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Fabless / IDM News

• Ambiq Micro announces that the world's lowest power microcontroller is now in volume production (Wednesday Nov. 18, 2015)
  Ambiq Micro today announced that its Apollo MCU, which recently made microcontroller history by demonstrating that it consumes less than half the energy of rivals in real-world applications (EEMBC ULPBench benchmark), is now available for shipping into high volume consumer applications.
  
  
• Exclusive deal leads to world's smallest sensor for LED lighting & IoT (Wednesday Nov. 04, 2015)
  Gooee, the original ‘Full-Stack’, smart lighting ecosystem provider, has created the world’s smallest sensor for LED lighting and the Internet of Things (IoT) that now includes the latest Artificial Eye technology following an exclusive agreement with DELTA Microelectronics, a European leader in fabless ASIC design, sensor systems, lighting and optics.
  
  
• ACCO Semiconductor Announces World's Most Integrated Power Amplifier Module for 3G/LTE Smartphones (Wednesday Oct. 28, 2015)
  ACCO Semiconductor, a fabless RF front-end component provider, today announced the mass production of the AC26120, a CMOS Multi-mode Multi-band Power Amplifier (MMPA) for smartphones and Internet of Things (IoT) applications.
  
  
• mCube Redefines MEMS Sensor Innovation by Unveiling the World's Smallest 1x1mm Accelerometer (Wednesday Oct. 28, 2015)
  The MC3571 is only 1.1 x 1.1 x 0.74 mm in size making it 75% smaller than current 2 x 2mm accelerometers on the market today, enabling developers to design high-resolution 3-axis inertial solutions for products that require ultra-small sensor form factors.
  
  
• Atmel Delivers Industry's Lowest Power ARM Cortex-A5-based MPU with Leading Security Features for Industrial IoT and Wearable Applications (Monday Sep. 14, 2015)
  
  
  
• MStar Semiconductor, Inc. Integrates INSIDE Secure Technology to Protect Premium Content on its New 4K Ultra HD Platform (Thursday Sep. 10, 2015)
  INSIDE Secure announced that it is providing a cryptography engine to allow MStar Semiconductor, Inc.,a leading semiconductor company for display and digital home solutions, tocomply with the most stringent requirementsfor content protection on its new 4K Ultra HD platform.
  
  
• STMicroelectronics Unveils World's First Set-Top-Box SoC with Integrated Wi-Fi and Support for High Dynamic Range (Tuesday Sep. 08, 2015)
  STMicroelectronics today announced its Cannes Wi-Fi (STiH390) System-on-Chip, targeting HD HEVC[1] Wi-Fi® IP client and interactive set-top-box markets.
  
  
• Toshiba ApP Lite IoT Processor Incorporates Support for Bluetooth v4.1 Functions (Monday Sep. 07, 2015)
  Toshiba America Electronic Components, Inc. (TAEC)* today rolled out the newest addition to its TZ1000 series of ApP Lite™ processors targeting Internet of Things (IoT) applications.
  
  
• Microsemi Introduces XMC Form Factor SATA SSD for Industrial and Defense Applications Requiring the Highest Levels of Security and Reliability (Tuesday Aug. 25, 2015)
  Microsemi today announced an ANSI/VITA 42.3-2014-compliant PCI Express interface XMC form factor serial advanced technology attachment (SATA) solid state drive (SSD) for industrial and defense applications where ultimate security for data-at-rest is required.
  
  
• eASIC and ASOCS Partner to Develop Custom Silicon Accelerators for Network Function Virtualization (NFV)-based Virtual Base Station Solutions (Monday Aug. 24, 2015)
  eASIC and ASOCS today announced that they have signed a definitive agreement to develop a custom silicon device for the acceleration of next-generation network virtualization applications utilizing the eASIC Nextreme-3 platform.
  
  
• Lattice Semiconductor Expands USB Type-C Product Family (Tuesday Aug. 18, 2015)
  Lattice today announced the expansion of its USB Type-C product family with the introduction of its latest SiI7012, SiI7013 and SiI7014 port controllers.
  
  
• eASIC and Tamba Networks Announce Immediate Availability of 100 Gigabit Ethernet Solution for Data Center, Core and Access Network Switching Applications (Monday Aug. 17, 2015)
  eASIC and Tamba Networks today announced the immediate availability of a 100 Gigabit Ethernet MAC (media access controller) and PCS (physical coding sublayer) solution for high bandwidth applications, such as data center, and core and access network switching.
  
  
• Rambus Makes Server Memory Interface Chipset For Advanced Enterprise and Data Center Systems (Monday Aug. 17, 2015)
  Rambus today introduced the R+ DDR4 server memory chipset, RB26, for RDIMMs and LRDIMMs[i], delivering superior performance and capacity for both the enterprise and data center server markets.
  
  
• Bring on the 64-Bit Tablets: Allwinner's First 64-Bit Tablet Solution Goes Mass Production in August (Friday Aug. 14, 2015)
  At this year's CES, Allwinner announced its first 64-bit solution, the $5 quad-core ARM Cortex-A53 based A64 chipset. As of August 2015, the cost-effective A64 is already in mass production with several customers.
  
  
• eASIC Announces Nextreme-3 Platform Support for PCIe Gen 3.1 - SRIS (Tuesday Aug. 11, 2015)
  eASIC today announced immediate availability of silicon-proven transceivers optimized for the PCIe 3.1 electrical specification.
  
