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Fabless / IDM News

• Spin Memory Unveils New Method of Designing Memory to Shake Up $100B Chip Market (Thursday Aug. 13, 2020)
  Spin Memory, Inc. (Spin Memory), the leading developer of MRAM technologies, today announced a new solution that will significantly improve the capabilities of existing and emerging memory technologies: the Universal Selector.
  
  
• Imec presents low-power 60 GHz radar chip for contactless health tracking in battery-powered devices (Monday Aug. 10, 2020)
  Achieving 2-cm range resolution, the ultra-sensitive radar is optimized for vital sign monitoring and gesture recognition. The compact radar chip only consumes 62 mW, making the sensor integrable into small, battery-powered devices.
  
  
• MediaTek and Intel Advance Partnership to Bring 5G to Next Generation of PCs (Thursday Aug. 06, 2020)
  MediaTek today announced advances in its collaboration with Intel to bring 5G experiences to next-generation PCs with the successful development and certification of its 5G modem data card.
  
  
• Pliops Storage Processor Proven to Boost Flash Performance (Wednesday Aug. 05, 2020)
  Pliops today announced that its new, patent-pending Storage Processor has been successfully tested and evaluated by more than 10 tier-one cloud and enterprise companies – and proven to boost performance by more than 10x, reduce five 9s latency by up to 1000x, and increase flash price/performance by more than 90%.
  
  
• Marvell Unveils the Industry's Most Comprehensive Custom ASIC Offering (Tuesday Jul. 28, 2020)
  Marvell (NASDAQ: MRVL) today announced a unique custom ASIC offering that addresses the stringent requirements of next generation 5G carriers, cloud data centers, enterprise and automotive applications.
  
  
• Alchip Technologies 7nm ASIC Capabilities Set Advanced Technology Pace (Wednesday Jul. 22, 2020)
  With the number of expected tape outs jumping to nine by the end of 2020 Alchip Technologies, Limited has become one of the leading advanced technology ASIC providers. Alchip revealed that it had completed 3 tape outs in May alone.
  
  
• MediaTek Introduces Helio G35 & G25 Gaming Series Chipsets (Thursday Jul. 02, 2020)
  MediaTek, the world's 4th largest global fabless semiconductor company, today launched its newest chips in the smartphone gaming-focused G series – the MediaTek Helio G25 and G35.
  
  
• Palma Ceia SemiDesign Announces Sampling for PCS11ax28, New 802.11ax Transceiver (Monday Jun. 29, 2020)
  Palma Ceia SemiDesign today announced the PCS11ax28, its new chip for the 802.11ax Wi-Fi standard, is now available for customer sampling.
  
  
• Arbe Launches Automotive Grade Imaging Radar Processor Chip (Monday May. 04, 2020)
  Israeli startup Arbe, which has raised $55 million to date to develop a 4D imaging radar chipset, has today announced exclusively through EE Times that it has now launched its imaging radar processor chip as part of the chipset.
  
  
• NVE Introduces Noncontact ABZ TMR Magnetic Encoder Sensor (Monday May. 04, 2020)
  NVE Corporation today expanded its industry-leading line of angle sensors with the new ASR022-10E ABZ TMR Magnetic Encoder Sensor.
  
  
• MediaTek to Enable Cutting-edge AV1 Video Codec Technology on Android Smartphones (Tuesday Apr. 28, 2020)
  MediaTek has announced it will enable YouTube video streams using the cutting-edge AV1 video codec on the MediaTek Dimensity 1000 5G SoC. The MediaTek Dimensity 1000 is the world’s first smartphone SoC to integrate an AV1 hardware video decoder, enabling it to play back AV1 video streams up to 4K resolution at 60 fps.
  
  
• OmniVision Unveils World's First 0.7 Micron, 64 Megapixel Image Sensor for Ultra Thin, High End Smartphones (Tuesday Apr. 28, 2020)
  
  
  
• Samsung and Xilinx Team Up for Worldwide 5G Commercial Deployments (Thursday Apr. 16, 2020)
  Xilinx, Inc. (NASDAQ: XLNX), the leader in adaptive and intelligent computing, today announced that the Xilinx® Versal™ adaptive compute acceleration platform (ACAP) will be utilized by Samsung Electronics Co., Ltd., for worldwide 5G commercial deployments.
  
  
• BrainChip Announces Wafer Fabrication of the Akida System-on-Chip (Wednesday Apr. 08, 2020)
  BrainChip announced that the Company and Socionext Inc., it’s development, manufacturing and commercial partner, have provided its wafer fabrication partner, TSMC, with the completed Akida design files and the Multi-Project Wafer (MPW) is scheduled to commence fabrication on 8 April 2020.
  
  
• Perceive Corporation Launches to Deliver Data Center-Class Accuracy and Performance at Ultra-Low Power for Consumer Devices (Monday Apr. 06, 2020)
  Perceive Corporation, an edge inference solutions company, today launched the company and debuted its first product, the Ergo™️ edge inference processor. Ergo brings breakthrough accuracy and performance to consumer devices such as security cameras, smart appliances, and mobile phones.
  
