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Fabless / IDM News

• TI introduces new Tiva C Series ARM Cortex-M4 microcontrollers (MCUs) for connected applications (Tuesday Apr. 16, 2013)
  The first devices in the new platform – Tiva C Series TM4C123x ARM Cortex-M4 MCUs – are the first Cortex-M-based MCUs to be built on 65 nanometer flash process technology, setting the roadmap to higher speeds, larger memory and lower power.
  
  
• BlinkSight and imec announce world's first single-chip indoor GPS solution (Thursday Apr. 11, 2013)
  BlinkSight, a fabless semiconductor company in real-time location systems (RTLS), has released the first single-chip ‘indoor GPS’ solution for RTLS and wireless sensor network (WSN) applications.
  
  
• Spreadtrum Announces Commercial Launch of Dual-Core Smartphone Chipsets for TD-SCDMA and EDGE (Thursday Apr. 04, 2013)
  The single-chip chipsets integrate a dual-core 1.2GHz Cortex-A5 core processor, a dual-core Mali 400 graphics processor and multimedia and hardware accelerators for differentiated performance and user experience. Both chipsets are further paired with a single-chip mutimode RF transceiver for a high level of integration and are pin-to-pin compatible, enabling handset makers to leverage a common handset development effort for products shipping to China as well as to emerging markets.
  
  
• Algo-Logic Systems Launches 2nd Generation Ternary Search Engine (TSE2) Solutions for the new Tabula ABAX2 P-Series of 3PLD (Wednesday Mar. 27, 2013)
  Algo-Logic announces the launch of their second-generation Ternary Search Engine (TSE2) capable of running on Tabula’s new ABAX2 P-series of 3D Programmable Logic Devices (3PLDs).
  
  
• Tabula Sets New Industry Benchmarks with a Suite of 100G Programmable Solutions Based on the Company's ABAX2 P-Series of 3PLDs (Tuesday Mar. 26, 2013)
  Tabula today announced a comprehensive suite of high-performance packet processing solutions. The suite solves the most challenging problems posed by the transition from 10 to 40G and 100G: specifically, routing of high-performance buses, on-chip RAM throughput, and timing closure for the ultra-high-performance functions required by these systems.
  
  
• Renesas Electronics Announces R-Car H2, Offering Highest CPU and Graphics Performance for the Automotive Infotainment Market (Tuesday Mar. 26, 2013)
  The R-Car H2 is powered by the ARM(R) Cortex(TM)A-15 quad-core configuration running an additional ARM(R) Cortex(TM)A-7 quad-core - the industry's first implementation of a Quad ARM(R) Cortex A15 and the big.LITTLE processing technique in an automotive SoC.
  
  
• Toshiba Adds New Platform SoC To Its Custom SoC/ASIC Product Line (Monday Mar. 11, 2013)
  Toshiba America Electronic Components today announces availability of a new Metal-Configurable Standard Cell (MCSC) platform SoC. The platform SoC employs an innovative MCSC architecture that speeds ASIC development for faster time-to-market at lower non-recurring engineering (NRE) costs
  
  
• Dreamchip Electronics Announces Plan for India's Own Processor Based Tablet SoC (Thursday Feb. 28, 2013)
  In perhaps a first for any Indian company so far, Dreamchip Electronics Private Limited, a fabless semiconductor company founded in 2012 has announced plans for launching SoCs for tablet computers. The SoCs come in 3 different variants named Siddhi, Vani and Sandesh. Each of these has been specified and optimized for a distinct tablet application. Dreamchip will use a proprietary multi-core 32-bit RISC and DSP processor architecture and a unique optimized direct connect architecture for powering these SoCs.
  
  
• Violin Memory Selects eASIC for Flash Memory Arrays (Thursday Feb. 28, 2013)
  eASIC today announced that Violin Memory has selected eASIC’s Nextreme-2T NEW ASICs for implementing FLASH controllers for its latest 6000 Series enterprise-grade FLASH memory arrays.
  
  
• Silicon Image Announces New 60GHz WirelessHD RF Receiver for HD Displays (Wednesday Feb. 27, 2013)
  Silicon Image today announced the availability of a new 60GHz WirelessHD® omnidirectional RF receiver. The SiI6312 is a small form factor integrated circuit (IC) that contains a complete 60GHz RF receiver with an on-chip embedded antenna array.
  
  
• Freescale Introduces Kinetis KL02, World's Smallest ARM Powered Microcontroller (Wednesday Feb. 27, 2013)
  Freescale Semiconductor is addressing the miniaturization trend with its new Kinetis KL02 MCU–the world’s smallest ARM Powered MCU. The KL02 holds great potential for ultra-small-form-factor products in applications such as portable consumer devices, remote sensing nodes, wearable devices and ingestible healthcare sensing.
  
  
• GainSpan Unveils Industry First Wi-Fi and ZigBee IP Single Chip (Wednesday Feb. 27, 2013)
  GainSpan today unveiled the GS2000, the industry’s first single chip solution bringing together two IEEE low power standard wireless technologies: Wi-Fi® (802.11b/g/n) and 802.15.4.
  
  
• Sequans introduces LTE-Advanced Chip (Monday Feb. 25, 2013)
  Sequans today announced that its first LTE-Advanced chip will be sampling next quarter. The SQN3220 is part of Sequans’ Cassiopeia platform, supporting 3GPP Release 10 specifications.
  
  
• ST-Ericsson brings PC speeds to mobile devices: First 3GHz smartphone prototype demo at Mobile World Congress (Friday Feb. 22, 2013)
  At Mobile World Congress in Barcelona, ST-Ericsson will demo the NovaThor™ L8580 integrated smartphone platform with a 3Ghz eQuad™ application processor and a multimode LTE Advanced modem supporting Carrier Aggregation.
  
