry’s first production release of a JEDEC-standard persistent memory register clock driver (NVRCD) for use with DDR4 non-volatile dual in-line memory modules (NVDIMM).
  
  
• Kalray Announces the Release of its Third-Generation MPPA Processor "Coolidge" (Friday May. 26, 2017)
  Kalray, an industry leader in manycore technology, is proud to announce that it will launch the third-generation of its high performance MPPA® processor: the MPPA®3 Coolidge.
  
  
• eASIC and Comcores Announce Support for CPRI V7.0 (Monday May. 01, 2017)
  eASIC® Corporation, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP), today announced the support of CPRI V7.0 (CPRI Specification CPRI_v_7_0 v2015-10-09) for eASIC’s Nextreme-3S family.
  
  
• asicNorth enhances IoT Design EcoSystem with IoT Endpoint ASIC Platform (Friday Apr. 28, 2017)
  Building on the momentum of their IoT Design EcoSystem, asicNorth announced today the debut of an IoT Endpoint ASIC Platform to further accelerate the deployment of custom IoT endpoint devices for their customers.
  
  
• Toshiba Expands Line-up of ARM Cortex-M-Based Microcontrollers (Thursday Apr. 13, 2017)
  Toshiba Corporation's (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of “M3H group (2),” as the third product group in the TXZ™ Family of low-power, high-speed microcontrollers based on the ARM Cortex-M core. Sample shipments of the 24 products in the group will start in May with mass production scheduled to start in September.
  
  
• Socionext Develops Small, Low Power 4K/60p HEVC Codec (Tuesday Apr. 11, 2017)
  Socionext Inc., an emerging leader in advanced SoC based video and imaging solutions, today introduced the SC2M50, a new HEVC / H.265 Codec IC. Sample shipments will start in May 2017.
  
  
• NXP Announces ARM Cortex-M4-based MCU with Industry's Largest Embedded SRAM Memory, Optimized for Portable Devices (Wednesday Mar. 15, 2017)
  NXP Semiconductors N.V. (NASDAQ:NXPI) announced today its new Kinetis K27/K28 family of ARM® Cortex®-M4-based microcontrollers (MCUs) that uniquely address the growing requirements of portable display applications.
  
  
• Kalray Announces the Release of an Efficient Manycore Processing Solution Dedicated to Deep Learning (Tuesday Mar. 14, 2017)
  Rounding out its embedded technology offer, Kalray has expanded its processing capabilities to the world of artificial intelligence. The company is introducing a highly optimized deep learning solution targeting embedded applications like autonomous cars, avionics, drones, robotics and more.
  
  
• NXP Taps into FD-SOI Technology to Enable the Industry's Lowest Power General Purpose Applications Processors (Monday Mar. 13, 2017)
  NXP Semiconductors N.V. (NASDAQ:NXPI) is first to market with a new applications processor design that leverages Fully Depleted Silicon On Insulator (FD-SOI) technology to offer the industry’s lowest power consuming general-purpose processor.
  
  
• Everspin Expands MRAM Ecosystem with Xilinx FPGAs (Wednesday Mar. 08, 2017)
  Everspin Technologies, Inc., as the leading provider of MRAM solutions, today announced compatibility for its Spin Torque MRAM memory and Xilinx’s UltraScale™ FPGAs.
  
  
• Socionext Develops World's First Graphics Display Controller with OpenVX Compliant Hardware Accelerator (Friday Mar. 03, 2017)
  Socionext Inc., a leader in state-of-the art system-on-chip technology, has developed the "SC1810" series, the fourth generation version of its high-performance graphics display controllers.
  
  
• SecureRF and BaySand Collaborate to Provide Quantum-resistant Security for ASIC-powered IoT Devices (Tuesday Feb. 28, 2017)
  SecureRF, a leading provider of quantum-resistant security solutions for the Internet of Things (IoT), and BaySand, the leader in application-configurable ASICs, today announced they have joined forces to provide fast, quantum-resistant authentication and data protection solutions for low-resource IoT devices.
  
  
• Dream Chip Technologies Presents First 22nm FD-SOI Silicon of New Automotive Driver Assistance SoC (Monday Feb. 27, 2017)
  Advanced driver assistance system (ADAS) computer vision SoC developed for European THINGS2DO project with working first silicon fabricated on GLOBALFOUNDRIES’ 22nm FD-SOI Platform
  
  
• Spreadtrum Launches 14nm 8-core 64-bit Mid- and High-end LTE SoC Platform (Monday Feb. 27, 2017)
  Built on Intel's 14nm foundry platform, SC9861G-IA is targeting the global mid-level and premium smartphone market, and features Intel Airmont architecture with powerful mobile computing performance.
  
  
• Qualcomm Announces First End-to-End 802.11ax Wi-Fi Portfolio (Monday Feb. 13, 2017)
  Qualcomm today announced an end-to-end 802.11ax portfolio, which includes the IPQ8074 system-on-chip (SoC) for network infrastructure and QCA6290 solution for client devices, making Qualcomm Technologies the first company to announce end-to-end commercial solutions to support 802.11ax.
  
  
• Semitech's Multi-Mode PLC Platform Receives G3-PLC Certification (Monday Feb. 13, 2017)
  Semitech Semiconductor today announced that its PLC reference design has been certified by the G3-PLC™ Alliance.
  
  
• MediaTek Introduces Helio P25 Premium Performance Chip For Dual-Camera Smartphones (Thursday Feb. 09, 2017)
  MediaTek today announced the launch of its MediaTek Helio P25, the newest addition to the MediaTek Helio P series mobile processor family. The new chipset combines the power of 16nm Octa-core processing with MediaTek Imagiq - a superior Image Signal Processor (ISP) technology - and dual camera features to satisfy smartphone photographers.
  
  
• Valens and Lattice Semiconductor Partner to Deliver HDBaseT Reference Design to Support 4K 60Hz 4:4:4 Resolutions (Tuesday Feb. 07, 2017)
  Valens, the developer of HDBaseT and founder of the HDBaseT Alliance, announced the availability of a reference design for HDBaseT transmission of full 18 Gbps HDMI 2.0, including 4K 60 4:4:4.