  
• Socionext Prototypes Low-Power AI Chip with Quantized Deep Neural Network Engine (Tuesday Mar. 17, 2020)
  Socionext Inc. has developed a prototype chip that incorporates newly-developed quantized Deep Neural Network (DNN) technology, enabling highly-advanced AI processing for small and low-power edge computing devices.
  
  
• Xilinx Announces World's Highest Bandwidth, Highest Compute Density Adaptable Platform for Network and Cloud Acceleration (Tuesday Mar. 10, 2020)
  Xilinx, Inc. (NASDAQ: XLNX) today announced Versal™ Premium, the third series in the Versal ACAP portfolio. The Versal Premium series features highly integrated, networked and power-optimized cores and the industry’s highest bandwidth and compute density on an adaptable platform
  
  
• MediaTek and Samsung Introduce World's First Wi-Fi 6 8K TV (Thursday Mar. 05, 2020)
  MediaTek and Samsung today introduced the world’s first 8K QLED TV equipped with MediaTek’s custom Wi-Fi 6 chipset, the Samsung 8K QLED Y20 model (Q950, Q900).
  
  
• Xilinx Launches Industry's First SmartNIC Platform Bringing Turnkey Network, Storage and Compute Acceleration to Cloud Data Centers (Tuesday Mar. 03, 2020)
  The Alveo™ U25 SmartNIC is designed to bring the greater efficiency and lower TCO benefits of SmartNICs to cloud service providers, telcos, and private cloud data center operators struggling with increasing networking demands and rising costs.
  
  
• Marvell Announces OCTEON TX2 Family of Multi-Core Infrastructure Processors (Monday Mar. 02, 2020)
  Fifth generation OCTEON family supports 4 to 36 Arm v8 cores coupled with comprehensive set of hardware accelerators for networking, security, and wireless infrastructure applications
  
  
• Samsung Begins Mass Production of Industry's First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones (Tuesday Feb. 25, 2020)
  Samsung Electronics, a world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones.
  
  
• Intel Announces Unmatched Portfolio for 5G Network Infrastructure (Monday Feb. 24, 2020)
  
  
  
• OmniVision Announces Its First 64 Megapixel, 0.8 Micron Image Sensor (Tuesday Feb. 18, 2020)
  OmniVision Technologies today announced the OV64C, its first 64 megapixel (MP) image sensor featuring a 0.8 micron pixel size to enable high resolution smartphone cameras in a 1/1.7" optical format.
  
  
• Eta Compute Announces Production Silicon of the World's Most Energy-efficient Edge AI Processor (Thursday Feb. 13, 2020)
  Eta Compute Inc., a company dedicated to delivering machine learning to mobile and edge devices using its revolutionary new platform, announces the first shipment of production silicon for its ECM3532, the world’s first AI multicore processor for embedded sensor applications.
  
  
• XMOS announces world's lowest cost, most flexible AI processor (Thursday Feb. 13, 2020)
  XMOS today announces xcore.ai — its new, disruptive crossover processor for the AIoT market, which delivers high-performance AI, DSP, control and IO in a single device with prices from $1.
  
  
• EnSilica to Develop Next-Generation Ka Band Satellite Transceivers for the European Space Agency (Monday Feb. 10, 2020)
  EnSilica, a leading provider of custom ASIC design and supply services has announced it is developing a single-chip Ka band transceiver IC for the European Space Agency. The mmWave IC will form a key component of next-generation, low-cost hybrid automotive communication terminals – enabling vehicles to always be connected.
  
  
• Xilinx Adds Advanced Machine Learning Capabilities for Pro AV and Broadcast Platforms (Monday Feb. 10, 2020)
  Xilinx today announced a range of new and advanced machine learning (ML) capabilities for Xilinx devices targeted at the professional audio/video (Pro AV) and broadcast markets
  
  
• GigaDevice Launches the New GD32E232 Series of MCU's Featuring the Arm Cortex-M23 core for Embedded Systems (Wednesday Feb. 05, 2020)
  GigaDevice, an industry-leading semiconductor supplier (SSE code: 603986), officially released the GD32E232 microcontroller series based on the Arm® Cortex®-M23 core. The series is presently sampling and will officially move to mass production in February.
  
  
• Qualcomm Accelerates Autonomous Driving with New Platform - Qualcomm Snapdragon Ride (Wednesday Jan. 08, 2020)
  Snapdragon Ride aims to address the complexity of autonomous driving and ADAS by leveraging its high-performance, power-efficient hardware, industry-leading artificial intelligence (AI) technologies and pioneering autonomous driving stack to deliver a comprehensive, cost and energy efficient systems solution.
  
  
• OmniVision Announces 4K Video Processor with Industry's Lowest Power Consumption and HEVC Compression Capability for Battery-Powered Security and Surveillance Applications (Thursday Jan. 02, 2020)
  OmniVision Technologies today announced in advance of CES the OA805, a video processor that supports high-efficiency video coding (HEVC) compression with the lowest power consumption in the industry.