  
• Dialog Semiconductor delivers critical system power management for tablets based on the next generation Intel Atom processors (Thursday Feb. 21, 2013)
  Dialog Semiconductor announced today that Intel Corporation and Dialog have expanded their collaboration for the development of a single-chip power management IC (PMIC).
  
  
• Achronix Now Shipping 22nm Speedster22i FPGAs to Customers (Wednesday Feb. 20, 2013)
  Achronix Semiconductor Corporation announced today that it has begun shipping the industry-leading Speedster®22i HD1000 FPGA to customers. Built on Intel’s advanced 22nm, 3-D Tri-Gate transistor technology, Speedster22i HD devices consume half the power and are half the cost of competitive high‑end FPGAs for targeted high bandwidth applications.
  
  
• Tilera Announces TILE-Gx72, the World's Highest-Performance and Highest-Efficiency Manycore Processor (Tuesday Feb. 19, 2013)
  The TILE-Gx72, with 72 advanced 64-bit cores and over 100 Gbps of networking I/O, delivers the compute for highly integrated products, offering richer services and applications in a standard Linux platform
  
  
• LSI Introduces Axxia 5500 Communication Processors with ARM Technology for High-Performance, Power-Efficient Networks (Tuesday Feb. 19, 2013)
  LSI scalable architecture with ARM multicore processors and interconnect to improve multi-radio base station and 4G/LTE-capable wireless network performance
  
  
• AnSem announces the availability of an Analog Front End that makes Power Line Communication for smart grids more reliable (Tuesday Feb. 19, 2013)
  AnSem announces the availability of a flexible and low power Analog Front End (AFE) for power line communication (PLC) in the lower frequency bands. The ANS6201 is a single chip Analog Front End built in 0.18µm TSMC technology that integrates all main blocks, including filters, for a narrowband OFDM PLC transceiver.
  
  
• Lantiq Introduces Lowest Power GPON SoC Solution for SFP Optical Module Form Factor (Tuesday Feb. 19, 2013)
  Lantiq today introduced the FALC™ ON-S, a complete GPON Optical Network Unit (ONU) system-on-chip in a compact 11 x 11 mm package.
  
  
• Toshiba to Launch New Structured Array with Short Turnaround-Time Samples (Monday Feb. 18, 2013)
  Toshiba today announced that it has introduced a new structured array that makes it possible to develop and deliver samples with a short turnaround-time, and that only requires the customization of a few layers of metal mask designs.
  
  
• STARCHIP Announces the Sampling of its SCF670H SIM Controller to tackle the 4G/LTE market (Friday Feb. 15, 2013)
  StarChip today announced that it is currently sampling the SCF670H product, its latest SIM controller designed to tackle the booming 4G/LTE market.
  
  
• Renesas Mobile Introduces Ground-Breaking Quad Core ARM Cortex-A15/Cortex-A7 CPU-based Communication Processor with Integrated LTE Cat-4 Modem (Friday Feb. 15, 2013)
  Based on ARM® big.LITTLE™ technology, the processor combines high performance, to deliver exciting multimedia use cases, and extreme power efficiency to extend device battery life. Samples of the MP6530 platform will be available to Tier 1 OEMs in early 2013.
  
  
• Nujira releases new 16-band ET RF front-end for global LTE handsets (Monday Feb. 11, 2013)
  Nujira has today released its new “Woodstock” 16-band Multi-Mode, Multi-Band (MMMB) ET reference design for 4G smartphone RF Front Ends.
  
  
• MoSys Unveils New Bandwidth Engine IC with On-Board Macro Functions for 400G Network Equipment (Thursday Feb. 07, 2013)
  The Bandwidth Engine 2 - Macro delivers the highest access rate and throughput of any single device today coupled with offload accelerators for single rate and two rate three color marker (srTCM, trTCM) metering, statistics, and accounting applications.
  
  
• TI power management front-end chip increases battery run-time in ARM Cortex A15-based designs (Monday Feb. 04, 2013)
  TI today introduced the industry's first single-chip, front-end power management unit (PMU) for battery-powered applications based on ARM Cortex A9 and A15 processors.
  
  
• TOSHIBA Develops High Speed NANO FLASH-100 Flash Memory for ARM Core Based Microcontrollers (Monday Feb. 04, 2013)
  Toshiba today announced that it has developed NANO FLASH™-100 much faster access for embedded microcontrollers, based on Toshiba's original NANO FLASH™.
  
  
• Atmel Introduces New Family of Cortex-A5 Processor-Based MPUs For Embedded Industrial and Consumer Applications (Monday Feb. 04, 2013)
  Atmel today announced it is shipping production quantities of the Atmel® SAMA5D3 series, its highest performance, low-power microprocessor units (MPUs) based on the ARM® Cortex™-A5 core.
  
  
• Accent Extends Its Market Leading Position In ZigBee Solutions With ZigBee IP and SEP 2.0 (Wednesday Jan. 30, 2013)
  Accent announced today that it will incorporate the ZigBee®Alliance’s IPv6-based software stack developed by Grid2Home, developer of Smart Energy Profile 2.0 (SEP 2.0) communication technologies, as a part of its innovative ASMgrid2 silicon and software system solutions.
  
  
• MoSys Announces Renesas Electronics Support of GigaChip Interface for Chip-to-Chip Communications (Tuesday Jan. 22, 2013)
  MoSys today announced that Renesas Electronics will support the GigaChip™ Interface in its Networking ASIC business.