  
• Diablo Technologies Launches Memory1, World's First All-Flash DDR4 Memory Module, Transforming Datacenter Performance and Economics (Wednesday Aug. 05, 2015)
  Diablo Technologies today announced the launch of Memory1™, the first all-flash server system memory technology that rewrites the rules of datacenter performance and economics. The revolutionary technology packs four times the capacity of the largest DRAM modules, delivering greater capability on fewer servers and lowering datacenter costs by up to 70 percent.
  
  
• Lattice Releases World's First superMHL Solutions for USB Type-C to Deliver 4K 60fps Video with Concurrent USB 3.1 Data (Monday Aug. 03, 2015)
  Lattice today announced the world’s first superMHL™ products for USB Type-C to deliver 4K 60fps RGB/4:4:4 video with concurrent USB 3.1 Gen 1 or Gen 2 data.
  
  
• Peregrine Semiconductor Introduces First RF SOI 300 mm Technology Platform (Wednesday Jul. 08, 2015)
  Peregrine Semiconductor announces the UltraCMOS® 11 platform, the industry’s first RF SOI technology built on GLOBALFOUNDRIES’ 130 nm 300 mm RF technology platform.
  
  
• STMicroelectronics Begins STM32F7 Production, First to Market with Microcontrollers Featuring Advanced ARM Cortex-M7 Core (Thursday Jun. 25, 2015)
  STMicroelectronics has become the first chip maker to begin volume production of microcontrollers featuring the new ARM® Cortex®-M7 processor: the latest and highest-performing Cortex-M core for advanced consumer, industrial, medical, and Internet-of-Things (IoT) devices.
  
  
• Freescale takes its next generation QorIQ multicore platform to 16nm FinFET technology (Tuesday Jun. 23, 2015)
  Freescale Semiconductor has disclosed initial details regarding the next generation of its successful QorIQ multicore processor portfolio, today announcing it will drive innovation for the secure Internet of Tomorrow (IoT) on highly advanced 16nm FinFET process technology.
  
  
• mCube Unveils Its First Ultra-Low Power Accelerometer Family Optimized for Wearables and the "Internet of Moving Things" (Wednesday Jun. 17, 2015)
  mCube today introduced the company’s first family of accelerometers optimized for wearables and the “Internet of Moving Things (IoMT)”. The MC3600 family of ultra-low power, high-performance 3-axis accelerometers is built upon mCube’s award-winning monolithic single-chip MEMS technology platform, widely adopted in mobile handsets with over 100 million units shipped.
  
  
• eASIC and Comcores Deliver CPRI v6.1 Switch Reference Design for Next-Generation LTE Advanced and 5G Networking Equipment (Tuesday Jun. 16, 2015)
  eASIC and Comcores today announced immediate availability of a common public radio interface (CPRI) v6.1 switch reference design.
  
  
• MegaChips is First to Bridge DisplayPort with HDMI2.0a in a Single Chip (Monday Jun. 15, 2015)
  MegaChips today announced the production shipment of the MCDP28 family of products, the world’s first devices to bridge DisplayPort1.2 and HDMI2.0a, the two most common digital-display interface technologies used in computer and consumer electronics.
  
  
• Engineering Shortage Persists (Friday Jun. 12, 2015)
  Lower engineering salaries means managers should brace themselves for the revolving door, especially when 3-7-year itch kicks in.
  
  
• ASMedia Technologies Achieves Industry's First SuperSpeed USB 10 Gbps (USB 3.1 Gen 2) Certified Silicon (PCIe to USB 3.1 Gen 2) (Monday Jun. 01, 2015)
  ASMedia Technologies, a fabless semiconductor company that develops and markets high-speed IO solutions, announced the industry’s first SuperSpeed USB 10 Gbps (USB 3.1 Gen 2) certified host silicon-ASM1142.
  
  
• Genesys Logic Announces Industry's First USB Type-C Integrated USB 3.1 Gen 1 Hub Controller - GL3523S (Monday Jun. 01, 2015)
  Genesys Logic today announced its high-performance USB Type-C™ integrated SuperSpeed hub controller, GL3523S. GL3523S USB 3.1 Hub controller features USB 3.1 Gen 1 PHY developed in-house by Genesys Logic with on-chip integration of USB Type-C™ functions.
  
  
• Atmel Launches Innovative 5V Cortex-M0+ MCU Family With Integrated Peripheral Touch Controller (Wednesday May. 27, 2015)
  Atmel today introduced the world’s first full 5V ARM Cortex-M0+-based MCU family with integrated peripheral touch controller (PTC). The new family of Atmel | SMART ARM Cortex-M0+ MCUs innovatively combines 5V, DMA performance and a PTC with excellent moisture tolerance.
  
  
• Fresco Logic Charges Ahead with USB Type-C Applications and Power Delivery (Tuesday May. 26, 2015)
  Fresco Logic, a global market leader that develops advanced connectivity technologies and ICs, today introduced two new product families targeting the Type-C connector recently introduced across a number of consumer products including the Nokia N1, Apple MacBook, and Google Chromebook Pixel 2.
  
  
• World's smallest micro-camera promises to revolutionize smart sensors (Monday May. 18, 2015)
  Swiss researchers at CSEM in Neuchatel have developed the smallest-ever complete vision system on a chip, called Vision-In-Package (VIP).
  
  
• Intel, eASIC Collaborate on Customized Intel-Based Solutions for the Cloud (Wednesday May. 13, 2015)
  Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the “cloud”.